BMS Business Unit Overview

1

• BMS Business Unit Overview
• Eric Marcelot
• Marketing Manager
• Broadband Data Converters, Microprocessors
  Services

2
History
Phoenix Dynamo Co Ltd formed Name changed to
English Electric Valve
France
UK
1947
Opening of site in Saint-Egrève France ( as
Sescosem)
1955
1968
GEC acquires English Electric
1988
Name changed to EEV Ltd
1978
Name changed to Marconi Applied Technologies
Start of CCD activities
1999
Becomes Thomson-CSF Military Space Division
3i and Management buy out to found e2v
technologies
1984
2002
Renamed Thomson-CSF Semiconducteurs Spécifiques
2003
e2v acquires automotive security business
1992
2004
e2v technologies plc floats on the London Stock
Exchange
2000

• Becomes Atmel Grenoble

2005
e2v acquires Gresham Scientific Instruments
e2v acquires Grenoble facility from the Atmel
Corporation for 140m.
2006
Becomes e2v Grenoble
2007
e2v acquires MiCS
3
Business overview
Medical and Science
Aerospace and Defence
Commercial and Industrial
Sensors and semiconductors
Electronic tubes
4
Revenue
Europe Group sales 105m
Asia Pacific Group sales 15m
Americas Group sales 51m
Middle East Africa Group sales 3m
e2v group annual sales 2006/7 174m
5
Operations
Chelmsford

• Headquartered in Chelmsford, UK
• Additional design, development and manufacturing
  facilities in Corcelles (Switzerland), Grenoble
  (France), Lincoln (UK) and High Wycombe (UK).
• 1800 employees 600 engineers and scientists
• Sales and support offices in the USA, Germany,
  France and Hong Kong
• Global network of distributors, consultants and
  representatives
• ISO90012000, ISO/TS 169492002 (Lincoln and
  Corcelles automotive products) and ISO140012004
  certified (UK sites)

Lincoln
High Wycombe
Corcelles
Grenoble
6
History of the Grenoble facility

• 1955 Opening of site in Saint-Egrève (SESCOSEM)
• Manufacturing of diodes, transistors
  and vacuum tube imagers
• 1978 Beginning of CCD activities
• 1984 Becomes Thomson-CSF Military Space
  Division
• Integrated circuits for Military Space
• 1992 Renamed Thomson-CSF Semiconducteurs
  Spécifiques
• Specific semiconductors in CCD and CMOS
  technologies
• 2000 Becomes Atmel Grenoble
• August 2006 Becomes e2v semiconductors

7
Advanced Imaging Semiconductors (AIS) Division
Organization
8
Advanced Imaging Semiconductors (AIS) Revenue
by Region
Europe
Asia
North America
9
Grenoble Industrial FacilitiesWafer Fab

• Front-end
• Class 10 and 1 clean rooms
• CCD technology
• CMOS imager and sensor post-processing

10
Grenoble Industrial FacilitiesPackage Assembly

• 1 Hi-Rel assembly facility in Europe
• 600 sq. meters, Class 100 clean room
• Die processing capability
• Screening levels up to Space-grade (QML Class V)
• Low and Medium volume (up to 1M/year)
• Hermetic ceramic packages
• DIL CPGA CQFP CLCC
• Flip-Chip ceramic BGA packages
• CBGA Hi-TCE CBGA

11
Grenoble Industrial FacilitiesElectrical Test
Screening

• Automatic Test Equipment CCD CMOS image
  sensor
• Teradyne A393, A565IH, IP750 and dedicated
  test-bench
• Mixed RF IC
• Teradyne A567 (x3), A585
• Digital IC
• Teradyne J971, J973, TigerNextTest PTHF64
• Low/high temperature handlers and probers
• EG4080/4090 probers
• Multitest, Delta design, Aseco S130
• Reliability and burn-in

12
Quality Roadmap
Compliance with TS 16949 ISO 14001
AS9100B EN9100 JISQ9100 AQAP2110
QS9000 practices
ISO90012000
QML
AQAP110
Technology Approval
ISO9001
CNES/ESA
CECC
RAQ1
MIL-STD-883
1985
1995
1990
2000
2002
2004
2006
2008
13
BMS Business Unit
Broadband Data Conversion Microprocessors and
Services
14
BMS at glance

