MEMS : The Natural Expansion of Analog Mixed Signal Technologies

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MEMS The Natural Expansion of Analog Mixed
Signal Technologies
Digital ICs
Analog ICs
RF ICs
MEMS
High-Value
High-Volume
Technologies
Technologies
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RF MEMS for Mobile PhonesRF-front-end
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Technical Challenges

• Compatibility of the MEMS process with active
  circuitry processing is critical for the
  realization of integrated MEMS
• Same process for the manufacturing of all RF-MEMS
  components
• Possibility to use different foundries

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Above-IC High-Q Inductors

• Thick Copper Inductor on Top of IC
• Low Temperature Process
• Q gt 80 _at_ 2 GHz
• Technology in Production

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Packaging Issues

• Size (and cost) is important in wireless as it is
  a consumer market
• Monolithic integration allows miniaturization and
  system integration
• However, MEMS usually requires specific packaging
  which may justify stand alone packages

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SMD High-Q inductors

• Thick Copper on Quartz
• The IC chip and the inductor are connected by a
  Telecom-specific Flip-Chip
• Technology reoriented to SMD packaging

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MEMS for Wireless

• MEMS Components
• Inductive Loads, Variable Capacitors,
  Relays/Switches, Mechanical Filters,
  Transformers, etc.
• Integrated with
• Amplifiers (LNA, PA), Oscillators (VCO), Mixers,
  Filters, etc.
• Up to Complete and Highly Integrated Radio
  Systems !

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Wireless Libraries MEMS Comm

• RF-MEMS Library of Components
• - Characterized Set Of Inductors, Variable
  Capacitors, Relays / Switches, etc.
• - Automatic Components Generators
• Available through major design environments
  (Agilent, Cadence, Mentor Graphics)

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Wireless Design Tools

• Memscaps RF Engineering Platform
• - Cross-Section Viewer, 3-D Viewer, Customized
  DRC, LVS, GDS Generators
• - Interfaces To a Dedicated RF Finite Elements
  Method Solver