GSRC Annual Symposium - PowerPoint PPT Presentation

About This Presentation
Title:

GSRC Annual Symposium

Description:

What are relevant bounds, and how do they evolve? ... SCAMPI: SCalable Advanced Macro Placement Improvements. Variety of macro sizes & shapes ... – PowerPoint PPT presentation

Number of Views:28
Avg rating:3.0/5.0
Slides: 24
Provided by: Len65
Learn more at: https://vlsicad.ucsd.edu
Category:

less

Transcript and Presenter's Notes

Title: GSRC Annual Symposium


1
System-Level Living Roadmap
  • GSRC Annual Symposium
  • September 28 29, 2006
  • Faculty Kahng, Markov, Orshansky, Sylvester

2
System-Level Living Roadmap
  • Only cost-effective technology innovations reach
    production
  • What are relevant bounds, and how do they evolve?
  • What are quantified benefits from available
    technology options?
  • Beyond-ITRS what are system implementation
    roadblocks?
  • System-level design optimization and scaling
  • What are the relevant models and metrics for
    system scaling?
  • Early analysis tools
  • Map technology concerns (power, variability,
    speed, area, ) to system concerns (total cost,
    availability, )
  • Roadmaps
  • Connect applications to design and process
    technologies ?
    well-calibrated cost and resource tradeoffs

3
Roadmap of Parametric Yield Estimation and
Optimization TUNES
Variability Data
Technology / Circuit Data
Fmax Variability
SER Macromodeling
Statistical Clock Skew
4
Roadmap of Parametric Yield Estimation and
Optimization Block-Level Probabilistic
Power-Delay Exploration
  • Variability greatly impacts leakagepower and
    parametric yield
  • Exponential dependency on process
  • Package often sets power limits
  • Cooling costs grow rapidly for higher power

Cooling/Power Limit
Switching Power
Number of Parts
Minimum Ship Frequency
Power
Design Spread
Slow
Fast
Max Ship Freq (With Leakage)
Max Ship Freq (No Leakage)
5
Roadmap of Parametric Yield Estimation and
Optimization Block-Level Probabilistic
Power-Delay Exploration
  • How much parametric yield loss can be recovered?
  • DAC-05 Best Paper Robust LP, second-order conic
    programming for sizing / dual Vth
  • Efficient, large-scale parametric yield
    maximization
  • Designer chooses sweet spot in power-delay space,
    trades timing yield for power yield, etc.
  • E.g., 5 timing yield loss ? 25 less power

6
Roadmap of Reliability Impact of Dynamic
Reliability Management
  • TDDB, EM, thermal cycling, NBTI with dynamic
    stress inputs
  • PID threshold control solution
  • DRM voltage control
  • Boosts/throttles maximum assignable voltage
  • 25 peak performance with typical
    workload/temperature
  • 12-15 peak performance ? workloads
  • 10-12 peak performance ? temperature
  • Future directions
  • Parametric performance degradations vs. hard
    failures
  • Sensor architecture and placement
  • ElastIC A system-level adaptive architecture

7
Roadmap of Reliability Efficient Soft Error
Analysis and Optimization in Combinational Logic
  • Proposed algorithm considers injection,
    propagation, and merging of SET descriptors
    (capturing correlation between transient
    waveforms and rate distribution function) in
    STA-like fashion
  • Waveform models based on Weibull, 1-time
    characterization cost
  • Highly efficient runtime linear with gates
    (25K gates in 0.2sec)
  • Accurate 15 error in FIT
  • vs. Monte-Carlo SPICE
  • Used in SER optimization
  • Gate sizing flip-flopassignment shows 28X SER
    reduction with nodelay penalty and 5 area
    overhead
  • Runtime 1 minfor 5K gates

8
Roadmap of Reliability Bottom-Up Reliability
Prediction
  • Pulse Generation
  • Library Output Waveform f(Collected
    Charge)
  • System-level analysis requires
  • Precise gate electrical properties
  • Logical structure of the circuit
  • System-level timing behavior
  • ? Electrical, logical, and timing window masking
  • Cell library characterization
  • Intractability (P) of logical masking
  • Pioneered use of decision diagrams in this
    context
  • DATE-05 Best Paper award
  • Three new static SER analysis tools

Vth
Y
0
PW
CL
A0
B1
  • Pulse Propagation
  • Library Output Waveform
    f(Input Waveform)

Y
Vth
Vth
A
CL
0
PWin
B1
9
Roadmap of Reliability Fast Analysis of Soft
Error Susceptibility (FASER) for Cell-Based
Designs
  • Fast analytical modeling and computational
    technique for logic SER analysis for cell level
    designs
  • Excellent accuracy compared to SPICE
  • Best Paper Award, ISQED 2006