• Hi-Rel Microprocessors product offer
• Freescale upscreened Microprocessors 68K,
  PowerPC G2, G3 and G4 (since 1980)
• Integrated Processors and Communication
  Controllers 68K and 82xx
• Peripheral devices Tundra PCI Bridge Memory
  Controllers, Clock Drivers

• Added-value services and solutions
• Electrical Test and Characterization over wide
  temperature range
• Enhanced Reliability Packaging Hi-TCE Ceramic,
  Column-Interposer, hermetic packages
• Die Processing High and Low temperature
  electrical test and screening
• Long term availability Long life time item
  selection and die-banking capability

• Broadband Data Converter product offer
• Commercial Industrial grade data converters
  8-bit 5Gsps to 12-bit 500Msps
• Military Space grade data converters 8-bit
  1Gsps to 10-bit 2.2 Gsps
• ASSPs (Application Specific Standard Product)
  commercial through space grades
• ASICs commercial through space grades

15
Hi-Rel Microprocessors Mission Statement
The Hi-Rel Microprocessors Product Line of e2v
deliversa wide range of Extended Reliability
Products and Servicesbased on PowerPC and 68K
microprocessorsfor Professional Electronics
markets

• Host Processors and Integrated Processors
• in partnership with Freescale since 1980
• System Interconnect Products
• in partnership with Tundra, formal agreement
  signed in July 2006
• Added-Value services and solutions
• Electrical Test and Characterization over wide
  temperature range
• Enhanced Reliability Packaging Hi-TCE Ceramic,
  Column-Interposer, hermetic packages
• Die Processing High and Low temperature
  electrical test and screening
• Long term availability Long life time item
  selection and die-banking capability
• Companion devices Assembly Test Services
  (FSRAMs, SDRAMs, ASICs,...)

16
Broadband Data Converters

• Broadband Data Converters - over 45 years of
  combined expertise
• 15 data converter design engineers for custom and
  COTS development
• Dedicated solely to ADC, DAC and peripherals
  designs (no timesharing)
• High speed (gt500Msps to 2.2Gsps and beyond) data
  converter designs
• (4 designs per year on average)
• Peripheral devices design (HSSL, DMUX, MUX,
  memory, etc..)
• Over 35 patents registered in high speed high
  linearity data converters
• Data converter core design architecture
• Data converter T/H design
• etc..
• State-of-the-art development labs for
  characterization of
• High speed ADC characterization
• High speed DAC characterization
• Temperature extremes/mechanical shock/design
  limits validation

17
Broadband Data ConvertersSilicon Technology

• e2v designs its ICs on a range of technologies
  that are adapted to optimize the performance,
  flexibility and power consumption of the device
• Fully bipolar SiGe technology (Ft 200GHz) for
  demanding high speed high performance RF
  applications (ie. military, instrumentation,
  telecom, space,)
• BiCMOS SiGe technology (Ft 120GHz) for
  demanding high speed high resolution RF
  applications (ie. instrumentation, telecom,
  medical, )
• CMOS technology for low power integration
  (ie. telecom, medical, ..)

18
Broadband Data Converters Applications
Defense Radar ECW Guided weapons Space Com
sat military satellites Terrestrial base
stations Radio antenna arrays Test
Equipment Digital oscilloscope ATE
(semi-conductor) Industrial Telecom
infrastructures Medical imaging (MRI..)

