Simulation of Particle Incoporation during Electrocodepostion Process

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Simulation of Particle Incoporation during
Electrocodepostion Process

• David Allen Wong, Dr. Jan Talbot, and Dr. David
  Abramson
• University of California, San Diego and Monash
  University
• July 7, 2008- July 18, 2008

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Background Proposal

• Electrocodeposition is the process in which
  nanoparticles are absorbed and plated into a
  metal film
• The growth of an electrodeposited film along the
  electrode is controlled by the local current
  density affected by the presence of an insulating
  particle during electrocodeposition
• The objective of this research is to simulate the
  incorporation of a particle by the growing metal
  film for primary, secondary, and tertiary current
  distributions.

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Progress

• Gathered background information for
  finite-element method and level set method
• Modelled and simulated applications given in
  Quick Start Guide and Minicourse
• -Aluminium film on silicon substrate
• -IC soldered to printed circuit board
• Looked at pre-configured modules in COMSOL

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Sample COMSOL Simulations

• Aluminium film on silicon substrate

• IC soldered to printed circuit board

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Future Work

• Determine which module to use in COMSOL and begin
  designing simulation
• Review sample simulation and outline for steps
  for electrocodeposition model
• Begin drawing rough geometry and start inputting
  boundary/subdomain conditions

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Adventures in Australia! _
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CHEERS!