10
Roadmap of Reliability System Susceptibility to
Soft Errors Memory Modeling
  • Memory arrays much more sensitive to single event
    upsets
  • Developed first analytical model for predicting
    SER noise margins under dynamic disturbances
    (single event upsets)

11
Roadmap of Reliability Synthesis for
Reliability and Probabilistic Testing
  • Optimize reliability usingrecent competitive
    synthesis frameworks
  • Allow or veto logic transformations
  • Using ABC from Berkeley
  • Probabilistic test
  • Take deterministic patterns
  • Compute multiplicitiesusing a reliability
    evaluator
  • Evaluating 4 GSRC reliability evaluatorsand two
    more
  • Figure out which work !
  • Use in estimation
  • Use in synthesis and optimization
  • Use in circuit test

New project withAir Force Research Lab
12
Roadmap of Power and Variability Energy-Optimal
Gate Sizing for Subthreshold Circuits
  • Subthreshold energy efficiency is limited by
    leakage
  • Energy optimal supply voltage, Vmin, determined
    by rise in leakage
  • At Vmin, leakage accounts for 30 of total
    energy
  • Increasing gate sizes along critical paths can
    reduce energy
  • Shorter clock period shorter leakage time
  • A reduction in leakage affects the location of
    Vmin therefore, Vdd can be reduced if leakage is
    reduced
  • An energy-driven, TILOS-like sizing algorithm
    yields energy savings of 6-15 on ISCAS85
    benchmarks

15 energy reduction
6 energy reduction
13
Roadmap of Power and Variability Design
Assessment under Realistically Available
Uncertainty Descriptions
  • In practice, detailed process characterization
    data for current and future generations are not
    available
  • Only partial probabilistic descriptions are
    accessible, e.g., mean and variance
  • Timing, power, and parametric yield estimates are
    affected
  • Probabilistically-enhanced interval analysis
  • Use mean, variance, and intervals of circuit
    parameters to estimate probabilistic bounds for
    timing and power
  • Probability box bounds for cumulative
    distribution function

14
Roadmap of Power and Variability
Intra-Gate Biasing
  • Exploit edge effects in modern MOSFET devices
    that lead to different Ion/Ioff current densities
    based on position in channel
  • Key lengthen channel near edges to suppress high
    leakage there, reduce Ldrawn in center slightly
    to compensate
  • FREE circuit-level leakage reduction on the order
    of 5-6
  • No delay penalty or optimization cost
  • An orthogonal knob to all other circuit
    optimization techniques

15
Roadmap of Cost Low-Volume Implementation
  • What can be recovered along cost trajectory of
    Moores Law?
  • OPC, reticle plan, multi-layer reticle strategy,
    multi-flow production strategy, wafer shot map,
    blading, mask write and inspect, dicing plan,
    ? many
    optimization opportunities
  • Goal 10X reduction in per-die cost for low
    volume

16
MFMLMP Reticles
  • A reticle has multi-layers of multi-projects of
    multi-flows
  • Different printing frames for different wafers
  • More design challenges layer assignment, flow
    embedding and frame floorplan

Die 1 Lay 3
Die 2 Lay 3
Die 1 Lay 3
Die 2 Lay 3
Reticle 1
Die 1 Lay 2
Die 2 Lay 2
Frame
Die 1 Lay 1
Die 2 Lay 1
Die 1 Lay 1
Die 2 Lay 1
Die 1
Die 2
Die 1
Die 2
Reticle 2
Wafer 1
Wafer 2
Example of MFMLMP Reticles Layer 2 of Die 1
and Die 2 cannot share the same reticle
17
GSRC On-Line MFMLMPR Designer
  • Flexible Handles all known practical design
    constraints
  • Fast Interactive solver to minimize
    manufacturing costs
  • Graphical viewing of output
  • Co-developed with, used at Cypress Semiconductor
    for MFMLMP Reticle design

Define Parameters
Input Data
Output
18
Roadmap for Physical Implementation QOR
  • Delay, Power large part in interconnect
  • Growing problem with every technology node
  • Spatial embedding becomes more critical
  • Unpleasant surprises at first spatial
    embedding(industry many RTL designs are found
    infeasible)
  • Early planning for distances, shapes and sizes
  • Manual planning has hit the complexity limit
  • System must co-evolve with its spatial embedding
  • Embedded memories, IPs, analog/RF,
  • Vertically-consistent spatial embedding
  • Consistent objectives and optimizations through
    multiple levels of abstraction
  • Smooth transitions between design steps, with
    gradual refinement
  • Support for design optimizations such as
    high-level and RTL synthesis