19
Broadband Data Converters Industry legacy of BDC
Firsts to market

2007 (8B 5Gsps ADC)
2006 (12B 500M ADC)
2005 (10B 2G ADC DMUX)
2005 (10B 1.2G MUXDAC)
2003 (Dual 8B 1Gsps ADC)
2002 (10B 1.5Gsps DMUX)
2002 (10B 2Gsps ADC)
2000 (8B 1Gsps ADC)
20
Broadband Data ConvertersProduct Overview
Future Trends
14
ADC
EV12AS110
12
DAC
AT84AS001
EV12DS130
10
resolution (bits)
AT84AS008
AT84AS003/004
TS86101G2
8
TS81102
AT84AD001 AT84AD004
TS8388B
EV8AQ160
6
2
.5
1
1.5
2.5
3
0
sampling frequency (Gsps)
21
AT84AS001TP Series ?High linearity SFDR
Performance
EE Times ACE Awards Winner

• Key Performances (at full data rate of Fs
  500Msps)
• 12-bit resolution (no missing codes at 500Msps)
• 1GHz full power analog bandwidth
• SFDR 75 dBc (at Fin 250MHz)
• SFDR 71 dBc (at Fin 500MHz)
• SNR 62 dB (at Fin 200MHz)
• ENOB 10 bits
• BER 10E-14
• Power consumption 2.4W

Availability AT84AS001TP-EB (ADC Evaluation
Board) AVAILABLE AT84AS001CTPY (Commercial
grade EBGA192 RoHS) AVAILABLE AT84AS001VTPY
(Industrial grade EBGA192 RoHS) AVAILABLE
22
EV8AQ160CTPY ? Key Performances
Now Released, samples available

• Quad ADC with 8-bit resolution (no missing codes
  at 5Gsps)
• 1.25Gsps sampling rate in 4-channel mode
• 2.5Gsps sampling rate in 2-channel mode
• 5Gsps sampling rate in 1-channel mode
• 4-channel mode (Fs1.25Gsps, -1dBFs)
• ENOB 7.5 bit, SFDR 52dBc, SNR 48dB
  (Fin100MHz), TBC(Fin 620MHz)
• 2-channel mode (Fs2.5Gsps, -1dBFs)
• ENOB 7.3 bit, SFDR 51dBc, SNR 46dB
  (Fin100MHz), TBC (Fin620MHz)
• 1-channel mode (Fs5Gsps, -1dBFs)
• ENOB 7.1 bit, SFDR 49dBc, SNR 44dB (Fin
  100MHz), TBC (Fin620MHz)
• Digital Interface (SPI) with Reset signal
• channel mode selection, selectable ratio DMUX
  outputs, selectable input analog bandwidth
• gain, offset, phase controls, test mode, standby
  modes, etc

23
Quad 1.25 Gsps ADC Block Diagram
Output A
Output B
Output C
Output D
LVDS Buffers 11 or 12 DEMUX
LVDS Buffers 11 or 12 DEMUX
LVDS Buffers 11 or 12 DEMUX
LVDS Buffers 11 or 12 DEMUX
Clock Buffer selection decimationSDA
Gain
Gain
Gain
Gain
2.5GHz Clock
T/H
T/H
T/H
T/H
SPI Serial interface
Offset
Offset
Offset
Offset
Analog MUX (Cross Point Switch)
1
2
3
4
24
AT84AS008GL Series ?fastest 10-bit ADC
available on the market

• Performance
• On-chip T/H, monolithic die advanced high speed
  SiGe technology
• 10-bit resolution at 2.2Gsps sampling rate
• Outstanding dynamic performance
• 8-bit ENOB SFDR of 54 dBc at Fin 1.7GHz
• Gain flatness of 0.5dB from DC to 1.5GHz
• Spectral signature stable vs temp. AND sampling
  freq. to 1.9Gsps
• 3.3GHz full power input bandwidth (-3dB)
• SFDR -58 dBc (1.7Gsps, Fin 850MHz) -54 dBc
  (2.2Gsps, Fin 2GHz)
• SNR 52 dB (1.7Gsps, Fin 850MHz) 48 dB
  (2.2Gsps, Fin 2GHz)
• ENOB 8 bit (1.7Gsps, Fin 850MHz) 7.4 bit ENOB
  (2.2Gsps, Fin 2GHz)
• 2-Tone IMD3 64 dBFs (1.7Gsps, Fin 995/1005MHz)
• ADC gain sampling delay adjust, data ready
  output, out of range output bit
• Availability In production, die stock available
  (EOL)

