Interconnect Focus Center ChipLevel Thermal and Power Management Workshop

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Interconnect Focus CenterChip-Level Thermal and
Power Management Workshop

• May 1, 2006

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Agenda

• 730 800 Registration and Breakfast
• 800 815 Welcome
• 815 900 Andrei Fedorov, Georgia Tech,
  Miniaturized refrigeration systems for
  sub-ambient cooling of electronics
• 900 930 Krishna Saraswat, Stanford
  University, Power/Performance Implications
• 930 1000 Chia-pin, Chiu, Intel Corp.,
  Thermal Analysis and Hot Spots
• 1000 1030 Break
• 1030 1100 David Perreault, MIT Challenges
  and Opportunities in Microprocessor Power
  Delivery
• 1100 1130 James Lu, RPI, Monolithic DC-DC
  Converters and 3D Power Delivery
• 1130 1200 Muhannad Bakir, Georgia Tech,
  Electrical, Thermofluidic, and Photonic I/O for
  3D Nanosystem Intergration
• 1200 100 Lunch
• 100 130 Ken Goodson, Stanford University,
  Nanostructured Thermal Management Materials
• 130 200 Darvin Edwards, TI
• 200 230 Azad Naeemi, Georgia Tech,
  Performance Modeling for Single and Multi-Wall
  Carbon Nnanotube Interconnects
• 230 300 Ali Shakouri, UCSC, Microscale
  solid-state cooling and thermal characterization
• 300 315 Break
• 315 445 Breakout Session Drivers 12
  The role of Research Vehicles
• Rizwan Bashirullah High Speed I/O Modules
• Krishna Saraswat on Metrics for Driver 1

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Research Vehicles Needed?

• Scope of Focus Centers
• Many Exploratory Projects
• Critical Road Blocks
• 1 Some Maturing Concepts
• 2 1 No Mature Projects
• 3 2
• 4
• Role of Research Vehicle
• Provide Structures Provide Context and Framework
• And Metrics to Address Integration Issues w/o
  Overstepping