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Photoemission Studies of Interface Effects on Thin Film Properties

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Title: Photoemission Studies of Interface Effects on Thin Film Properties


1
Photoemission Studies of Interface Effects on
Thin Film Properties
Final Examination April 18th, 2006 Dominic A.
Ricci Department of Physics University of
Illinois at Urbana-Champaign
2
Threshold of Technology
Year
Length Scale
3.5 million transistors
Final examination, April 18, 2006
3
On the Atomic Scale
When physical structures lt e- coherence
length quantum effects manifest
1D e- confinement quantum well states
Thin films
Pure Science
Applied Technology
Quantum wells dominate properties of thin films
Understand quantum physics of thin films
Thin films are building blocks
Final examination, April 18, 2006
4
Film Properties
  • Schottky barrier height
  • Rectifying energy barrier at metal-semiconductor
    junction
  • Confines electrons in film
  • Determines transport properties in solid-state
    devices
  • Thermal stability temperature
  • Annealing temperature at which smooth film
    structure roughens
  • Relevant to robustness under technological
    operating conditions

Final examination, April 18, 2006
5
Preview
Thin Pb films grown on metal (Au, In,
Pb)-terminated Si(111) probed with angle-resolved
UV photoemission
  • Terminating metal serves as interfactant layer
    between film and substrate
  • Quantum well states depend on boundary
    conditions
  • Same film, same substrate, different
    interfactant isolates the interface effect on
    properties
  • Schottky barrier and thermal stability measured
    via quantum well spectroscopy

Control electronic and physical film properties
with interfacial engineering
Final examination, April 18, 2006
6
Overview
  • Background
  • Photoemission
  • Surfaces reconstructions and films
  • Quantum well states
  • Results
  • Schottky barrier tuning
  • Thermal stability temperature control

Final examination, April 18, 2006
7
Photoemission Spectroscopy
  • Probes electronic states in system
  • Input High intensity, monochromatic photons
    (VUV)
  • Output e- emitted energy, momentum recorded

  • (angle-resolved)

e-
photoelectron kinetic energy
electronic state binding energy
work function
Final examination, April 18, 2006
8
Photoemission Spectroscopy
  • Probes electronic states in system
  • Input High intensity, monochromatic photons
    (VUV)
  • Output e- emitted energy, momentum recorded

  • (angle-resolved)

e-
Normal emission h? 22 eV
Photoemission is surface sensitive ideal for
studying thin films
Final examination, April 18, 2006
9
Photoemission Spectrum
Typical spectrum energy relative to Fermi level
EF
Final examination, April 18, 2006
10
Photoemission Requirements
Final examination, April 18, 2006
11
Overview
  • Background
  • Photoemission
  • Surfaces reconstructions and films
  • Quantum well states
  • Results
  • Schottky barrier tuning
  • Thermal stability temperature control

Final examination, April 18, 2006
12
Substrate
Semiconductor substrate n-type Si(111) 7 x
7
  • n-type e- charge carrier
  • (111) surface plane in Miller indices
  • 7 x 7 surface reconstruction periodicity
  • (n x m) n bulk units by m bulk units relative
  • to surface 1 x 1 unit cell
  • Formed by heating in vacuo _at_ 1250C for 7-10 s
  • Si has band gap Eg 1.15 eV

Final examination, April 18, 2006
13
Deposition
Sample
  • Metal deposited on clean Si(111) surface with
    molecular beam epitaxy (MBE)
  • Material evaporated from e-beam-heated
    crucible
  • Amount deposited measured in monolayers (ML)
  • Atomic layer

HV
Filament Supply
Final examination, April 18, 2006
14
Reconstructions
Sub-monolayer amounts of metal are deposited on
clean Si(111)-7 x 7 at RT, then annealed, to form
reconstructions
Reconstruction Coverage (ML)
0.42
0.76
0.96
0.96
0.33
0.33
Used to modify film-substrate boundary
Final examination, April 18, 2006
15
Pb Film Growth
Metal-reconstructed Si(111) substrates cooled to
60-100 K prior to Pb deposition, then film
annealed to 100 K
Interfactant
  • Pb is a free-electron-like metal
  • Pb/Si interface abrupt w/o intermixing