CBGA152 package (21x21) AT84AS008GL
Series AT84AS008GLY Series (RoHS) AT84AS008MGS
Series (military)
10-bit 2.2GHz DMUX AT84CS001VTP
25
AT84AS003TP 004TP Series ?fastest 10-bit
ADC DMUX available on the market

• Performance
• T/H circuitry, monolithic ADC die combined DMUX
  device
• 10-bit resolution at 1.5/2Gsps sampling rates
• Outstanding dynamic performance
• Full 8-bit ENOB SFDR of 54 dBc at Fin 1.7GHz
• Gain flatness of 0.5 dB from DC to 1.5GHz
• Spectral signature stable vs temp. AND freq. to
  1.9Gsps
• 3.3GHz full power input bandwidth (-3dB)
• SFDR -55 dBc (2Gsps, Fin 1GHz) -54 dBc
  (2Gsps, Fin 2GHz)
• SNR 51 dB (2Gsps, Fin 1GHz) 50 dB (2Gsps, Fin
  2GHz)
• ENOB 7.8 bit (2Gsps, Fin 1GHz) 7.5 bit ENOB
  (2Gsps, Fin 1GHz)
• 2-Tone IMD 60 dBFs (2Gsps, Fin 945/955MHz)
• ADC gain sampling delay adjust, selectable
  12/14 DMUX, data ready output,
• Availability In production, die stock available
  (EOL)

EBGA317 package (25x35) AT84AS003TP
Series AT84AS004TP Series AT84AS003TPY Series
(RoHS) AT84AS004TPY Series (RoHS)
26
Hi-Rel Microprocessors - Applications

• Defense Aerospace
• Radars
• Electronic warfare
• Counter measures

• Avionics
• Flight computers
• Flight control systems
• Voice data recorders
• Displays
• Engine control

• Industrial Communication
• Transportation Systems
• Heavy industries
• Industrial Computers
• Power plant control

27
Hi-Rel MicroprocessorsApplications in Commercial
Avionics
Ordinateurs de Bord
28
Hi-Rel Microprocessors Offer Roadmap
e600 High-Performance Processors
Production
PC7448
PC7447A
PC7410
PC755
PC603R
PC8641D
8641D
Samples
PC7457
PC745
PC8610
Scheduled
e500 PowerQUICC III Processors
Proposed
PC8540
PC8548
PC85xx
PC8572
e300 PowerQUICC II Processors
PC860SR
PC8245
PC8265A
PC8280
PC83xx
PC8240
PC8270
Host Processor Bridges
PC107
PC109
Serial RapidIO Switches
PC578
PC5xx
PC574
Magnetoresistive RAM (MRAM)
EV2A16A
EV4A16
2007
2008 2009
29
Hi-Rel Microprocessors
PC603R Overview
BASIC ARCHITECTURE G2 Available since mid 90s
30
Hi-Rel Microprocessors
PC745 and PC755 Overview

• G3 Architecture issued in 2000
• L1 Cache memory size is doubled
• The bus interface allows access to
• L2 Cache Memory (external)

31
Hi-Rel Microprocessors
PC7410 Overview
G4 Architecture issued in 2002 Addition of
Altivec unit allows vectorial calculation over
128 BIT
32
Hi-Rel Microprocessors
PC7448 Overview
G4 Architecture, also known as e600 architecture
in 2006 L2 Cache is integrated on the silicon
33
Hi-Rel Microprocessors
The Future of the PowerPC Architecture Leveraging
the SoC Platform to Manage Power

• Some applications can take benefit of thread
  parallelism
• Requires higher performance
• double the cores
• or double the speed ?
• Both options have similar performance but
• Dual core is much lower power gt much better
  performance / watt ratio

34
Hi-Rel Microprocessors
PC8641D Preliminary OverviewDual-Core PowerPC
processor
PC8641D
MPX Bus

• E600 Architecture (new name of G4)
• 2 cores in parallel
• Integration on
• silicon of communication and memory controllers

