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COOLRUNNER II REAL DIGITAL CPLD

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Title: COOLRUNNER II REAL DIGITAL CPLD


1
COOLRUNNER IIREAL DIGITAL CPLD
  • Ravi Kumar Vommina
  • CPE 695

2
Contents
  • Introduction
  • Features
  • Architecture
  • Advanced Features
  • Applications
  • ISE 6.1
  • Cool Runner II Family parameters

3
Introduction
  • Reconfigurable Computing Platforms
  • Implementing algorithms directly in hardware
  • Parallelism nature of Hardware
  • Efficient Implementation
  • FPGA (Field Programmable gate Array)
  • Configurable logic blocks and routing resources
  • CLB uses LUTs to implement Boolean functions
  • Inclusion of hard cores
  • CPLD (Complex programmable logic device)
  • PLA , programmable AND plane,fixed OR plane
  • PAL, both AND and OR planes

4
Introduction
PAL Requires 4 pts!
PLA Requires only 3 pts!
C
B
A
C
B
A
X A B C Y A B !C
Can NOT share common logic
Y
X
X
Y
Indicates used junction
Common logic may be shared in Cool Runner II
Indicates unused junction
Indicates fixed junction
5
Cool Runner II Features
  • Real Digital
  • patented design technology enabling high
    performance and ultra low power consumption.
  • true CMOS both in process technology and design
    technique
  • 1.8 V system, fastest low power CPLD using real
    digital technology
  • 0.18u process technology CMOS CPLD
  • Static Icc of less than 100 micro amps at all
    times
  • 100 CMOS product term generation

6
CMOS
V
DD
  • In steady state there exist always a finite
    resistance path between Vout and either VDD or
    Ground.
  • Ideal static power should be zero
  • Small static power consumption exists due to
    leakage currents and sub threshold conduction
    that is lt 100 micro amps
  • Total power dynamicshort circuit static
  • Short circuit current flow is due to the delay in
    rise and fall times of input.
  • Dynamic power C .VDD2/ 2 . f

CMOS inverter
V
V
in
out
C
L
V
V
DD
DD
R
p
V
out
V
out
R
n
V
V
V
0
5
5
in
DD
in
7
Product term generation
Distributed RC model (Elmore
delay) tpHL 0.69 Reqn(C12C23C34CL) Design
for speed Alternative structures
A
B
C
D
8
100 CMOS Product Generation
Delay lt 0.1ns
Delay lt 0.3ns
9
Cool Runner Architecture High Level View
10
Cool Runner II Macro cell view
11
Global Clock Signals
  • Clock input is buffered that drives multiple
    internal global signal traces to deliver low skew
    and reduce loading delays

12
Recap
  • High level View
  • 16 macro cells in a function block
  • Function blocks use PLA
  • Function blocks interconnect with advanced
    interconnect matrix
  • AIM is highly connected low power rapid switch
  • Macro cell View
  • 56 product terms
  • 4 control terms, 3 product terms
  • One flipflop as (D,T or latch) , ( edge or dual
    edge triggered)
  • Xilinx software makes the choice when to choose
    product or global or control term

13
Cool Runner-II I/O Characteristics
Programmable Output capabilities
  • performed with software attributes
  • Open drain with pull up
  • Slew rate

14
Cool Runner II input view
Schmitt Trigger Input
15
Cool Runner II Input Characteristics
  • Termination Options
  • Bus- Hold (Weak Keeper)
  • Pull-Up
  • CGND
  • During power up device is in Quiescent state

16
Advanced Features Data Gate
17
Advanced Features Clocking Options
18
Advanced Features-Cool Clock
19
Using the advanced features
  • Clock divide
  • declaration
  • Instantiation
  • Schmitt Trigger input

20
Advanced Features-On the fly Configuration
  • Initial pattern is loaded into a configuration
    shifter
  • The pattern first transfers into nonvolatile
    memory
  • The pattern is then read from NV to SRAM for
    actual cell operation
  • Leaves ability to reload the NV memory as xilinx
    says, On the Fly

21
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22
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23
Impact Menu
24
Selecting OTF
25
Cool Runner II Features
  • Advanced Design Security
  • Hot Pluggable
  • Wide package availability
  • Supports Multi Voltage standards

26
Applications
  • Ideal for high speed designs
  • High performance CPLD
  • Advanced features
  • Double data rates
  • Target device for portable designs
  • Lowest power
  • Maximum battery life
  • Lower heat dissipation
  • Small packaging
  • Chip scale packaging

27
PDA
IrDA
LED
?P
UART
Docking Cradle
LCD
SPI
Touchscreen
Keypad
28
Interface for DDR SDRAM Interface
  • Double data rates
  • Address translation

29
ISE6.1Design Flow
  • An active project space is created.
  • Existing VHDL modules can be added or new ones
    can be created in the project.
  • A user constraint file is specified that maps the
    input and out put signals to the actual pins of
    the device
  • Synthesis of the design is performed by just
    selecting the implement design option.
  • Device is configured by IMPACT.

30
Cool Runner II
31
Bibliography
  • WWW.Xilinx.com
  • http//bwrc.eecs.berkeley.edu/IcBook/
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