AMS 02 Electronics

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AMS 02 Electronics

• CERN 01 Aug 03

0900 Introduction
M.Capell 0915 M-Crate Cryocooler electronics
M.Capell 0930 PIT results
X.Cai Status at CSIST of 0945 Crate
Mechanics Manufacturing CS Lin 1000
PCB Manufacturing GD Lo 1015
Production Schedule YL
Lin 1030 NSPO QM J, JT, and JPD TV Test Prep.
JR Tsai 1045 Tracker Thermal Electronics
J. van Es 1100 Electronics Weight
M.Capell 1110 Electronics/Radiator
Weight reduction M.Molina
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Current Accommodation
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Electronics Mechanics

• QM crate design finished.
• J, JT, JPD, T, U, R QM crates built at CSIST,
  CIEMAT, Karlsruhe.
• Positive results from J-Crate TVT
• Revisions for flight blocked by crate/radiator
  negative margins.
• TPD, UPD QM design finished.
• Under fabrication at Karlsruhe.
• Needs test positive margins.

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M - Crate
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P. Trampus/CARSO G. