Large Area Plasma Processing System (LAPPS) - PowerPoint PPT Presentation

About This Presentation
Title:

Large Area Plasma Processing System (LAPPS)

Description:

Large Area Plasma Processing System (LAPPS) R. F. Fernsler, W. M. Manheimer, R. A. Meger, D. P. Murphy, D. Leonhardt, R. E. Pechacek, S. G. Walton and M. Lampe – PowerPoint PPT presentation

Number of Views:52
Avg rating:3.0/5.0
Slides: 17
Provided by: Richar1176
Learn more at: https://ptsg.egr.msu.edu
Category:

less

Transcript and Presenter's Notes

Title: Large Area Plasma Processing System (LAPPS)


1
Large Area Plasma Processing System (LAPPS)
  • R. F. Fernsler, W. M. Manheimer, R. A. Meger, D.
    P. Murphy, D. Leonhardt, R. E. Pechacek,
  • S. G. Walton and M. Lampe
  • Naval Research Laboratory
  • Presented at ICOPS, June 1999
  • Work supported by the Office of Naval Research

2
Outline
  • General description of LAPPS
  • Experiments
  • See Poster 6P01 for details.
  • Physics
  • Comparison with other sources
  • Summary

3
LAPPS Overview
  • A magnetically confined, sheet electron beam is
    used to ionize a gas.
  • Purpose Create a cold, weakly ionized, planar
    plasma for material processing.
  • Key distinguishing features
  • Beam ionization replaces plasma heating.
  • Large processing area ( 1 m2).
  • Limited by the size of the vacuum chamber and
    power.

4
Experimental Program
  • Status
  • ne 5x1012 cm-3 over 60 x 60 x 2 cm.
  • Wide range of gases, 20-300 mtorr.
  • Etch rate in oxygen gt 6 mm/min.
  • Grounded stage (no bias).
  • Immediate Plans
  • Extend area to 1 m2.
  • Etch with rf bias.
  • Investigate other beam sources.
  • Present source is a hollow-cathode discharge.
  • Diagnostics Langmuir probe, m-wave and optical,
    electron energy analyzer, mass spectrometer, SEM.

5
Processing Objectives
  • Large area.
  • But thin to minimize electrical power.
  • Independent control of ion and free-radical
    fluxes.
  • Wide operating range in power, gas and bias.
  • High uniformity.
  • Efficient.
  • Low Te.
  • To maximize ion anisotropy.

6
Design Constraints
  • Beam current and energy.
  • Gas pressure and composition.
  • Magnetic field.
  • Particle fluxes.

7
Beam Energy
  • Energy loss rate
  • N gas density, Z atomic number, eo 100 eV.
  • Beam range
  • Increase R by raising eb or reducing N.
  • R gt 1 m in 100 mtorr ? eb 3 keV.
  • N 20 mtorr to avoid two-stream instability.

8
Beam Current
  • Gas ionization rate
  • jb beam current density, wi _at_ 30 eV per e-i
    pair.
  • Loss rate, worst case
  • Where b 5x10-8 cm3/s (for eAB ? AB).
  • ne 1012 cm-3 requires jb _at_ 10 mA/cm2.
  • nb/ne lt 10-4.
  • Dissociation rate
  • Metastable rate Sm ltlt Si.

9
Beam Confinement
  • Elastic collisions cause the beam to spread.
  • Apply Bz to keep the gyroradius rc lt dxb.
  • dxb beam thickness.
  • rc lt 1 cm at 3 keV ? Bz 200 G.

10
Effect of Bz on the Plasma
  • Outward plasma flow produces a diamagnetic
    current circulating around the plasma
  • Bz ?
  • Only the electrons are strongly magnetized.
  • Outward flow is impeded if
  • m mass, n collision frequency of ions
    electrons.
  • n ? N ? Flow is impeded when Bz/N 2 kG/torr.

11
Electron Temperature Te
  • Initial mean energy of secondary electrons
  • Ii ionization energy.
  • Effective heating rate
  • Collisional cooling Te Te(Q).
  • Predict Te lt 1 eV in molecular gases.
  • Consistent with Langmuir probe.
  • Predict Te gt 1 eV in noble gases.
  • Can raise Te with external heating.

12
Particle Fluxes
  • Fluxes
  • Bz and recombination limit the ion flux to
  • Increase Bz or Dx to decrease Fi.
  • Add an atomic gas (b ? 0) to increase Fi.
  • Free-radical flux
  • Independent of Bz, Dx, or atomic additives.

beam/plasma
Dx
Fi ,Fr
substrate
13
Uniformity
  • jb _at_ constant but eb falls with z.
  • Si and ne thus rise (smoothly) with z.
  • One solution is to increase eb(0).
  • Decreases efficiency, unless the energy is
    recovered prior to the beam dump.
  • Other solutions
  • Vary Bz(z) or Dx(z) to make Fi more uniform.
  • Vary N(z) to make Fi and Fr more uniform.
  • Move the stage.

14
Conventional Sources
  • Heat the plasma to produce ionization.
  • Te gt 2 eV.
  • Inefficient wi gtgt I1 (in processing gases).
  • Energy goes mainly to low-lying excitation.
  • Restricted operating range.
  • In gas type, pressure and power.
  • Limited control.
  • Species with low Ii are ionized preferentially.
  • Heating zone is determined by E-to-ne coupling.

15
LAPPS Issues
  • Requires
  • Beam source.
  • Isolation of the source from the processing
    region.
  • Bz.
  • Beam-plasma instabilities.
  • Suppressed by collisions and beam velocity
    spread.
  • RF bias
  • Small ground electrode(s).
  • Effect of Bz on the sheath.

16
LAPPS Summary
  • Plasma density ne ? 5x1012 cm-3 (above 20 mtorr).
  • Area 1 m2.
  • Limited by chamber size and power.
  • Works in all gases over a wide pressure range.
  • Ionization rate depends mainly on concentration.
  • Independent control of ion and radical fluxes.
  • Smooth (no hot spots).
  • But some variation along Bz.
  • Efficient.
  • Thin.
  • wi _at_ 30 eV, depending on tradeoff for uniformity
    along Bz.
  • Te lt 1 eV.
Write a Comment
User Comments (0)
About PowerShow.com