Preliminary to be finalized after silicon
characterization
35
PC7447A Overview

• G4 Processor Core
• Superscalar PowerPC core architecture
• 7 stage pipeline
• 11 Execution units Simple (3), Float, Complex,
  AltiVec (4), Branch, Load/Store
• SMP Support
• AltiVec engine enhancements Simple, Complex,
  Float, Permute
• Memory Subsystem
• 32KB L1 Instruction Data Cache, 8-way
  set-associative
• 256-bit internal datapath between L1 and L2
• 512KB On-chip L2-Cache, running at core frequency
• Compatibility
• Full G3/G4 Software compatibility
• Drop-in replacement in a PC7447 application
• Performance
• Dhrystone 2.1 2310 MIPS _at_ 1 GHz
• 18.3W typical power dissipation _at_ 1.267GHz _at_ 1.3V
  (L-Spec)
• 9.3W typical power dissipation _at_ 1.167GHz _at_ 1.1V
  (N-Spec)
• Enhanced Thermal Management Features

36
PC7448 Overview

• e600 Processor Core
• Superscalar PowerPC core architecture
• 7 stage pipeline
• 11 Execution units Simple (3), Float, Complex,
  AltiVec (4), Branch, Load/Store
• SMP Support
• AltiVec engine enhancements Simple, Complex,
  Float, Permute
• Out-of-Order AltiVec instructions supported
• Memory Subsystem
• 32KB L1 Instruction Data Cache, 8-way
  set-associative
• 256-bit internal datapath between L1 and L2
• 1MB On-chip L2-Cache with ECC
• Compatibility
• Software compatibility with PC744x/5x
• Drop-in replacement in a PC7447 application
• 60x / MPX Bus Interface (MPX running at 200MHz)
• Performance
• Maximum Core Speed 1250 MHz, targeting 1267MHz
  on Rev.D
• Power dissipation 10W (typical) at 1250MHz

37
PC8610 Preliminary OverviewSingle-Core e600
processor

• Features
• Single e600 core up to 1.33GHz
• AltiVec vector processor for image processing
• 256KB on-chip L2-cache
• DDR1/DDR2 controller, 64 or 32-bit, 333-533MHz
• LCD Controller, 24-bit/pixel, 60Hz refresh
• Up to SXGA 1280x1024 resolution
• 3 planes (XGA) 1 cursor plane
• PCI-Express x 2 ports (x1/x2/x4/x8 x1/x2/x4)
• PCI 2.2, 32-bit, 33/66 MHz
• Local bus, 32-bit, up to 133 MHz
• I2C x 2, GPIO x 32 (16 dedicated, 16 multiplexed)
• DUART x 2 x 4 channels each, 115 kb/s
• IrDA x 2 channels Fast/Serial, 4 Mb/s
• DMA x 2 x 4 channels each
• Serial peripheral interface (SPI) 4/8/16/32
• Machine Check ext interrupt
• Watchdog 2 Global Timers
• Technology

Preliminary to be finalized after silicon
characterization
PC8610
MCP interrupt
MPX Bus
LCD Controller
38
PC8641D OverviewDual-Core PowerPC processor

• Features
• Dual e600 cores _at_ 1.25GHz
• Dual DDR2 memory controllers
• Four Gigabit Ethernet controllers
• RapidIO fabric 1x/4x Serial RapidIO
• Dual x1/2/4/8 PCI Express
• Multiprocessor Interrupt Controller
• Local Bus
• Technology
• 90nm CMOS SOI (silicon-on-insulator) process
• 1.0V 1.1V core power supply
• 1023-ball Hi-TCE CBGA package
• Performance
• Target frequency 1250MHz
• Target Power Dissipation 15-25W (typical)
• Schedule