Final examination, April 18, 2006
16
Overview
  • Background
  • Photoemission
  • Surfaces reconstructions and films
  • Quantum well states
  • Results
  • Schottky barrier tuning
  • Thermal stability temperature control

Final examination, April 18, 2006
17
Quantum Well States
  • Metal e- confined in film between vacuum and
    semiconductor band gap
  • Particle-in-a-box discrete energies at
    integer monolayer film thicknesses
  • Different film thicknesses N
  • different energies
  • Different boundary conditions
  • different energies

hv
Vacuum
Band Gap
Final examination, April 18, 2006
18
Quantum Well States
Well depth confinement range E0 between Pb EF
and Si valence band maximum
CBM
EF
Eg
E0
VBM
n-type Semiconductor
Metal
Final examination, April 18, 2006
19
Quantum Well States
Confined electrons sharp, intense
peaks in spectra
Energy (eV)
EF
E
E0
Partially confined electrons E lt E0 Quantum well
resonances
broad, less intense peaks
Final examination, April 18, 2006
20
Atomic Layer Resolution
  • Quantum well peak reaches max intensity at
    integer monolayer film thickness
  • Absolute film thickness determination

Final examination, April 18, 2006
21
Bohr-Sommerfeld Phase Model
Total electronic phase quantized in 2p
Quantum well state energy levels for (N, n)
Final examination, April 18, 2006
22
Overview
  • Background
  • Photoemission
  • Surfaces reconstructions and films
  • Quantum well states
  • Results
  • Schottky barrier tuning
  • Thermal stability temperature control

Final examination, April 18, 2006
23
Schottky Barrier
Schottky Barrier
  • Rectifying energy barrier at metal-semiconductor
    junction
  • Barrier height S Eg E0 for n-type
    substrate

CBM
EF
E0
Eg
VBM
Examine Schottky barrier height by varying
film-substrate boundary condition
n-type Semiconductor
Metal
Final examination, April 18, 2006
24
Measuring the Barrier Height
Measure E0 Measure S
  • Two methods using quantum well spectroscopy
  • Energy level analysis
  • Interface phase shift depends on E0
  • Fit energy levels to obtain barrier height
  • Peak width analysis
  • E0 lt E lt EF small width E lt E0 larger width
  • Identify threshold to obtain barrier height

Final examination, April 18, 2006
25
Energy Level Analysis
Normal emission spectra Pb/Au-6x6/Si(111) _at_ 100 K
  • Energy levels differ by 1 eV among systems
  • known from
    first-principles calculations
  • (singularity at VBM)
  • Simultaneous fit E(N,n)
  • obtain E0 for all systems

Final examination, April 18, 2006
26
Peak Width Analysis
  • Widths increase rapidly below E0 threshold
  • provides measurement of Schottky barrier
  • Weighted avg. with heights from energy level
    measurements

Differences observed among systems due to
interface effect
Final examination, April 18, 2006
27
Interface Dipole Model
Interface species concentration and
electronegativity determine charge transfer
around metal-semiconductor dipoles
Final examination, April 18, 2006
28
Interface Dipole Model
Interface species concentration and
electronegativity determine charge transfer
around metal-semiconductor dipoles
  • avg. charge state of
    interfacial Si
  • electronegativity
  • interfactant concentration

Final examination, April 18, 2006
29
Interface Dipole Model
Interface species concentration and
electronegativity determine charge transfer
around metal-semiconductor dipoles
  • avg. charge state of
    interfacial Si
  • electronegativity
  • interfactant concentration
  • Schottky barrier height from
    model

Final examination, April 18, 2006
30
Schottky Barrier Results
Comparison of Sexp (circles) to Scalc (line)
yields agreement
Interface dipole model reproduces measurements
with only chemical parameters (concentration,
electronegativity)
Schottky barrier tuning via proper interfactant
selection
Final examination, April 18, 2006
31
Overview
  • Background
  • Photoemission
  • Surfaces reconstructions and films
  • Quantum well states
  • Results
  • Schottky barrier tuning
  • Thermal stability temperature control

