Thin and Thickfilm Integrated Circuits

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Thin- and Thick-film Integrated Circuits
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Characteristics of the Film Integrated Circuit

• The general Characteristics of both Thin-film
  and Thick-film ICs are similar to those of
  Monolithic ICs although they differ in many
  respects.

• Both are not formed within a semiconductor
  wafer, like the Monolithic IC, but instead on an
  insulating substrate such as glass or an
  appropriate ceramic material.

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Characteristics of the Film Integrated Circuit

• ONLY passive elements, such as resistors and
  capacitors, are formed on the insulating surface.

• The active elements, such as transistors and
  diodes, are added as discrete elements to the
  surface of the structure ONLY after the passive
  elements have been formed. (these active elements
  are usually produced through the Monolithic
  process).

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Important Differences Between the Monilithic and
Film Circuits

• Film Circuits use Evaporation or
  Cathode-sputtering techniques in forming the
  passive components and the metallic conduction
  pattern while Monolithic Circuits employ
  Silk-screen techniques.

• Film Circuits can be produced with a higher
  range of values and lower tolerances compared to
  monolithic Circuits.

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Important Differences Between the Monilithic and
Film Circuits

• Film Circuits are larger and have more elements
  than the Monilothic Circuit.

• Film Circuits are much more expensive due to
  the bigger number of elements it utilizes.

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End of Slide Show !!!
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