PC8641D
MPX Bus
39
PC8548 OverviewPowerQUICCIII Communication
Controller

• Processor Features
• e500 PowerPC core up to 1.0 GHz
• 512KB L2-cache w/ ECC
• 36-bit physical addressing
• Double precision Floating Point Unit
• System Unit
• 64-bit DDR/DDR2 memory controller
• 4x 10/100/1000Mbps Ethernet Controllers
• 2x 32-bit PCI or 1x 64-bit PCI-X
• DUART, 2x I²C, Timers
• Security Engine (Sec 2.1)
• ARC4, 3DES, AES, RSA/ECCXOR, Single pass SSL/TLS
• High-Speed Interfaces
• x4, x1 Serial RapidIO (20Gbps)
• Or x8, x4, x2, x1 PCI-Express (32Gbps)
• Or x4 Serial RapidIO and x4 PCI-Express (36Gbps)
• Local Bus (3.3V I/O)
• 32-bit for SDRAM, Boot-Flash, Compact Flash card
• Performance Technology

PC8548
512KL2
64b DDR/DDR2 SDRAMController
LocalBus
Coherency Module
OpenPIC
Security
Gigabit Ethernet
Gigabit Ethernet
Perf Mon DUART 2x I2C Timers
Gigabit Ethernet
DMA
Gigabit Ethernet
10/100 Ethernet
32b PCI 64b PCI-X

SRIO / PCI-Exp
32b PCI
40
PC8572 Preliminary OverviewPowerQUICCIII
Communication Controller

• Dual e500 Power cores up to 1.5GHz
• 36-bit addressing
• 1MB Shared L2 Cache/SRAM w/ECC
• Dual Memory Controller
• Dual DDR2/3 SDRAM up to 800MHz
• 32/64-bit data bus w/ECC
• Support for up to 32GB memory
• High Speed Interconnect
• One x8/x4/x2/x1 PCIeOr Two x4/x2/x1 PCIeOr
  One x4/x2/x1 PCIe AND Two x2/x1 PCIe Or One
  x4/x2/x1 PCIe AND x4/x1 sRapidIO
• Ethernet
• 4x 10/100/1000 Ethernet Controllers
• 1x 10/100 FEC w/ MII (muxed)
• Security Engine (SEC 3.0)
• ARC4, 3DES, AES, AES-GCM, SHA-384/512, RSA/ECC,
  RNG and XOR
• Single pass SSL
• Pattern Matching (Reg-Ex) Deflate
• 16k patterns up to 128, breaking across packets
• Table Lookup Unit (TLU)
• Up to 7M lookups/sec

1MB L2
2x DDR2/ DDR3, SDRAM Controller
64b
64b
Enhanced Local Bus
Pattern Matching Engine
32b
Coherency Module
Perf Mon, DUART, MPIC 2x I2C, Timers
2x Table Lookup Unit
System Bus
System Bus
4x GE MAC
10/ 100 FEC
4x SGMII
Preliminary to be finalized after silicon
characterization
41
PC107 OverviewPCI Bridge / Memory Controller

• 60x processor bus supports 66, 83 and 100MHz
• Integrated 32-bit PCI
• 33 and 66 MHz PCI 2.1 interface, 5V tolerant
• Full PCI support lock, memory coherent, sleep
  mode
• Master and Agent mode support
• Support for multiple 107 devices on PCI Bus
• PCI Arbiter (5 req/gnt pairs)
• Integrated Memory Controller (20-100 MHz)
• DRAM (FPM, EDO), SDRAM, up to 1GB
• Separate memory data bus w/buffers for parity or
  ECC
• ROM/Flash ROM (up to 144MB)
• Other Features
• EPIC Interrupt Controller
• Clock generation and buffering for PCI and memory
• I2C (Master and Slave mode)
• Message Unit (I2O support)
• Two-channel DMA (direct and chaining modes)
• Power managementNap, doze, sleep and suspend

42
PC109 OverviewPCI Bridge / Memory Controller

• 60x and MPX Bus Interface
• Support for the latest processors PC7410,
  PC7447/47A/57, PC7448
• MPX bus operation up to 200MHz
• Supports two processors (up to 167MHz bus speed)
• 64-bit Data 32/36-bit Address
• Integrated PCI-X Interface
• 133MHz PCI-X and 66MHz PCI, 64-bit Data
• Integrated Memory Controller
• 200MHz, 400 DDR-II, 8-bit ECC
• Direct Connect to MPX for minimum latency
• Dual DIMM support at 200MHz
• Other Features
• Host Port supporting 8-32 bit devices
• Clock generator requires single clock input
• Dual 10/100/1000 Ethernet, internal DMA per port
• Interrupt Controller
• I²C, Dual-UART, 16 GPIOs
• DMA
• Power managementNap, doze and sleep modes

