Title: Review 4,
1Additional Information for Exam 4
- Covers lectures 26 32 and the associated
reading assignments - Arrive 5 minutes before the start of the exam
- Closed-book, closed notes
- Bring
- Calculators (memories cleared)
- Notes on a 3 x 5 card
- Periodic table (handed out in recitation)
- Provided
- Fundamental constants
2Glassy Materials the Glass Transition
Glassy
Semicrystalline
Crystalline
3Properties from Engineering Stress-Strain Curves
Callister 6.5
- Elastic modulus
- Yield strength
- Tensile strength
- Strain to failure
- Modulus of resilience
- Modulus of toughness
- Other topics
- Poissons ratio
- True stress, true strain
Callister Fig. 6.11
4Mechanical Properties of Metals Callister 6.5
- Brittleness vs. ductility in metals, ceramics,
and polymers
Callister Fig. 6.13
5Effect of Temperature Glassy vs. Plastic
Callister 16.2
- Effect of temperature in a linear polymer (PMMA)
Tg 4 C TgtTg plasticity? TTg stiffness?
brittleness?
Callister Fig. 16.3
6Polymer Crystallinity Callister 15.11
- Polymer crystals
- Platelets Bundles Spherulites
Callister Fig. 15.14
Callister Fig. 15.15
7Mechanical Characteristics of Polymers Callister
16.3
- Macroscopic effects of deformation
Callister Fig. 16.4
Callister Fig. 16.5
8Defects in Crystalline Solids by Dimension
- Point defects
- vacancies self-interstitials
- impurities (in elemental solids or in compounds)
- substitutional interstitial
- in compounds
- Schottky cation Frenkel anion Frekel
- Line defects dislocations
- edge screw mixed
- Planar defects
- grain boundaries twin boundaries surfaces
- stacking faults
- Volume defects
- pores inclusions
intrinsic defects
9More on Point Defects
- Intrinsic defects are thermally activated
- e.g., metal vacancies NV NS exp(GV/RT)
- Alternate form NV NS exp(QV/kT) (Callister
eq. 4.1) - gives
probability of an event - Impurities factors favoring solubility of B in A
- Atomic size ?r/r 15
- Same crystal structure for A and B
- Similar electronegativities ?A ?B 0.6
(preferably 0.4) - At least one valence in common
10Diffusion a Thermally Activated Process
Callister 5.5
intercept_at_T?
slope
on a plot of ln D vs. 1/T
0.0
11Ficks First Law Callister 5.3
concentration gradient
Always true
eq. 5.3
flux
D diffusion coefficient
- Special case steady state diffusion
- No accumulation or depletion concentrations are
invariant - ? concentration gradient and flux are constant in
time - Concentration gradient is linear
12Nonsteady-State Diffusion Callister 5.4
- Conservation of mass what stays there what
goes in what comes out - Flux at plane 1 Flux at plane 2
- Accumulation
0 in steady state ? 0 in unsteady state
Ficks second law
13Thermal Conductivity Callister 20.4
- Fouriers law of cooling
- heat flux W m2
- thermal conductivity W m1 K1
- temperature gradient K m1
- Compare to Ficks first law
- mass flux
- diffusivity
- concentration gradient
14Diffusion a Thermally Activated Process
Callister 5.5
vacancy diffusion
interstitial diffusion
15Diffusion a Thermally Activated Process
Callister 5.5
intercept
slope
on a plot of ln D vs. 1/T
16Interatomic Potential Heat Capacity Callister
20.2
add thermal energy ET ? separation r oscillates
about eqm spacing r0
Callister Figs. 2.8 20.3
17Heat Capacity Specific Heat Callister 20.2
- Heat capacity amount of energy needed to raise a
materials temperature by 1 degree, per mole of
material - J/mol-K, cal/mol-K
- Specific heat heat capacity per unit mass
- Specific heat J/kg-K, cal/g-K
18Temperature Dependence of Heat Capacity
Callister 20.2
- Low T CV heat capacity at constant volume
- Only long-wavelength phonons are active (? gt
atomic spacing) - At T ?D, the Debye temperature, all phonon
modes are active - Above ?D CV ? 3R constant
- ?D is below room T for many solids
- Above ?D, adding heat increases amplitude (not
number) of phonons
CV ? 3R
Callister Fig. 20.2
19Thermal Expansion Callister 20.3
- Dimensional changes as a function of temperature
- start (s)
- finish (f)
- Example T2 ? T4
Callister Fig. 20.3
20Thermal Expansion Callister 20.3
- Linear expansion
- Initial length l0
- Volume expansion
- Initial volume V0
Callister Fig. 20.3
21Thermal Expansion of Metals Callister Table 20.1
?l ? 15?106 C1
22Thermal Conductivity Callister 20.4
- Fouriers law of cooling
- heat flux W m2
- thermal conductivity W m1 K1
- temperature gradient K m1
- Compare to Ficks first law
- mass flux
- diffusivity
- concentration gradient
23Wiedemann-Franz Law Callister 20.4
- In metals
- Conduction electrons are responsible for both
electrical and thermal conduction - Metals with high thermal conductivity ? also have
high electrical conductivity ? - Wiedemann-Franz Law
- where L is predicted to be a constant for all
metals
24Thermal Conductivity of Metals Callister Table
20.1
Metals
2.79
4.05
2.50
? ? 100 Wm1K1
for many metals, L is within 15 of predicted
value
25Charge, Heat Mass Transport
- Ficks first law
- Fouriers law of cooling
- Ohms law
- current density (charge flux)
- electrical conductivity
- electric field (voltage
gradient)
OGN eq. 23.4
26Electrical Conduction Macroscopic View
Callister 19.2
- Current density, conductivity, electric field
- resistance of material
- voltage drop across material
- current through material
- ? Ohms law
?? electrical conductivity ?? electrical
resistivity
Callister Figure 19.1
27Electrical Conduction Microscopic View
Callister 19.2
? nezµ
- ?? electrical conductivity
- n concentration of charge carriers
- e charge on an electron
- z valence of charge carriers
- µ mobility of charge carriers
?1m1Cm1V1s1 m3 C m2V1s1
a constant
z1 for electrons and holes, 2 for O2 ions,
(1, 2, )
- This expression holds for all substances
- Electrical conductivity varies by gt22 orders of
magnitude in ordinary materials - If material has more than one type of charge
carrier
, because of differences in n and µ
28Electrical Mobility of Metals Callister 19.8
- Effect of deformation on µ
- Dislocations (regions of deformed material)
scatter carriers, increasing the electrical
resistivity by
29Electron-Hole Pair Formation
- Thermal energy ? some electrons are excited from
the valence band into the conduction band ?
