Product Training

1
HIGH DENSITY DESIGN COMPONENT SOLUTIONS

2
Technology Challenges

• Market Drivers
• Make it smaller
• Make it operate faster
• Make it more efficient
• Make it cheaper

3
Technology Challenge

• Smaller Circuits Design
• Higher levels of circuit integration on silicon
• Use of smaller foot print components
• Components can be placed closer together
• - Closer the components get to each other, the
  more unwanted signal noise coupling occurs

• SMT 0603 0402
• CERAMIC CHIP CAPACITORS
• CHIP RESISTORS
• FERRITE CHIP BEADS
• INDUCTORS

4
Technology Challenge

• Faster Speed of Operation
• More done in shorter amount of time
• Higher complexity of functions display
• Smaller SMT Components Can Function at Higher
  Speeds.
• - Distances between components and traces become
  significant factors in limiting performance and
  creates need for control of signal integrity.

MHz 1200 800 600 400

• SMT 0603 0402
• CERAMIC CHIP CAPACITORS
• CHIP RESISTORS
• FERRITE CHIP BEADS
• INDUCTORS

5
Technology Challenge

• Less Power Consumed
• More features using less power
• Thinner barrier silicon IC chips lower voltage
  operation less energy needed.
• SMT Passive Components can function at lower
  voltages
• - Lower voltage IC have reduced tolerance to
  spikes transients. Higher level of transient
  and noise control is required more passive
  components needed (capacitors and TVS devices)
• - Lower ESR (lower loss) components needed

• CERAMIC CHIP CAPACITORS
• MLV VARISTORS
• LOW ESR ALUMINUM TANTALUM CAPACITORS

6
Technology Challenge

• Reduced Cost of Products
• Reduce size of PCB less cost
• Use SMT faster production and reduced cost to
  build
• Reduce component count by component integration
• Use smaller size components (less raw material
  less )
• Many SMT Passive Components cost less than
  leaded equivalents
• Integrated (multiple element passives) reduce
  board space and place costs

• CERAMIC CHIP CAPACITORS ARRAYS
• CHIP RESISTORS ARRAYS
• FERRITE CHIP BEADS / INDUCTORS
• PASSIVE ARRAYS (IPC)

7
Component Solution Component Size Reduction
NRC SERIES CHIP RESISTORS
SMT Component Size
0201
0201
NMC SERIES CERAMIC CHIP CAPACITORS
NIN/NIS SERIES CHIP INDUCTORS
0805 0603 0402 0201
12mm
3mm
NACxx SERIES SMT ALUMINUM ELECTROLYTIC CAPACITORS
8
Integrated Component Solution Resistor Arrays
High Density Design Solutions Component Size
Reduction and Integration
Get More Components In Less Space
2 OR 4 OR 8 ELEMENTS CHIP RESISTORS
10 PIN 8 ELEMENTS
4 PIN 2 ELEMENTS
NRSN SERIES RESISTOR ARAYS
REPLACE WITH
9
Thick Film Resistor Arrays

High Density Design Solutions Component Size
Reduction and Integration
Quad flat pack or PLCC package IC
0.5mm (0.20) ) 1.27mm (0.39) pitch
Four 0603 resistors (1.6mm X 0.6mm
each) Typically 0.20.5mm space between parts
(3.0mm X1.6mm total) Component size, spacing,
land patterns and connection layout takes up
valuable board space! Placing four components

103
103
103
103
NRSNA4I2
Quad flat pack or PLCC package IC
NRSNA4I4
0.5mm (0.20) 1.27mm (0.39) pitch
SUPERIOR PERFORMANCE IN HIGH SPEED CIRCUITS!
103
0.5mm (0.20) pitch (Same or less pitch as IC!)
0804 resistor arrays (2.0mm X 1.0mm total) NIC
P/N NRSNA4I4 Far less board space used and short
connection layout frees up valuable board space!
Placing one component ¼ the placement cost
saved!
10
Integrated Component Solution Capacitor Arrays
High Density Design Solutions Component Size
Reduction and Integration
Get More Components In Less Space
NCA SERIES CAPACITOR ARRAY 1 PART 4
ELEMENTS 1206 SIZE
4 ELEMENTS CERAMIC CAPACITORS
REPLACE WITH
11
Integrated Component Solution Capacitor Arrays
High Density Design Solutions Component Size
Reduction and Integration
0603 Ceramic chip capacitor 6/1000 0.6
each 4 parts 2.4 total.
Placement cost 0.5 5 each (industry
estimates) lets say it's 2 per part 8 for 4
parts. Total cost of 4 ceramic chip capacitor
elements 10.4 Total board
area 1.6mm X 4.7mm 7.52mm²

C1
C2
C3
C4
1.6mm
4.7mm
C1
C2
C3
C4
1.6mm
3.2mm
4 Element capacitor array 40/1000 4.0
each 1 part 4.0 total.
Placement cost 0.5 5 each (industry
estimates) lets say it's 2 per part 2 for 1
part. Total cost of 4 ceramic chip capacitor
elements 6.0 (42 savings)
Total board area 1.6mm X 3.2mm 5.12mm² (32
smaller) Capacitor Array
Benefits Lower total cost and less board space
used!
12
Integrated Component Solution Passive Component
Arrays
High Density Design Solutions Component Size
Reduction and Integration
Get More Components In Less Space
SUPERIOR PERFORMANCE IN HIGH SPEED CIRCUITS!
NPA SERIES PASSIVE ARRAY 1 PART 8 ELEMENTS 1608
SIZE
8 ELEMENTS 4 CAPACITORS 4 RESISTORS
REPLACE WITH
13
Integrated Component Solution Passive Component
Arrays
High Density Design Solutions Component Size
Reduction and Integration

• NPA SERIES - Four element RC network array in
  EIA 1608 size package
• Capacitance values from 10 180pF
• Resistive element values from 10 ohm 1K-ohm.
  

R R R R
C
R
C C C C
1608 size 0.16 long X 0.08 wide 4.0mm long X
2.1mm wide