New Features

1
Introducing Speedstack 2013 March 2013 - Richard
Attrill / John Lee
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New Processed Thickness displayable column
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New Processed Thickness displayable column
Processed Thickness, a single column that
contains the conductor Finished Thickness and
dielectric Isolation Distance. Totalling these
fields equals the Stack Up Thickness
4
New Processed Thickness displayable column
Processed Thickness, shown on the Technical Report
5
Calculated Impedance field now highlighted
Speedstack 2013
Speedstack 2012
6
Design rule check (DRC) improvements
New mechanical drill aspect ratio checks
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Stack Up Thickness Enhancements
New Solder Mask Thickness and Stack Up
Thickness with Solder Mask calculations now
included within Speedstack
Stack up thickness calculations also included on
Speedstack status bar. Easy to keep track on
stack up thicknesses while adding / swapping and
deleting materials.
8
Stack Up Thickness Enhancements
Stack Up Information grid layout improved to more
clearly present stack up thickness data
Updated Speedstack status bar showing stack up
thickness totals
9
Stack Up Thickness Enhancements
New Solder Mask Thickness and Stack Up
Thickness with Solder Mask calculations now
included on report
10
The selected Units are now printed on the title
bar
Printing Enhancements
Improvements have been made to the position of
the dimensioning text and lines / arrows
11
Interfacing with other systems
It is now possible to automatically import an XML
file into Speedstack on launch. Useful for
importing pre-existing stack up data
XML
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Interfacing with other systems
Call an external program / utility / script from
within Speedstack via the External Utilities menu
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Interfacing with other systems
External Utilities menu defined within the
Configuration option
14
Multiple instances of Speedstack may now run
simultaneously
15
Other Speedstack enhancements Technical report
improvements Impedance structure highlighting
improvements for Advanced structures A more
consistent number accuracy (precision) is now
used for the dielectric constant, isolation
distance and finished thickness fields shown on
the stack up graphic Opening / saving of SCI
project files is now given more emphasis
throughout Speedstack than the older STK file
format
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Other Speedstack enhancements The Speedstack
keyboard short-cuts have been reallocated to more
Windows-like functionality. Short-cuts that
originally use the Insert key have been changed
to more suitable keys in order to support Apple
keyboards Alterations have been made to the
controlled impedance tab scroll bar behaviour to
accommodate Simplified / Traditional Chinese and
Korean Windows 7 OS Speedstack now confirms
adequate screen resolution during start up
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Windows 8 Speedstack 2013 has been tested for
compatibility with Windows 8
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• Upgrading to Speedstack 2013
• Active Speedstack Polarcare customers are
  entitled to upgrade to the 2013 release
• Speedstack 2013 requires a new license
• The Speedstack 2012 license will NOT be suitable
  for Speedstack 2013
• The 2013 license will NOT be suitable for
  Speedstack 2012 or earlier releases
• Users wishing to evaluate Speedstack 2013 prior
  to upgrading should contact their local Polar
  Instruments office

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Thank you
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For more information Contact Polar now
Phone USA / Canada / MexicoKen Taylor (
503) 356 5270 Asia / Pacific Terence Chew 65
6873 7470 Japan japan_at_polarinstruments.asia 81
45 339 0155 UK / EuropeNeil Chamberlain 44
23 9226 9113 Germany / Austria / Switzerland
Hermann Reischer 43 7666 20041-0 www.polarinst
ruments.com