ELECTRONIC MANUFACTURING BRANCH

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ELECTRONIC MANUFACTURING BRANCH CODE 6086
22 JANUARY R. Jung
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• MISSION
• To support sustainment of legacy equipment and
  to accelerate the integration of emerging
  electronic technology into military applications.

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PCB SIGNIFICANCE
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WHY ARE WE HERE?

• Organic manufacturing base is diminishing

• Overseas dependence is growing
• (whether we know it or not)

• Major manufacturers are making significant
  commitments to oversea locations for economic
  reasons.

Look at the indicators..
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OUTSOURCING
PWB Trends In Make Or Buy (For Domestic OEMs)
RD
U.S. PWB Capacity of World Market in 1980 was
46, 2001 was 18
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WHAT ARE WE UP AGAINST?
The Peoples Republic of China is committed to
driving/controlling PCB industry via tremendous
investment and clear long term planning.
They plan 50 years out
We have a five-year plan
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• DoD, SAME CUSTOMER, NEW CHALLENGES
• We need DoD organic expertise to continue to meet
  RD needs
• We have unique national security products
• DoD represents only 4 of industry market share
• We do not drive the industry -- We react to it

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WHY IS CODE 6086 UNIQUE?

• Last Navy PCB shop

• One of two remaining DoD PCB shops

• Extensive hands on experience with PCB and
  PWA products

• Extensive relationships within the Industry

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• IN-SERVICE PRODUCT RE-ENGINEERING
• Parts Obsolescence
• Supplier attrition
• Upgrade in technology
• Design Documentation
• Full design capabilities
• Create documentation for existing design- reverse
  engineering
• Incorporate engineering changes
• Re-Engineer Product Design
• Recreate Parts List
• Recreate Connect List Schematic
• Fabricate/Assemble Product
• Low-Rate Production in-house
• Facilitate Product Acquisition
• Out source to industry supplier

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PCB/PWA Manufacturing/Assembly

• Complete PCB Manufacturing
• CAD/Imaging/Plating/Drilling/ Pressing/Testing
• Printed Wiring Assembly Facility
• Automated Assembly/Soldering/Testing

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HOW DOES THIS AFFECT YOU?

• Manufacturing capabilities are declining.
• Fewer suppliers for military quality product
• Acquisition process impact (no competition)

• Product availability is at risk.
• How economically healthy is your supplier?

• Industry RD capability is gone.
• Military will be limited to commercial technology

• National Security Issues.
• Do you know where your product is manufactured?
• Can you trust your supplier?

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• WHAT IS THE SOLUTION?

PROACTIVE COMMITMENT
MILITARY
PCB Stewardship
ACADEMIA
INDUSTRY
RELATIONSHIPS!
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INDUSTRY RELATIONSHIPS

• Industry manufacturing sources
• Military quality suppliers
• Assist with challenging manufacturing

• Industry research and development activities
• Aware/Involved with commercially driven
  technology development
• Technology insertion opportunities for Military
  applications

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ELECTRONIC INTERCONNECTION CENTER OF EXCELLENCE
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EICE MISSION
To strengthen the abilities of both the
Department of Defense (DoD) and the North
American Printed Circuit Board industry to
support the militarys printed circuit board
requirements through an integrated program of
research, education, and industrial extension
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WHAT DOES EICE HAVE PLANNED?

• High frequency material evaluation

• New material development - Liquid Crystal Polymer

• Embedded Passive Technology Development

• Embedded/Buried Optics

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• LCP PROJECT GOALS
• Develop LCP material evaluation test vehicles
• Develop LCP board assembly test vehicles
• Fabricate LCP test vehicles
• Test Evaluate LCP material
• Material Characteristics Physical/Electrical
  (i.e. RF)
• Board Manufacturability
• Assembly
• Document, publish and present results