conduction electrons - This leaves an empty state in the valence band
a hole - n concn of condn e
- p concn of holes
- Intrinsic semiconductorelectrons and holes
formin pairs, - Conductivity
Callister Figure 19.6
30Electrical Conduction in Intrinsic Semiconductors
Callister 19.10
- Intrinsic semiconductors (no impurities)
Note µe usu. gt µh
Callister example problem 19.1
31Electrical Conductivity in n-type Semiconductors
Callister 19.10
- If concn of donors Nd gtgt ni, pi then n ?? Nd
an n-type extrinsic matl
Callister Figure 19.12
32Electrical Conductivity in p-type Semiconductors
Callister 19.10
- If concn of acceptors Na gtgt ni, pi then p ?? Na
a p-type extrinsic matl
Callister Figure 19.14
33Electrical Conductivity in Semiconductors
Callister 19.10
- Can obtain Eg from intrinsic region
- Slope of ln(n) vs. 1/T is Eg/2kB
Callister Fig. 19.16
34Callister Table 19.1
35Callister Table 19.2
36Electrical Conductivity in Insulators Callister
19.15-16
- Ionic materials
- Often electrical insulators low electrical
conductivity - Charge carriers can be
- Ions
- Electrons or holes
- Ionic valence
- Mobility based on diffusivity
- Electrical properties of polymers
- Most are insulating
- Conducting polymers as high as
37Wiedemann-Franz Law Callister 20.4
- In metals
- Conduction electrons are responsible for both
electrical and thermal conduction - Metals with high thermal conductivity ? also have
high electrical conductivity ? - Wiedemann-Franz Law
- where L is predicted to be a constant for all
metals
38Thermal Conductivity of Metals Callister Table
20.1
Metals
2.79
4.05
2.50
? ? 100 Wm1K1
for many metals, L is within 15 of predicted
value
39Materials Cycle
- Raw materials
- Synthesis
- Engineered materials
- Product design
- Applications
- Waste
- Recycle / reuse
- Solid waste / landfill
- If biodegradable a new natural resource
40Life Cycle Assessment of a Product
41What Materials are Recycled?
- Metals
- Lead (Pb) e.g., lead batteries
- Aluminum (Al) e.g., aluminum cans
- Iron/steel (scrap metals)
- Gold, silver, platinum (e.g., contacts in
electronic devices) - Rubber and plastics
- PET and polycarbonates e.g., plastic bottles
- Tires
- Synthetic textile fibers
- Glass
- Food containers
- Paper
- Newspapers, cardboard boxes, etc.
42Ref http//www.icmm.com/gmi_conference/
433BrianWilsonPresentation.pdf
43Materials Cycle Environmental Considerations
- The earths materials are a closed system, not an
infinite reservoir - Each step in the materials cycle consumes energy
- In order of increasing energy consumption
- Reduce amount of material used
- Reuse existing material
- Recycle existing material
- Produce new material from natural resources
- Each step in the materials cycle produces
byproducts - Solid waste litter landfills
- Liquid waste water pollution
- Gaseous waste air pollution
- Health impact
- Control of toxic materials (Pb in solders Cr
volatile organics )
44Thermodynamics Remelting Aluminum
- Estimate energy needed to remelt 1 kg of aluminum
cans - Assumptions
- Cans are pure Al Start at room T
Remelt at Tm of Al - Input
- Tm,Al 933 K cP,Al 900 J kg1 K1
?Hf,Al 10.5 kJ mol1 - AWAl 26.98 g mol1
- Energy needed to heat solid Al to melting point
cP,Al(Tm,Al room T) - Energy needed to melt solid Al at melting point
?Hf,Al/AWAl - Answer
45Thermodynamics Reduction of Alumina
- Estimate energy needed to extract 1 kg of Al from
Al2O3 - Assumptions
- T 298 K Process is 100 efficient
- Input
- ?G (given above) AWAl 26.98 g mol1
- Answer
Vs. 961 kJ/kg to remelt used Al 30? as much
energy