Final examination, April 18, 2006
32
Thermal Stability Temperature
Annealing temperature at which smooth film
structure roughens Thermal energy allows atomic
rearrangement
T gt Tstability
T lt Tstability
Compare Pb films w/ 3 interfactants
Final examination, April 18, 2006
33
Electronic Stability
Quantized electronic structure
Total film electronic energy
Thermal stability
  • Quantum well energy levels change with N
  • Layer-to-layer variation in total electronic
    energy
  • Thickness-dependent thermal stability

Final examination, April 18, 2006
34
Thickness Oscillations in Pb Films
  • e- fill quantum wells w/ increasing N
  • Shell effect periodic oscillation in total
    energy and film properties
  • ?N 2.2 ML _at_ integer sampling
  • Beating pattern
  • Characteristic oscillation in work function,
    charge density distribution, interlayer lattice
    spacing, TC

Final examination, April 18, 2006
35
Quantum Well Spectroscopy Redux
In Au Pb A -1.70 0.29 2.21
  • In and Pb diff. by p
  • ?N 1 equivalent to phase change of p

Final examination, April 18, 2006
36
Measuring Thermal Stability
  • Quantum well peak intensity monitored as
    function of T as film annealed
  • Sudden drop off at Tstability as film rearranges
    to more stable thicknesses

Final examination, April 18, 2006
37
Thermal Stability Analysis
  • Oscillation phase reversal in Pb/In/Si(111)
    system
  • odd N more stable
  • Oscillation amplitude larger in Pb/Au/Si(111)
    system
  • stable above RT

Final examination, April 18, 2006
38
Thermal Stability Analysis
Friedel-like functional form
F phase shift (interfactant dependent)
Thermal stability control via interfacial
engineering
Final examination, April 18, 2006
39
Recapitulation
Thin Pb films grown on metal (Au, In,
Pb)-terminated Si(111) probed with angle-resolved
UV photoemission
  • Used interfactant layers to alter film-substrate
    boundary condition and change film quantum
    electronic structure
  • Schottky barrier tuning
  • Thermal stability temperature manipulation

Control electronic and physical film properties
with interfacial engineering
Final examination, April 18, 2006
40
(No Transcript)
41
Title
Final examination, April 18, 2006
42
Future Directions
  • Pure science
  • Use quantum well spectroscopy to probe other
    film properties to identify non-classical
    behavior
  • Applications to technology
  • Control film properties, e.g. superconducting TC

Final examination, April 18, 2006
43
Synchrotron Radiation
  • Magnet-confined e- ring
  • Monochrometers at beamlines

Final examination, April 18, 2006
44
Ultrahigh Vacuum
  • UHV lt 10-9 torr
  • Stainless steel chamber
  • Series of pumps

Final examination, April 18, 2006
45
Energy Analyzer
Final examination, April 18, 2006
46
Deposition
Metal deposited on clean Si(111) surface with
molecular beam epitaxy
  • Amount deposited measured in
  • monolayers (ML)
  • For reconstruction, defined in substrate units
  • 1 ML 7.83 x 1014 atoms/cm2 for Si(111) surface
  • For film, defined by bulk
  • 1 ML 9.43 x 1014 atoms/cm2 for
  • Pb(111) films

Final examination, April 18, 2006
47
RHEED
Surface quality monitored with Reflection High
Energy Electron Diffraction (RHEED)
Final examination, April 18, 2006
48
Phase Comparison
Direct relationship
Thermal stability control via interfacial
engineering
Final examination, April 18, 2006
49
Thermal Stability Analysis
Friedel-like functional form
a 1.77 from free electron model F phase
shift (interfactant dependent)
In Au Pb F -1.354 0.942 1.529
  • In and Pb diff. by p

Final examination, April 18, 2006
50
Phase Comparison
Direct relationship
F can be determined from quantum well energy
levels
Thermal stability control via interfacial
engineering
Final examination, April 18, 2006
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