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TEAM MEMBERS

• INTEL
• IPC
• KEMMER
• MACDERMID
• ONR
• ROGERS
• ROSE-HULMAN
• TECHNIC

• ALION
• AMCOM
• AUBURN
• BOEING
• CRANE
• ESI
• FOSTER-MILLER
• GOULD

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Copper Plating Line
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PCB Processes
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Quality Assurance
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Zero-Discharge Waste Treatment
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Through-Hole Board Assembly
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Surface Mount Board Assembly
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Board Rework
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• AN/WLR-1H(V) Spiral Antenna
• AN/WLR-1H(V) Spiral Antenna
• No Schematic (Product only)
• In-house Documentation, Fabrication, Product
  Improvement
• Out-source

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• AN/SSQ-82 Mute Board
• AN/SSQ-82 Mute Board
• No Schematic (Product only)
• No Parts List
• In-house Documentation, Fabrication Assembly

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• F-15 Power Supply Interface Assembly
• F-15 Power Supply Interface Assembly
• No Schematic (Product only)
• No Parts List
• In-house Documentation, Fabrication Assembly
• In-house Repair process development

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Embedded Passive Manufacturing RD Test Bed

• EPMRDTB

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• EPMRDTB Purpose
• To develop capability for various methods and
  processes for manufacturing PCBs with buried
  passives
• To assist North American PCB manufacturers to
  meet the future package density requirements of
  OEM's and the military services.

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• EPMRDTB Goals
• Provide sufficient space for R D, development
  and small scale manufacturing
• Developing the ability to demonstrate in a
  production setting a variety of buried passive
  technologies
• Make this expertise available to the North
  American Fabrication base through comprehensive
  training and prototyping.

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• Objectives
• Strategically select several technologies from
  the range of offerings available to day.
• Cost will be a very important consideration in
  this process
• Obtain equipment through donation or procurement
  to implement these technologies

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• What do we want audience to do?
• Technology supplier Discuss with Crane details
  for implementing your technology
• OEMs support EICE and consider projects
• PCB fabricators, plan for training projects
• Consider joining our alliance.

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Emerging/Critical Interconnection Technologies
Program (E/CIT)

• IPC Lobbying Activity and Support for FY03 Request

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IPC-E/CIT FY03 Support

• Coordinated message development and delivery.
• Supported NAVSEA Crane Division Management
  contact in Congress and DoD.
• Drafted official request/justification language.
• Guided request through authorization/appropriation
  s processes.
• Worked directly with Rep. Hostettler/staff.

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IPC-E/CIT FY03 Support

• Acted as primary lobbyist.
• Educated key IN Congressional Delegation Members.
• Lobbied House and Senate Armed Services and
  Defense Appropriations Committee members and
  staff.
• Lobbied House/Senate conference committee
  members.

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• CONVENTIONAL SUCCESS STORIES
• CEC/Raytheon production issue resolution
• PARCS Radar tech refresh/sourcing support
• SP-23 new test technology development
• ATFD rigid flex technology development
  application
• ALE-47 prototype and supplier development

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IPCs Embedded Passives Technology Center

• IPC Printed Circuits Expo
• March 25 27, 2003
• Long Beach, California

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IPCs Embedded Passives Technology Center

• Its better to show as well as tell

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IPCs Embedded Passives Technology Center

• Special Area for
• Embedded Passives
• Materials and Processes

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IPCs Embedded Passives Technology Center

• Mentor Graphics
• DDE-USA, Inc.
• DuPont
• MacDermid, Inc
• Oak-Mitsui
• Shipley Company, L.L.C.

• Vantico/Motorola Labs
• Ohmega Technologies
• Gould
• GSI Lumonics
• ESI

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IPCs Embedded Passives Technology Center

• Special Registration for Attendees to the
  Technology Center
• Special Marketing to promote the Technology Center

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Embedded Passives Session

• 2 paper sessions 3/25 3/27
• Presentations from Motorola, Shipley, Gould,
  ATS, ESI, 3M, GSI Lumonics
• Free Forum 3/26
• Thanks to Denny Fritz, MacDermid

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Thank You

• David W. Bergman, CAEVice President
  Standards, Technology
• IPC2215 Sanders RoadNorthbrook, IL
  60062-6135 USA847-790-5340 Phone [phone]
  FaxMobile 847-867-1388DavidBergman_at_ipc.orgwww.i
  pc.org

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POINT OF CONTACT Renee Jung Phone [phone] Fax
854-1174 Building 38