Caspers/Mostacci:Proposal for the - PowerPoint PPT Presentation

1 / 17
About This Presentation
Title:

Caspers/Mostacci:Proposal for the

Description:

... beam power in the chopper section =4 kW) we would get about 200 Watt beam losses ... for 500 Volt we still get 10A) ... too low (about 46 Ohm instead ... – PowerPoint PPT presentation

Number of Views:23
Avg rating:3.0/5.0
Slides: 18
Provided by: Casp155
Category:

less

Transcript and Presenter's Notes

Title: Caspers/Mostacci:Proposal for the


1
Proposal for the SPL Chopper StructureF. Caspers
and A. Mostacci
  • Potential difficulties related to earlier designs
    (radiation aspects, out-gassing, size)
  • What could we do in order to reduce the cost for
    the puls generator or RFamplifier?
  • Are there other aspects, which would make an
    alternative design interesting?
  • Discussion of layout and results
  • Conclusion

2
Potential difficulties related to earlier designs
(radiation aspects, out-gassing, size)
  • In previous reports a beam transmission
    efficiency around 95 over the chopper section
    has been quoted
  • Translating these numbers for the SPL (average
    beam power in the chopper section 4 kW) we would
    get about 200 Watt beam losses
  • In the CERN-SPL chopping line (L6 meter) 1.5
    meter are occupied by chopper structures (present
    version)
  • The substrate material proposed and used (Rogers
    RT duroid 6002) contains teflon out-gassing?!
  • The radiation limit for teflon in vacuum is 105
    Gray (1Gray 1 Joule/Kg)

3
How to reduce the cost for the driver?(impuls
generator or wide-band amplifier)
  • For a 2 ns rise- and fall-time (10-90) the
    external drivers could become very costly for a
    deflection voltage of 0-1 kV (peak, uni-polar)
    per deflecting plate.(1 kV into 50 Ohm requires
    20 A ! for 500 Volt we still get 10A)
  • If we could produce deflecting structures with a
    width of, say, less than 5 cm, they would rather
    easily fit into dipole or quad magnets and we
    could simplify the design of this section.
  • We gain linear (in terms of kicker output power)
    with the length of the deflecting structures
    used.
  • Less voltage per kicker module would simplify the
    driver design (less signal combination thus
    better rise/fall time) and lowers the heat loss
    in the meander.

4
An alternative design for a meander structure on
aluminum oxide (1)
  • Using alumina (eps9.6) on a massive metallic
    support (e.g. aluminum) would increase the heat
    transfer capability, allow for less width and has
    infinite radiation resistance
  • A recent printed version on organic substrates
    with separators had a width of 90 mm for ?0.065
    (2 MeV). For ?0.08 (3 MeV) a width of 75 mm or
    somewhat less appears possible with that
    technology.
  • With an alumina substrate for ?0.08 a width of
    45 mm can be reached.
  • However Can we get acceptable values for
    reflection, loss and dispersion when taking
    alumina?
  • Are there technological limits to produce printed
    meander structures on 50 cm long alumina strips?

5
An alternative design for a meander structure on
aluminum oxide (2)
  • The concept of separating ridges would be very
    hard to implement for a ceramic substrate. Thus
    we have to check the influence of mutual coupling
    from adjacent lines on the dispersion (variation
    of group delay vs frequency)
  • We have to find an optimum for the thickness of
    the alumina substrate. If it is too thin, it will
    become very fragile and the conductor losses
    increase due to the small width of the lines. If
    its too thick, the mutual coupling from adjacent
    lines increases.
  • Reducing the length of the coupling section
    between adjacent lines should help to reduce
    dispersion.
  • Thus a design using a symmetric double meander is
    proposed ( a simple meander was proposed earlier)

6
  • We are considering first a double meander
    structure 20 cm long as shown below

1982mm (33 cells)
50 mm
Substrate
W
3 mm (50
)
3 mm thick
e

9.6
0.45 mm
6 mm
W
(100
)
42.5 mm
7
  • Results for the 20 cm long structure (no
    additional electro-deposited metal after firing,
    0-1GHz)DC resistance near 5 Ohm( too high)

8
  • 50 cm long structure, transmission measurements,
    0-600MHz, time -domain display
  • The metal thickness of the meander has been
    increased to about 40 micron by electro-chemical
    deposition

1.65ns
1.98ns
9
  • 50 cm long structure,transmission measurements,
    0-1000MHz, time-domain display (notice the
    increased ringing due to larger bandwidth)

10
  • 50 cm long LANL structure, measured time domain
    response, EPAC paper 2000 by S.Kurennoy,

1 ns filter
2 ns filter
11
  • 50 cm long structure,transmission measurements,
    0-1000MHz for comparison, on the right, meas
    data from LANL, Kurennoy, EPAC2000 also 50 cm
    long but on RT duroid substrate with separating
    fins

12
  • 50 cm long structure,transmission measurements,
    0-1000 MHz, phase after delay correction

13
  • 50 cm long structure,transmission measurement,
    0-1000 MHz, group delay variation vs frequency

14
  • 50 cm long structure, reflection measurement, S11
    (step-response) in the time domain (0-1000 MHz
    bandwidth)
  • notice, that the char. impedance is slightly too
    low (about 46 Ohm instead of 50 Ohm)

15
  • 50 cm long structure, field coverage factor (data
    provided by S.Kurennoy) peak value on axis 0.79
    for the 50 Ohm meander in upper color bar.

Relative color scale up to 100
16
  • 50 cm long structure, field coverage factor (data
    provided by S.Kurennoy), 100 Ohm structure, peak
    value0.74

17
  • Conclusion
  • This prototype of a 50 ohm double meander printed
    on 3 mm thick alumina is a competitive candidate
    for the SPL chopper
  • Losses and dispersion are comparable to the LANL
    prototype
  • The structure can stand the radiation and heat
    load (if water cooled) and should have good
    vacuum properties
  • Wideband impedance matching can be achieved
  • The field coverage factor is slightly lower(79)
    as compared to the LANL prototype (89 ) for 50
    Ohm impedance.
  • 100 Ohm char. impedance is also possible, but at
    the expense of further decrease in field coverage
    as well as in field homogeneity
Write a Comment
User Comments (0)
About PowerShow.com