AP 5301 / 8301 Instrumental Methods of Analysis

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AP 5301 / 8301 Instrumental Methods of Analysis

• Course Coordinator Prof. Paul K. Chu
• Electronic mail paul.chu_at_cityu.edu.hk
• Tel [phone] Fax [phone]

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Reference Books

• Encyclopedia of Materials Characterization, C.
  Richard Brundle, Charles A. Evans, Jr., and Shaun
  Wilson (Editors), Butterworth-Heinemann (1992)
• X-Ray Microanalysis in the Electron Microscopy
  (4th Edition), J. A. Chandler, North Holland
  (1987)
• Methods of Surface Analysis Techniques and
  Applications, J. M. E. Walls (Editor), Cambridge
  University Press (1990)
• Secondary Ion Mass Spectrometry, Benninghoven,
  Rudenauer, and Werner, John Wiley Sons (1987)
• Surface Analytical Techniques, J. C. Riviere,
  Oxford University Press (1990)
• Modern Techniques of Surface Science, D. P.
  Woodruff and T. A. Delchar, Cambridge University
  Press (1994)
• Analysis of Microelectronic Material Devices, M.
  Grasserbauer and H. W. Werner (Editors), John
  Wiley Sons (1991)
• Scanning Electron Microscopy and X-Ray Analysis
  (3rd Edition), J. Goldstein, D. Newbury, D. Joy,
  C. Lyman, P. Echlin, E. Lifshin, L. Sawyer, and
  J. Michael, Kluwer (2003)

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COURSE OBJECTIVES
Course Objectives

• Basic understanding of materials characterization
  techniques
• Emphasis on applications

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Classification of Techniques

• Microscopy and related techniques
• Surface characterization techniques
• Elemental / chemical depth profiling techniques
• Non-destructive testing

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Microscopy and Related Techniques

• Light Microscopy
• Scanning Electron Microscopy (SEM) / Energy
  Dispersive X-Ray Spectroscopy (EDS) / Wavelength
  Dispersive X-Ray Spectroscopy (WDS) / X-ray
  Diffraction (XRD) / X-Ray Fluorescence (XRF)
• Transmission electron microscopy (TEM) / Scanning
  Transmission Electron Microscopy (STEM) /
  Electron Diffraction (ED)

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Surface Characterization Techniques

• Auger Electron Spectroscopy (AES)
• X-ray Photoelectron Spectroscopy (XPS) or
  Electron Spectroscopy for Chemical Analysis
  (ESCA)
• Scanning Probe Microscopy (SPM) Scanning
  Tunneling Microscopy (STM), Atomic Force
  Microscopy (AFM),

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Depth Profiling Techniques

• Auger depth profiling
• XPS depth profiling
• Secondary Ion Mass Spectrometry (SIMS)

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Non-Destructive Testing Techniques

• Radiographic and Neutron Radiographic Tests
• Electromagnetic Magnetic Particle Tests
• Sonic, Electrical, Mechanical, and Visual Tests
• Photoelasticity Test
• Liquid Penetrant Tests
• Leak Tests
• Acoustic Emission Tests

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Principles of Analytical Techniques
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Product Yield Enhancement

• Understand via modeling and simulation which
  parameters can improve product yield
• Systematically identify these parameters within
  the process
• Control and reduce / eliminate these parameters
  by identifying their root cause
• Process monitor these parameters to measure the
  success of contamination control efforts

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Surface Contaminant Identification

• Particles Optical Microscopy, SEM/EDS, AES,
  XPS, SPM
• Residues SEM/EDS, AES, XPS, SIMS
• Stains, discoloration, hazes SPM, SEM, XPS,
  AES, SEM/EDS
• General surface contamination XPS, AES,
  SEM/EDS, SIMS

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Haze on Silicon Surface (SPM)
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TiN Grains (SPM)
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Imaging of Hard Disk (SPM)
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Residues on Integrated Circuits (SEM)
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Integrated Circuit (SEM)
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Hard Disk Defects (AES)
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Si Wafer Surface Contamination (XPS)
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Depth Profiling
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Gate Oxide Breakdown (SIMS)