failure analysis

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failure analysis
enabling

• an introduction to

ULTRAPOL advance
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TOPICS

• About ULTRA TEC
• Polishing machinery - history
• ULTRACOLLIMATOR Technology
• A New Generation Polisher
• Apps Topside
• Apps Cross-section
• Apps Backside
• Recap

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ULTRA TEC About Us

• Supplying precision sawing, lapping and polishing
  equipment for 30 years
• Supplied F.A. industry for 15 years first as
  OEM manufacturer
• Also active in comms., optical, medical
  compound semiconductor industries
• Approached by F.A. engineers / microscope
  suppliers to produce workable solutions for
  sample prep.

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ULTRA TEC other key products
ASAP-1
MULTIPOL
ARC-lite
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ULTRAPOL advance
Evolution



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ULTRAPOL advance
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ULTRAPOL advance
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Alignment Methods
MECHANICAL
OPTICAL
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What is the ULTRACOLLIMATOR System?

• The Ultracollimator system is a Patent Pending
  system that provides for an advanced technique to
  ensure planar polishing for various failure
  analysis applications.

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Comparison of Mechanical vs. Optical Parallelism
Alignment
Improvement due to optical alignment
Typical accuracy of measurement
Calibration measurement device
- -
1 to 2 microns
Mechanical indicator
10x to 20x
0.1 microns
ULTRACOLLIMATOR Die size 9mm
5 to 10x
0.2 microns
ULTRACOLLIMATOR Die size 9 to 18mm
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Is the Backside of Wafer Parellel to the topside?

• Yes! At standard wafer TTVs, the sine of the
• Subtended Angle is extremely small.

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ULTRACOLLIMATOR Technology

With the use of light, the Ultracollimator is
able to accurately adjust for tilt. By observing
light reflecting off the surface of the chip, the
guess work of adjusting for tilt is eliminated.
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Intuitive Design
Alignment made easy by simply aligning the beam
reflection to the cross hairs to ensure
parallelism of sample to polishing surface.
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Tilt Effects

• The wafer chip can be tilted within the package,
  which is introduced during manufacturing.
• Mounting the sample onto the sample holder for
  sample preparation may also introduce tilt.
• Wax mounting
• Clamp mounting
• The fix?!? ULTRACOLLIMATOR.

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Correcting for Tilt
The Ultracollimator can easily correct this
problem.
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ULTRAPOL advance
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ULTRAPOL advance
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ULTRAPOL advance
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ULTRAPOL advance
Dual Coolant Modes
FAUCET - control Coolant runs to drain
Recirculating Pump Coolant saved
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ULTRAPOL advance
Removable Tray Easy to keep clean Avoid
cross-contamination
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ULTRAPOL advance
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ULTRAPOL advance
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ULTRAPOL advance
Setting Polishing Pressure
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ULTRAPOL advance
Quick Release Interface allows for fast movement
of sample between polisher and microscope
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Improving Polishing Planarity
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The Complete System

• ULTRAPOL advance equipped with the
  Ultracollimator offers versatility for
• - Topside Deprocessing / Planar polish
• - Backside Preparation
• - Cross-sectioning

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APPLICATIONS - TOPSIDE
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ULTRAPOL advance
SEM STUB Fixture Holders so far for Philips,
Hitachi SEMS FEI FIB For single die
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TOPSIDE - Delayering Example Whole Die (12
image stitch)
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TOPSIDE - Delayering Example 2
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TOPSIDE - Delayering Example 3
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APPLICATIONS - BACKSIDE
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BACKSIDE

• Suits Applications where SAP not needed, rapid
  Silicon Removal is required
• e.g.-- Flip Chip
• -- Wafer Section
• Rapid Polish with Lapping films colloidal
  silica

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BACKSIDE - Decap to allow alignment
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APPLICATIONS - CROSS-SECTIONING
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CROSS-SECTIONINGSingle Die optical fixture
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CROSS-SECTIONING Single Die optical
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CROSS-SECTIONING Quick Release Vise - 1
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CROSS-SECTIONINGQuick Release Vise - 2
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TOPICS

• About ULTRA TEC
• Polishing machinery - history
• ULTRACOLLIMATOR Technology
• A New Generation Polisher
• Apps Topside
• Apps Cross-section
• Apps Backside
• Recap

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Other Information
TEC Note6
Catalog
BIG ONLINE RESOURCES PAGE
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For more information

• Visit www.ultratecusa.com
• Contact us _at_ Tel [phone]
• e-mail info_at_ultratecusa.com
• Call one of our team of representatives or
  distributors

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failure analysis
enabling

• an introduction to

ULTRAPOL advance