EXHT-G1

1

• Gel Type Series

• Sheet Type Series

• EXHT-S1
• EXH-AL00(02)

• EXHT-G1
• EXH-AL00(01)

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2
Total EMC Products
ISO 9001 / 14001

• Introduction

• Why is Heat Transfer important?

In these days, a lot of electronic devices demand
very high levels of thermal management. The
objective of all thermal control programs in
electronic packaging is the efficient removal of
heat from device junctions to the ambient
environment. And packaging of portable
electronics is slim, which means that components
are more closely packed together, so the amount
of heat is increased. Clock speed of processor
and overall power density are increasing, which
means that more heat must be dissipated per
volume of electronic equipment than ever before.
EX-Therm is AMICs trademark, thermal management
materials combine high thermal conductivity and
superior flame-retardancy with specific organic
properties of heat resistance and electrical
insulation. If you focus to maximizing the heat
transfer, EH-Therm suits the purpose. It has got
UL approval for 94V-0 and/or 94V-1 flame class.
Achieving this goal is required a thorough
understanding of heat transfer fundamentals as
well as knowledge of available interface
materials, and how their key physical properties
affect the heat transfer process. Attaching heat
sink to a semiconductor package surface requires
that two commercial grade surfaces to be brought
into intimate contact. These surfaces are usually
characterized by a microscopic surface roughness
superimposed macroscopic non-planarity that can
give the surfaces a concave, convex or twist
shape. When two such surfaces are joined, contact
occurs only at the high points. The low points
form air-filled voids. Typical contact area can
consist of more than 90percent air voids, which
represents a significant resistance to heat flow.
EX-Therm is used to eliminate these interstitial
air gaps from the interfaces. Because the
material has a greater thermal conductivity than
through air it replaces, the resistance across
the joints decreases, while the component
junction temperature will be reduced.

• Properties of Thermal Interface Materials

Thermal impedance is the measure of the total
resistance to the flow of heat from a hot surface
through an interface material into a cold
surface. It is measured according to the ASTM
D5470 test method. Although the current version
of this method is specific to high durometer
insulating pad materials tested at high clamping
forces, the method has been successfully adapted
for use with low durometer materials as well as
fluid compounds.
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Gel Type TIM

• Applications

EXHT-G1
EXH-AL00(01)

• Characteristics

• Characteristics

EXHT-G1 Test Method
Color Gray -
Thickness (?) 0.2510 ASTM D374
Hardness (Shore OO) 10 ASTM D2240
Specific Gravity 2.5 ASTM D792
Service Temp. (?) -30 200 -
Volume Resistivity (Ocm) 1.0?1011 ASTM D257
Voltage Breakdown (kV) gt 6 ASTM D149
Thermal Conductivity (W/mK) 2.0 ASTM D5470
EXH-AL00(01) Test Method
Color Gray -
Thickness (?) 0.310 ASTM D374
Hardness (Shore OO) lt 50 ASTM D2240
Specific Gravity 2.0 ASTM D792
Service Temp.(?) -30 200 -
Volume Resistivity (Ocm) 1.0?1011 ASTM D257
Voltage Breakdown (kV) gt 6 ASTM D149
Thermal Conductivity (W/mK) 1.5 ASTM D5470

• Features

• Features

• EXHT-G1 is very soft, freestanding gap filler
  that is
• more compressible than any other gap filler.
• EXHT-G1 has not only good thermal conductivity
  of
• 2.0W/mK but high compressibility, which leads
  to
• low thermal impedance.
• EXHT-G1 is inherently sticky, so not necessary
  to
• use additional adhesive coating which
  deteriorates
• thermal performance.
• EXHT-G1 is electrically insulated and stable
  from
• 30? to 200?.

• EXH-AL00(01) has not only good thermal
• conductivity of 1.5W/mK and high
  compressibility to
• produce low thermal impedance.
• EXH-AL00(01) is electrically insulating, stable
  from
• 30? to 200?.
• Available in various thickness from 0.25mm to
• 10.0mm.
• EXH-AL00(01) does not require reinforcement.

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4
Total EMC Products
ISO 9001 / 14001
Sheet Type TIM

• Applications

EXH-AL00(02)
EXHT-S1

• Characteristics

• Characteristics

EXH-AL00(02) Test Method
Color White -
Thickness (?) 0.11.0 ASTM D374
Hardness (Shore A) 50 ASTM D2240
Specific Gravity 2.5 ASTM D792
Service Temp.(?) -30 200 -
Volume Resistivity (Ocm) 1.0?1011 ASTM D257
Voltage Breakdown (kV) gt 6 ASTM D149
Thermal Conductivity (W/mK) 2.0 ASTM D5470
EXHT-S1 Test Method
Color White -
Thickness (?) 0.10.35 ASTM D374
Hardness (Shore A) 70 ASTM D2240
Specific Gravity 2.7 ASTM D792
Service Temp.(?) -30 200 -
Volume Resistivity (Ocm) 1.0?1011 ASTM D257
Voltage Breakdown (kV) gt 6 ASTM D149
Thermal Conductivity (W/mK) 4.0 ASTM D5470

• Features

• Features

• EXH-AL00(02) has both good thermal conductivity
• of 2.0W/mK and compressibility to produce low
• thermal impedance.
• EXH-AL00(02) is electrically insulating, stable
  from
• 30? to 200?.
• Available in various thickness from 0.1mm to
  2.0mm
• EXH-AL00(02) does not require reinforcement.

• EXHT-S1 has high thermal conductivity of 4.0W/mK
  
• to produce low thermal impedance.
• EXHT-S1 is electrically insulating, stable from
• 30? to 200?.
• Available in various thickness from 0.1mm to
• 0.35mm.
• EXHT-S1 does not require reinforcement.
• Not only the lowest thermal resistance but the
  highest
• dielectric strength are the distinctive
  characteristics
• of EXHT-S1.

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• Thermal Resistance

• How to Use

1st
2nd
3rd
Heat sink
EXH-Al00(01)
Chip
Chip
Release paper

• How to Order

(1) Serial Number (2) Thickness (?) (3) Type
Al00(01), Al00(02), G1, S1 (4) Width (?) (5)
Length (?) (6) Adhesive Tape (Available)
P/N EXHT AAA BBB CCC DDD EEE
(1) (2) (3) (4) (5)
(6)
P/N EXH AAA BBB CCC DDD EEE
(1) (2) (3) (4) (5)
(6)
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