19
Vertical Consistency (1)
  • SCAMPI SCalable Advanced Macro Placement
    Improvements
  • Variety of macro sizes shapes
  • Look-ahead, macro clustering,obstacle evasion
  • FlooristFloorplan Assistant(constraint-driven
    FP repair)

red overlap
blue block movement (no overlap)
20
Vertical Consistency (2)
  • Physically safe logic restructuring
  • Top-down whitespace buffer area allocation
  • Support for design optimizationsvia selective
    re-embedding (below)
  • More direct optimization of routed net lengths
    (ROOSTER), at several
    design steps

Legalize
Improve
21
SLLR Theme Posters
  • Parametric Yield Estimation and Optimization
  • Eric Karl, Dennis Sylvester and David Blaauw
    Multi-Mechanism Reliability Modeling and
    Management in Dynamic Microprocessor-Based
    Systems
  • Scott Hanson, Dennis Sylvester and David Blaauw
    A New Technique For Jointly Optimizing Gate
    Sizing and Supply Voltage in Ultra-Low Energy
    Circuits
  • Saumil Shah, Dennis Sylvester, Andrew Kahng and
    Youngmin Kim Intra-Gate Channel Length Biasing
    for Transistor-Level Circuit Optimization
  • Roadmap of Reliability
  • Bin Zhang and Michael Orshansky Evaluating
    Reliability of On-Chip SRAM Arrays using Dynamic
    Stability Analysis
  • Rajeev Rao, Vivek Joshi, David Blaauw and Dennis
    Sylvester Efficient Soft Error Rate Computation
    and Circuit Optimization Techniques to Mitigate
    Soft Errors in Combinational Logic
  • Wei-Shen Wang and Michael Orshansky Yield
    Estimation under Realistic Descriptions of
    Parameter Uncertainty
  • Roadmap of Cost
  • Andrew Kahng and Xu Xu A General Framework for
    Multi-Flow Multi-Layer Multi-Project Reticle
    Design
  • Roadmap of Physical Implementation QOR
  • Jarrod Roy and Igor Markov Vertically-Consistent
    Spatial Embedding of Integrated Circuits and
    Systems
  • Roadmap of Power and Variability
  • Andrew Kahng, Swamy Muddu and Chul-Hong Park A
    Scalable Auxiliary Pattern-Based OPC Strategy for
    Better Printability, Timing and Leakage Control
  • Andrew Kahng and Swamy Muddu Design-Centric
    Modeling and Optimization of BEOL Interconnect
    Stacks
  • Andrew Kahng, Kambiz Samadi and Puneet Sharma
    Study of Floating Fill on Interconnect
    Capacitance
  • Andrew Kahng and Kambiz Samadi Nanometer Era CMP
    Fill for Variability Reduction
  • Andrew Kahng and Puneet Sharma CMP Fill for
    Reduced STI Variability
  • Andrew Kahng and Swamy Muddu Predictive Modeling
    of Systematic Intra-die Variability

22
Toward System Scaling Theory
  • Future Scaling
  • Driven by system constraints
  • Non-determinism size impact mediated by power
    density, redundancy overhead, low yield,
    increased comm overhead
  • System-level overdesign and effective transistor
    density
  • Performance is achieved by multi-core
    architectures running at lower frequencies
  • Adaptivity/reliability ? many transistors are
    used to diagnose and tune
  • Power trades off with design time
  • Impacts of concurrency, spatial embedding,
    application domain,
  • Traditional Scaling
  • Driven by min feature size
  • Determinism size directly impacts performance
    and density
  • FO4-based performance metric
  • Transistors are either logic or memory
  • Cost not discussed (e.g., design TAT, leakage
    current from Tox scaling, )

23
Future GSRC Modeling and Metrics SIG
  • Enable system design to comprehend impact and
    feasibility of technology options
  • Variability, power, cost
  • Reliability, flexibility, resilience
  • Initial focus uncalibrated, variational
    scaling models
  • Priority modeling requests from system-level
    design and GSRC sponsors
  • X increase in reliability requires Y increase
    in power?
  • X (transient hard) fault coverage can be
    achieved with lt Y area overhead?
  • How to measure efficiency and yield in the
    presence of failures?
  • Approximations Abstractions ? block models
    for system optimization
  • Future system scaling is dominated by silicon
    non-idealities
  • Variability and reliability will fundamentally
    change density, power, speed, cost scaling laws
  • Long-term goal a new system scaling theory
Write a Comment
User Comments (0)
About PowerShow.com