Wirebonding for TOB and TEC

1
Wirebonding for TOB and TEC

• Susanne Kyre
• University of California, Santa Barbara

2
Wirebonding

• Equipment and Personnel
• Scale of the project
• Bonding times
• Bond quality
• TEC
• Outlook

3
Equipment and Personnel

• Equipment
• KS 8090 wirebonder
• KS 8060 wirebonder (receive end of January)
• Dage 3000 pulltester
• Stereo microscope
• Precision measuring microscope
• Personnel
• 1 main wirebond technician (Julie Stoner)
• 1 backup wirebond technician (Andrea Allen)
• In the process of hiring a second wirebond
  technician
• 1 support technician (David Staszak)

4
Scale

• UCSB will build 4000 Modules with about 10
  million wirebonds (that is 3 times the amount of
  wirebonds done in all of CDF All of UCSBs
  wirebonding for BaBar was 150,000 bonds, we will
  do that in a week)
• Full production TEC and TOB
• 15 Modules per day
• 30 Hybrids per day

5
Bonding times

• Starting point Bond centers had bonding times of
  up to 40 minutes with about 10 bonds that didnt
  stick and needed to be rebonded
• Wirebond programs now bond an entire Module or
  Hybrid (previously had separate programs for each
  row of bonds), reduced bonding time by 50
• Wirebond programs for all Module and Hybrid types
  now use pattern recognition (bonding time
  reduction by about 2-3 minutes)
• Pure bonding time for a module lt 5min, for a
  hybrid lt 4min (CMS record)
• Additional time (set up, database entry, pull
  testing)
• 11min for a module, 8min for a hybrid
• Total processing time can be reduce by using a
  support technician
• Actual bonding times during mini production run
• 2.5 hours for 10 modules (one technician)

6
Bond quality

• CMS wirebonding spec pull strength gt 6g
• Extensive pull testing was done to determine a
  set of standard bonding parameters for each
  bonding surface
• Hybrids
• We pull test 10 bonds on a test area on each PA
• Average pull strength 10.0 g, std. Deviation
  0.6g

7
Bond quality

• Modules
• First 20 parts of each type, pull test every 50th
  bond
• PA to Sensor bonds
• Average pull strength 9.9g, std. Deviation 0.7g
• Sensor to Sensor bonds
• Average pull strength 8.2g, std. Deviation 0.8g

8
Bond quality

• 79 Modules and 92 Hybrids bonded so far
• Faults introduced during bonding
• 1 pinhole (first TEC module) out of 84000 bonds
• Shorts 1 repaired short on a hybrid
• Open channels 13 on modules, 5 on hybrids
• Bad channels introduced in bonding 0.034 for
  modules, 0.012 for hybrids (historically 0.5
  2)

9
TEC production

• We will do TEC Ring 5 and 6 Module production
• TEC Module and Hybrid wirebonding
• All fixtures for Rings 5 and 6 are designed
• TEC Ring 6 module carrier and wirebond fixture
  were built and tested
• Wrote program and wirebonded 4 Ring 6 modules
• Wrote program and wirebonded 6 Ring 6 hybrids

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Future plans

• Produce hybrid and module carriers and wirebond
  fixtures in machine shop
• Write remaining wirebond programs for TEC Modules
  and Hybrids
• Installation and set up of new 8060 Wirebonder
  (end January)
• Training of new wirebond technician (mid
  February)
• Training of wirebond technician from Mexico
• Mini production run
• 2 weeks at full production capacity of 15 Modules
  per day (start January 26)
• Production bonding!