ATLAS MDT Electronics Responsibilities, Costs

1
ATLAS MDT ElectronicsResponsibilities,Costs
Schedule
Mezz
HedgeHog
CSM
ROD
MDT
AMT
ASD
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Design Responsibilities

• HedgeHog Boards
• Barrel Pavia (HV), Rome III (signal)
• EndCap MIT (HV), Boston U (signal)
• ASD Chip - Boston U and Harvard
• AMT TDC Chip - KEK
• Mezzanine Boards - Harvard and Boston U
• Chamber Service Module - Michigan
• ROD - NIKHEF

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Production Responsibilities

• HedgeHogs (common production by CERN)
• HV - INFN (all types)
• Signal - Boston (EndCaps), Chamber-Builders
  (Barrel)
• ASD - Boston U and Harvard
• AMT-TDC - KEK
• Mezzanine Boards - Harvard and Boston U
• Chamber Service Module - To Be Determined!
• ROD - (Freiburg, Munich LMU, Munich MPI)
  20, Nijmegen 41, Saclay 33, JINR 6

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Core Cost Estimate

• HedgeHogs (32,000 HVsignal) 1,892 kCHF
• (assumes common CERN production)
• AMT-TDC (16,000) 1,330 kCHF
• Mezz Boards (16,000) 2,433 kCHF
• (includes 45K ASD chips)
• Patch Panels 382 kCHF
• (replaced by Mezz -gt CSM cable assemblies)
• Off Chamber Electronics 1,682 kCHF
• (does NOT include CSM)

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Cost Estimate Issues

• HedgeHogs Common production at CERN of all types
  now being planned to reduce costs.
• ASD Current HP quote is 375K 600 kCHF, but
  production must be finished before HP phases out
  process.
• Mezz Boards Quote for US production is 1,875K
  3,000 kCHF gt CERN prod. is being investigated.
• Patch Panels No longer needed, but individual
  Mezz -gt CSM cables (16,000) may cost more.
• CSM estimate for 1,320 modules is 1,221K
  1,950 kCHF, however, funding source NOT yet
  determined!

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Production Schedule
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Mod-0 (10k) Test Schedule