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Outsourcing and Offshoring in the Semiconductor Industry

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Outsourcing and Offshoring in the Semiconductor Industry David A. Hodges Robert C. Leachman Competitive Semiconductor Manufacturing Program UC Berkeley – PowerPoint PPT presentation

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Title: Outsourcing and Offshoring in the Semiconductor Industry


1
Outsourcing and Offshoring in the Semiconductor
Industry
  • David A. Hodges
  • Robert C. Leachman
  • Competitive Semiconductor Manufacturing Program
  • UC Berkeley
  • Sloan Industry Centers Annual Conference
  • Atlanta, GA April 19-21, 2004

2
U.S. Integrated Device Manufacturers(e.g. Texas
Inst., Motorola, Intel, )
  • Labor-intensive chip assembly work mostly
    off-shored since the 1960s
  • Initially, plants served just one company
  • More recently, independent assemblers and testing
    firms are serving multiple customers
  • IBM automated in the 1960s
  • Automation of assembly and testing now spreading
    industry-wide and world-wide

3
U.S. IDMs, 1960-1990
  • Capital-intensive wafer fabs were off-shored
    selectively important aid market access
  • Cost of direct labor not a significant factor
  • US ownership, international professional staff
  • Hazards weak infrastructure, long supply lines,
    business and political climate
  • Early examples Texas Instruments (Japan), Analog
    Devices (Ireland), Intel (Israel)

4
U.S. IDMs, 1960-1990
  • Skills-intensive process development and product
    design mostly remained in the US
  • Firms sought advantages from proprietary
    technologies
  • Few skilled professionals available abroad
  • Some exceptions Chip design centers in England
    (TI), Israel (Intel) typically devoted to
    specific products for worldwide markets
  • Sales, marketing, customer support efforts
    carried on world-wide

5
Changing business modelsIDMs forced to become
specialists
  • Intel, AMD microprocessors
  • Samsung, NEC, Micron, Infineon memory
  • Texas Inst., STM chips for cell phones
  • These are standard products, MM units same
    designs purchased by many competing original
    equipment manufacturers (OEMs)
  • Above categories represent about ½ of total
    worldwide semiconductor production
  • What about the other half?

6
Factors leading to foundries
  • Competitive modern wafer fabs cost 2-4B
  • employ 1000 people (total for 7 x 24 operation)
  • Annual revenues gt ½ fab cost for profitability
  • Worldwide standardization of mfg. process
  • Innovative design firms require only a fraction
    of one fabs capacity
  • Vastly different management skills design vs.
    fab
  • IDMs rarely succeed in serving fabless firms
  • Foundries were established to serve this need
  • Leadership of Morris Chang!

7
Fabless-foundry business model
  • Fabless firms define, design, market chips
  • small investment, quick response
  • 300-500K revenue/employee
  • 50,000 well-paid U.S. jobs 13,000 ROW
  • Asian foundries fabricate chips for many firms
  • huge investments fixed costs 75 of total
  • 15,000 factory jobs, well-paid by local scales
  • highly automated for tight process control
  • short production cycle
  • timely intro of new technology generations
  • excellent customer service
  • some niche specialists with old technology

8
Outsourcing, Offshoring?
  • Fabless design centered in the U.S.
  • MS, PhD grads of top U.S. universities
  • U.S. is 1 (78 of 03 revenues)
  • Taiwan is 2 (11 of 03 revenues)
  • Equivalent design skills very rare elsewhere
  • Most silicon foundries are in Asia
  • Many process development jobs in Asia
  • Many grads of top US universities
  • Weak U.S. domestic investment (except Intel)

9
Food chain for semic. industry
  • Semiconductor production equipment raw
    materials are supplied mainly from U.S., Japan,
    and Europe
  • U.S. leads in key areas
  • MS PhD education
  • Computer-aided design for semiconductors
  • University-industry cooperation
  • Climate for innovation
  • Market for advanced technology
  • Government support is strongest in Asia

10
Factors influencing location for manufacturing
investments
  • Trophy value of semiconductor fabs
  • (Think about the steel industry in the 1960s)
  • Trophy sought by govts worldwide tax
    incentives!
  • China is the current leader in incentives
  • Most capital comes from outside PRC
  • Fading concerns about investment risks
  • Weaker controls on U.S. equipment export
  • Commodity status of manufacturing technology
  • Return of expatriates spread of higher education
  • Protected IP less important than know-how
  • Improving infrastructure in China, other nations

11
Chinese competition for foundry business
  • Semiconductor Manufacturing Intl Corp. (SMIC)
  • largest, most advanced Chinese foundry
  • founded in 2002 3 8 fabs in Shanghai
  • purchased Motorolas 8 Tianjin facility
  • 12 fab in Beijing under construction
  • 3/17/04 1.8B IPO in HK NY -12 as of 4/6/04
  • U.S. filed WTO complaint re Chinas lower VAT
    for locally designed or manufactured
    semiconductors
  • China remains far behind in chip design
    capability
  • China establishes unique domestic standard for
    cellular telephony Chinese partners required

12
2003 Foundry revenue leaders
  • 1. TSMC (Taiwan) 5.9 billion 26
  • 2. UMC (Taiwan) 2.7 27
  • 3. Chartered (Singapore) .73 49
  • 4. IBM (U.S.-IDM) .56 - 27
  • 5. NEC (Japan-IDM) .43 33
  • 6. SMIC (China) .37 630
  • 7. Hynix (Korea-IDM) .34 39
  • 8. DongbuAnam (Korea) .33 27
  • 9. Jazz (U.S. ex-Rockwell) .19 16
  • 10. HHNEC (China) .17 13
  • 11. SSMC (Singapore) .16 82
  • 12. X Fab (E. Germany) .13 27

13
Survival strategies of U.S. IDMs
  • Intel heavy investments try new markets
  • Texas Inst limit investments use foundries
  • IBM partnered with Chartered, Infineon
  • AMD more German incentives in Dresden
  • Micron innovation more cost reductions
  • Motorola divesting semiconductor business
  • National product focus use foundries
  • Analog Devices limit investments foundries

14
Conclusions for semiconductor industry
  • Its a fully globalized industry
  • Microprocessors Intel unchallenged
  • Memory is a commodity Samsung leads by far
  • IDM business model is dead for other products
  • U.S. leads in innovative chip design
  • U.S. unchallenged in design software
  • design software skills are bound to spread!
  • Asia leads in foundry manufacturing
  • U.S. is not a serious competitor poor ROI
  • TSMC, UMC are likely to remain leaders
  • Overcapacity looms SMIC payoff is uncertain
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