PC109
Ethernet Interface
43
PC578 Preliminary Overview16-port Serial
RapidIO switch

• 80Gbps Full-Duplex Serial RapidIO Switch
• RapidIO Interconnect Specification (Rev.1.3)
  Compliant
• 1149.6 AC-JTAG
• Configurability
• Up to eight x4 links or sixteen x1
• Multicast Event Control Symbol
• Lane Swap
• Performance
• Cut-through latency 100ns
• Multicast
• Low Power
• Programmable integrated SerDes
• Port Power Down
• Technology
• 27x27mm Flip-Chip BGA package

Preliminary to be finalized after silicon
characterization
44
MRAM High-Density, Fast, Non-Volatile RAM
45
MRAM History
1995 Initial research was started by the Motorola Labs-Physical Sciences Research Lab (PSRL) in conjunction with DARPA- US government agency.
2000 Significant investment was made in advanced, production ready, 200mm MRAM tool set.
2001 Development for commercialization began in the MOS12 Wafer Fab facility in Arizona.
2002 256Kb and 1Mb test vehicles were successfully demonstrated by Motorola using 0.60um technology.
2003 Motorola delivered the first 4Mb MRAM samples using 0.18um technology and functionality was demonstrated on customers board.
2004 Freescale spun off from Motorola. All MRAM activity transferred to the new company.
2006 Qualification Complete. Qualified products are currently shipping. The worlds first MRAM product.
2007 E2v announces plans to support extended-reliability versions of Freescales MRAMs
46
MRAM Technology
Magnetic Tunnel Junction (MTJ) deposited on
standard 180nm logic process Simple 1T-1MTJ Cell
Structure Information is stored as magnetic
polarization, not charge The state of the bit is
detected as a change in resistance
47
MRAM Operation Read
Read Mode Current is passed through the bit
Resistance of the bit is sensed
48
MRAM Operation Write
Write Mode Current is passed through the
programming lines generating magnetic fields
The sum of the magnetic field from both lines is
needed to program the bit
49
MRAM Advantages
Nonvolatile
Data Retention - ? 20 years Stable Reliable
Fast
Symmetrical Read/Write 35ns Byte writeable
bit level granularity
Unlimited Endurance - ? 1016 Non-destructive
read Data stored by polarization not charge no
leakage, no soft errors
Unlimited Cycles
Viable
Integrated with Existing CMOS Baseline Compatible
with Embedded Designs 4Mb Commercial Device
Qualified
50
EV2A16A 4Mbit MRAM Overview

• Features
• 4Mbit memory array
• 256Kx16bit organization
• Flexible Data Bus (8/16-bit access)
• Power Requirements
• 3.3V single power supply
• 600mW power dissipation
• Low Voltage Inhibit (prevents writes on power
  loss)
• Performance
• Symmetrical high-speed Read Write operations
• Fast access time (35ns)
• Fully static operation
• Technology
• 0.18µm CMOS process
• 44-pinTSOP type-II package, SRAM compatible
  pinout
• Ceramic, Hermetic package design possibilities

51
3 Reasons to Choose e2vs Hi-Rel Microprocessors

• e2vs Product Offering
• Extensive high performance product portfolio and
  roadmaps
• Thanks to our agreements with Freescale
  Semiconductor and Tundra
• All parts are certified by 100 electrical
  testing using original test vectors to ensure the
  highest level of fault coverage.
• e2vs Focus on Extended-Reliability Market
• Unique Assembly Test facility for Hi-Rel
  products.
• For 25 years, our business has been to support
  this market segment.
• We continue to have the flexibility to support
  specific customer needs
• Our Commitment to the Long- term
• We make products that are available for 20 years
• First life is 7 to 10 years of active foundry
• e2v adds another 5 to 10 years of second life
  thanks to our obsolescence management process

52
www.e2v.com