WBS 5 Forward Pixels

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WBS 5 - Forward Pixels
WBS 5 - Forward Pixels
Bruno Gobbi
DOE/NSF Review
May 8, 2001
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Outline

• Status of the US CMS Pixel project
• System overview
• Accomplishments of last years goals
• Status and technical progress
• Scope change and contingency use since
• last review
• Committee concerns and issues
• Plans for the next six months
• Summary and conclusions

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Status of the Forward Pixel
The FPix project is nearing the completion of a 3
year RD phase. All the major components have
now been defined, allowing for a more realistic
estimate of cost and schedule. The project is
now shifting into prototyping of components,
carrying out system tests, and studying how to
assemble the detector. The installation date
has been delayed by one year (to April 06),
permitting us to start the final assembly in 04
rather than 03.
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FPIX System Overview
FPix System Overview



FPix
CMS Pixel Detector

• US delivers 4 disks (stand alone system)

European Group
Barrel
?

• No changes in scope since last year

FPix Disks
IR
Responsibility of US CMS
FPix Full Size Model of 1/2-Disk
2.4m
Service Cylinder
Space Cylinder
Power, Cooling, Optical Fibers
Disks Mechanics
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FPIX Scope and Deliverables
FPix Scope and Deliverables
Comm. Network Hub
FEC VME Board
Token Bit Manager
Blade
Butterfly
HDI
Sensors
ROC
NEW
VHDI
Plaquette
Si Plate
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Last YearPlans and Accomplishments
Last Year Goals and Accomplishments

• Beam test Carried out.
• Prototype TBM/CNH, HDI, and FEC TBM/CNH, and FEC
  being tested (FPGA), HDI is now two components a
  Very-HDI (first prototype) and the HDI
• Submission of second prototype sensors In
  progress
• Submission of Multiple Chips Placement Parts
  just returned. Good results.
• Procure first 1/2-Disk made of Be Delayed by
  lack of engineers. Effort is resuming now.

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FPix Technical Progress in FY01

• Preparing for a new Sensor Submission
• Bump Bonding submission for multiple chips being
  evaluated
• First Prototypes of the TBM and FEC
• First prototype of VHDI
• Started tooling for assembly of detectors
• Results from Test Beam at CERN

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FPIX Sensors - First Submission
FPix. Sensors, 1st Subm.
Guard Ring Design hold 1000V. Very good!
p-Stop double open ring. OK but no safety margin
Before irradiation 90 of pixels have Vbrkdwn
gt300V
After ? 1x1014 p/cm2 increase in current after
300V (2-8) noisy channels (PSI) With ? 6x1014
p/cm2 same I with pixels at -100C
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FPIX Sensor - Second Submission
FPix. Sensor 2nd Submission

• Conclusions (first submission)
• Baseline design is adequate for CMS!
• - Would like to understand and correct the
• increase in current for irradiated sensors
• - the cause of ?10 noisy channels (test PSI)

• Second submission
• Is in preparation. Goals
• - finalize the two-double ring p-stop design
• - produce sensors to test the FPix readout

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FPIX - Bump Bonding
FPix, Bump Bonding

• Bump bonding with industry

• submission with MCNC for bump bonding (Blank
  Chips) for
• all the sensors required for 3 Blades 135 ROC,
  21 sensors of
• 5 different sizes, SnPb

• Single Chip Placement

• status parts returned.

• yield per bump 0.9998 ? 0.0001

• In house bump bonding

• at UCD (In) for RD detectors and read-out
  electronics

D/cms/Lehman/Lehman 2001/Presentations/Plenary
Presentations\Bump-Bonding..ppt
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FPIX - Test Beam at CERN
FPix. Test Beam at CERN
Charge Sharing
Vienna Repeater
Y
Row
X
Z, B

Double Column
Beam
20o
ROC, PSI36 11 double columns x 30 rows
Pixels 150 x150 ?m2
8mm
D\LHM\2001\Presentations\Plenary
Presentations\For Dan \Geometry Pixels.ppt
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CERN Test Results
FPix. CERNs Test Results
Charge sharing vs position
Pixels at 20o to beam
? 14 ?m over pixel
150 ?m
150 ?m
Charge sharing vs position
150 ?m / ?12 43 ?m
? 46 ?m over pixel
Pixels normal to beam
D\LHM\2001\Presentations\Plenary
Presentations\For Dan \Cern Test Result.ppt
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FPIX Readout Electronics
FPix, Readout Electronics
FPGA Token Bit Manger, TBM and Control Network
Hub
FED
Detetor
Front End Controller, FEC Single Channel Prototype
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Very High Density Interconnect
Very Hight Densityes. Interc.
VHDI for Row of 5 ROCs
Test Station
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FPIX - RD Assembly - SiDet
FPix, RD Assembly. SiDet
Assembly of Detectors NIKON measurement station.
Need 672 units
Assembly of Butterflies OMIS II
measurement station. Need 96 units
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FPIX RD - Survey
FPix, RD Survey
Survey Blades Zeiss 500 measurement
station. Need 8 units (1/2-Disk)
Components
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US CMS FPIXBCWS, BCWP ACWP
W. Scheduled
W. Performed
ACW. Performed
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FPIX - BCWS Profile
W. Scheduled vs. Year
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US CMS FPIXSch. Cost Performance
Scheduled Performance
Cost Performance
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US CMS FPIX ( Comp., Cont. Use)
W. Completed
Cont. Use
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FPIX - ETC
Mfg
EDIA
MS
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SOW 01 - FPIX
Rutgers
Fnal
Purdue
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US CMS FPIXL2 L3 Milestone Performance
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FPix Critical Path
Panels
Disks
Space Cylinders
VHDI HDI
Sensors
Readout Chip
Bump Bonding
Assembly Plaquettes
Assembly Butterflies
Assembly 1/2-Disks
Install Disks in 1/2-Cyl.
Shipment to LHC
Commissioning completed
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Critical Path Analysis
Critical Path Analysis

• The read-out chip development sets the critical
  path. responsibility of PSI
• Development of the TBM, VHDI and HDI depends on
  the design of the ROC.
• Bump Bonding is the next most critical task.

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Last Review Concerns

• Concerns from last time have been addressed
• Increase engineering support for HDI, (VHDI).
  Done
• Update the near term plan with specific
  milestones. Done
• Devote manpower immediately to the evaluation /of
  a new preproduction of sensors. Done
• Increase manpower on bump-bonding task.
• Request was made to the funding agencies but
  it
• has not been awarded yet.

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Issues
Issues

• Additional manpower for bump bonding
  remains a pressing issue.

• Mechanical engineering must be made
  available (from US CMS) now to prevent this task
  from becoming a critical one.

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What we plan for the next 6 months

• Submission of second prototype sensors
• Testing of the first prototype TBM/CNH and FEC
  (FPGA), then with FED and new sensors with
  final chip in Dmill
• Layout of VHDI and HDI
• Continue tooling for the assembly
• Procure prototypes PSS for 1/2-Disk

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Summary and Conclusions
Summary and Conclusions

• FPix effort is now moving from RD to
  prototyping.
• Results from a test beam at CERN confirm the
  expected position resolution.
• Evaluation of first sensors submissions
  completed. Second submission is being
  prepared.
• A submissions for bump bonding of blank multiple
• chips is being evaluated and gives promising
  results.
• Submission TBM/CNH chip to take place this month.
• Testing of prototypes TBM and FEC (FPGA) has
  started will allow a Full System test (sensors,
  ROC, FED, OL, ...)