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2003 Beijing Microelectronics International Symposium

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Title: 2003 Beijing Microelectronics International Symposium


1
2003 Beijing Microelectronics International
Symposium
Hiroshi Oura Chairman of the Board and
CEO Advantest Corporation
2
Chinas Promising Role in the Changing Landscape
of the Semiconductor Industry OPEN Architecture
is the Future of ATE
  • - Contents -
  • IC and ATE Market Trends
  • Challenges Facing the ATE Market
  • OPENSTARTM Test Architecture
  • Advantests Contributions to China

3
Trends in Total Worldwide IC Shipment
( Source WSTS )
4
Estimated Percentage of Chinas Total Worldwide
IC Consumption
China 44.6bn 23.4
China 22.3bn 14.3
2005
2002
Worldwide 156bn
Worldwide 191bn
( Source Spring 2003 iSuppli Forecast )
5
Semiconductor Production Equipment Trends by
Region
(M)
America
Europe
40,000
Japan
Korea
Taiwan
30,000
ROW
20,000
10,000
0
( Source SEMI-SEAJ SEMI Consensus Forecast,
July 2003 )
6
Expectations for the China Market
1. Growth of domestic market . Increasing
domestic demand . Continued investment by
overseas semiconductor manufacturers 2.
Abundant Workforce . Lower cost work
environment . Competent, highly skilled and
well educated labor pool
7
Expectations for the China Market
3. Global manufacturing base for ICs .
Pro-active government policies attract overseas
investment . Rapid development of
industrial infrastructure . Rapid improvement
in technical expertise . Cost efficient
design and manufacturing opportunities
8
Challenges Facing the Automatic Test Equipment
(ATE) Market
IC manufacturers are focusing product lines on
SoCs
  • Used in cell phones, digital TV, consumer
    electronics (DVD players, digital cameras
    etc.), IC Cards/smart cards, security devices
  • A wide range of new test solutions are needed
    for the development, design, and production
    of these devices

SoC Device
9
SoC Development Process
Planning
System Design
Board
Prototype
Production
Delivery
LSI Design
Device Process
Cell, IP Design
ES
MP
MassProduction
Lab Evaluation
IC Evaluation
(Engineering Sample)
Yield
10
Challenges Facing the ATE Industry
Challenges Facing the IC Industry
  • Provide the best test solution possible
  • Provide test solutions in a timely fashion
  • Extend ATE life span across technological
    generations
  • Lower costs
  • Reduction of product development times
  • Quickly adapt to sudden changes in device
    trends

11
Current ATE Business Model
Each ATE vendor has unique, proprietary test
platform
  • Drawbacks
  • Lack of compatibility between different test
    platforms
  • New test environments must be built for each
    test system
  • Increasing development times
  • Rising RD costs


12
OPENSTARTM Test Architecture
A common standard across the IC, ATE and
instrument industries
  • Instrument makers can develop and supply
    OPENSTAR- compliant modules and software
  • Open ATE architecture will alleviate the
    burden on test engineers

ATE Maker A
New Test Environments
ATE Maker B
ATE Maker C
13
OPENSTARTM Affords the Industrys Most Flexible
IC Test Solution
  • OPENSTARs testing flexibility will enable
    significant reductions in test costs
  • Ability to add testing modules as needed ensures
    optimal use of capital investment
  • ATE vendors can pass along dramatic savings
    through procurement of standardized parts

14
Customizable to Suit the Device Under Test
  • By combining OPENSTAR-compliant modules,
    companies can easily customize their
    Automatic Test Equipment (ATE)
  • Companies will be able to upgrade their test
    equipment by simply adding and/or replacing
    these modules, enabling efficient use of
    capital

15
Total Test Solution
System Development Process
Planning
System Design
Board
Prototype
Production
Delivery
LSI Design
Device Process
Cell, IP Design
ES
MP
Lab Evaluation
IC Evaluation
Production
or
Solution Plan
A solution plan to work for each phase of IC
development and test.
16
Semiconductor Test Consortium
STC offers an integrated test solution,
providing a suite of modules tailored to the
users requirements
Customer B
Customer C
Customer A
Apps A
Apps B
Apps C
OAI
OAI
Module Mainframe
Module Mainframe
Module Mainframe
Module
Module
3rd Vendor
ATE Vendor A
ADVANTEST
IP Licensing
Specification
Specification
Semiconductor Test Consortium (STC)
17
35 Signed MOU Member (August, 2003)
Japan Fujitsu, Renesas, JEM, NEC, ShibaSoku,
TEL, MJC, Sharp, NSW,ADVANTEST USA Intel,
Motorola, Agere, National Instruments,
Advanced Energy Industries, GuideTech, Inovys,
KVD, Manipulators International, Port Orford
Co., Pragmatics Technologies, Roos
Instruments, Racal Instruments, StarGen,
Stridge, 3MTS, Wavecrest, Xandex, Philips,
Analog Devices, ARTEST, MOSAID Systems Europe
Q-star Taiwan ASE Test, TSMC
18
Advantest Contributes to the Growth of Chinas
Semiconductor Industry
1. Establishment of a Test Support Center in
Beijing . In cooperation with the Beijing
Semiconductor Industry Association . To
provide local design houses with access to ATE
. Will provide ATE training to promote local
IC design and development 2.
Established joint research laboratory with
Shanghai Huadong Normal University .
Helped establish classes on testing technology
. Installed Advantest ATE for student use
. Scholarship program (RMB400,000 over five
years )
19
Advantest Contributes to the Growth of Chinas
Semiconductor Industry
3. Sourcing local manufacturing for OPENSTAR
modules device interfaces . Working
together with Chinese partners in
development and production
20
OPEN Architecture is the Future of ATE
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