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UWB Market Research

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Realtek Semiconductor Corp. has developed compact low-power CMOS RFIC ... Realtek UWB CMOS RFIC Transceiver Features: Compact design: ... – PowerPoint PPT presentation

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Title: UWB Market Research


1
UWBMarket Research Bill Lee
2
UWB Related Organizations
3
UWB Related Players
4
Integrated Circuits
http//www.alereon.com/solutions/ics/
AL4300 Ultrawideband Media Access Controller (MAC)
AL4200 Ultrawideband BaseBand Processor (BBP)
AL4100 UWB Analog Front End (AFE)
5
Evaluation Kit
http//www.alereon.com/solutions/devkits/evk/
6
http//www.artimi.com/products/index.html
  • Dual Mode Wireless Power Line.
  • Single monolithic chip UWB device, the RTMI-100,
    in 0.18 micron silicon germanium (SiGe) BiCMOS
    process.
  • The digital portion of the device is implemented
    in CMOS and the high
  • frequency section is implemented in SiGe.
  • Samples of this product will be available Q2 2005.

7
http//www.freescale.com/webapp/sps/site/overview.
jsp?nodeId02XPgQhHPR0220
  • UWB Chipset  Key Features   
  • Data rates of 29, 57, 86 and 114 Mbps
  • Support for IEEE 802.15.3 streaming media
    protocol
  • Enables wire-like high definition video
    applications -200 mW 3.3V power consumption for
    battery-powered products
  • Co-exists with 802.11b/a/g, Bluetoothª
    technology, GPS and all United States-based
    wireless systems
  • Built using low-cost 0.18 µm CMOS and SiGe
    technology

8
(No Transcript)
9
http//photonics.ga.com/uwb/index.html
AspenTM 2000
10
http//www.realtek.com.tw/
  • Realtek Semiconductor Corp. has developed compact
    low-power CMOS RFIC transceiver for UWB
    applications.
  • Realtek UWB CMOS RFIC Transceiver Features
  • Compact design
  • ncludes all essential and peripheral RF
    functions.
  • Only external crystal and antenna needed to
    complete RF module for embedded and add-on
    applications.
  • Small chip size
  • UWB CMOS RFIC Transceiver achieves a die size
    five to twenty times smaller than WLAN devices.
  • High data rates
  • MBOA (Multi-Band OFDM Alliance)
    standard-compliant prototype system delivers
    480Mbps and provides data throughput more than
    ten times that of state-of-the-art WLAN systems
    such as IEEE 802.11a/b/g.
  • Complete UWB solution on a single chip
  • Implemented in standard CMOS logic process,
    enabling true single-chip UWB solution.
  • Low power 100mW
  • Consumes around 100 mW while delivering 480Mbps,
    providing energy-efficient wireless communication
    solutions.

11
http//www.staccatocommunications.com/
  • Staccato Communications develops true single-chip
    all-CMOS silicon fully integrated into complete
    module products to enable low cost, small form
    factor, low and efficient power consumption
    480Mbps Wireless USB connectivity.
  • Single-chip CMOS design and packaging approach
    which absorbs critical RF interfaces as an
    integral part of the package mask set to reduce
    size and eliminate surface mount components.
  • Fully integrated solutions for Wireless USB
    applications. Module features integrated RF
    transceiver, baseband, MAC, 32-bit RISC
    processor, memory, and I/O functionality based
    upon the MultiBand-OFDM specifications and
    WiMedia Convergence Architecture.
  • Intended to simplify the design-in process and
    manufacturability, the small form factor module
    integrates low cost true single-chip silicon
    based upon advanced 0.13um all-CMOS architecture.
  • UWB Module expected to sample in early 2005.

12
Chip Antennas Taiyo Yudens Materials Science
Expertise Develops Worlds First Ceramic Chip
Antenna for Ultra Wideband (UWB) Technology
13
http//www.wisair.com/
14
Digital Living Network Alliance
http//www.dlna.org/home/
  • Align industry leaders in CE, mobile, and PC
    industries through digital interoperability.
  • Industry collaboration is not limited to just CE,
    mobile, and PC manufacturers.
  • Entire ecosystem of companies that together offer
    consumers a broad set of complementary products
    and services.
  • Ecosystem properly designed for digital
    interoperability starts with consumer in mind and
    includes contributors that can help bring all
    necessary elements of digital home network to
    market.
  • Industry collaboration encompasses manufacturers,
    software and application developers, and service
    and content providers.
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