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Friction%20Updates

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Friction Updates Last FtF Past issues & solutions Latest data CoF vs. slurry dilution CoF vs. rotation rate Fz vs. slurry dilution Laser displacement sensor tests – PowerPoint PPT presentation

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Title: Friction%20Updates


1
Friction Updates
  • Last FtF
  • Past issues solutions
  • Latest data
  • CoF vs. slurry dilution
  • CoF vs. rotation rate
  • Fz vs. slurry dilution
  • Laser displacement sensor tests
  • Feasibility
  • Specifications
  • Thesis Roadmap
  • Microscale friction and polishing model
  • Macroscale measurements
  • Questions/Requests
  • Future work

Jim Vlahakis PhD. Candidate Tufts University
2
Friction Updates Last FtF
  • External noise issues
  • New wafer motor power supply eliminated noise
  • Issues concerning slurry dilution
  • Moved from 91 to 32 dilution, more in line with
    industry practice
  • Data runs at 30/60rpm
  • Now using 60/120rpm (.5 1m/s), more in line
    with industry practice
  • Irregularities due to changes in wafer shape
  • Controls in place to monitor wafer shape

3
Friction Updates Latest Data
  • CoF vs. slurry dilution
  • 60rpm 1.7psi
  • Note large CoF (and large s) for pure slurry. A
    result of shear thickening?
  • CoF remains fairly constant over a wide range of
    slurry dilutions
  • CoF for pure H2O seems strongly dependent on pH
  • Next steps
  • study slurry compositions in the range of 1 part
    H2O to 2/3/5/7 parts slurry
  • Investigate pH dependence for H2O
  • Perform experiment backwards

4
Friction Updates Latest Data
  • CoF vs. rotation rate, note development of CoF
    plots and spectra

5
Friction Updates Latest Data
  • CoF vs. rotation rate, note development of CoF
    plots and spectra

6
Friction Updates Latest Data
  • Fx vs. slurry dilution
  • 60rpm - 1.7psi
  • Decrease in Fz tracks decrease in density of
    slurry as it is mixed with H20
  • Increasing s corresponds to increasing chatter
    (except for pure slurry case)
  • Next steps
  • study slurry compositions in the range of 1 part
    H2O to 2/3/5/7 parts slurry
  • Investigate pH dependence for H2O

7
Friction Updates Latest Data
  • CoF vs. rotation rate
  • 60rpm - 1.7psi
  • CoF remains fairly constant over a wide range of
    velocities
  • Below 30rpm data is unreliable motion of wafer
    drive is noticeably non-uniform
  • Next step
  • Investigating deeper into the Stribeck curve will
    require lower pressures and much higher
    velocities. Likely not possible with our current
    setup

8
Friction Updates Laser Sensor
  • Feasibility of using multiple laser sensors to
    monitor wafer displacement
  • How much does support frame displace during worst
    case polishing
  • 60rpm2.5psipure H20 (strong chatter)
  • Frame displacements are on the order of .1mm
  • Spectrum of displacement signal is very familiar
  • Safe to say that wafer motion wont be lost in
    frame motion

9
Friction Updates Laser Sensor
  • Generate rough idea of wafer displacement
  • 60rpm-1.7psi-32 (minimal chatter)
  • range /- 1mm
  • Wafer regularly moving out of range
  • To be safe, we should require a range of at least
    /- 2mm or even /-5mm
  • Must design a system that allows for quick
    adjustment of sensor position
  • Given the accuracy of the laser (1µ), is this a
    good way to measure fluid film thickness?
  • Sensor size is an important consideration

10
Friction Updates Thesis Roadmap
  • Microscale Changes and Their Effect on Macroscale
    Process Variables in Chemical Mechanical
    Planarization
  • Submitted by
  • James Vlahakis
  • In Partial Fulfillment of the Requirements for a
    PhD.
  • School of Engineering
  • Tufts University
  • May 2008
  • Develop a micro-friction model utilizing the
    expertise of the BostonCMP group
  • Identify the processes that contribute to CoF
    and/or MRR
  • Examples
  • CoF µfluidµpadµparticles
  • Polishing is more a plucking (chemical)
    process, rather than a plowing (mechanical)
    process
  • Make changes on the microscale and measure their
    effect on the macroscale, for example
  • Vary roughness and moduli of pads
  • Various particle loads
  • Maintain constant particle loading, while varying
    the load of particles that participate in the
    polishing
  • Measure effect on both CoF and MRR
  • Which changes effect CoF or MRR only
  • Which effect both
  • Does this confirm our model or do we need to make
    adjustments?


11
Friction Updates - Questions/Requests
  • Questions
  • How can we measure MRR?
  • Can we etch a radial channel in our wafers and
    measure the change in step heights?
  • Can we replace slurry silica particles with
    particles that do not participate in the
    chemistry?
  • Requests
  • More slurry please!
  • Pads of various roughness and modulus

12
Friction Updates Future Work
  • High Level View
  • Continue to develop models with Boston CMP group
  • Identify the experiments that will show the
    accuracy (or inaccuracy) of our models
  • Perform the experiments and, if necessary,
    iterate until our models can explain our data
  • Write it up!
  • Low Level View
  • Complete CoF vs. slurry dilution experiments
  • Determine µ and shear thickening effects for
    various slurry dilutions
  • Purchase and begin installation of laser
    displacement package
  • Prepare for various conferences and papers
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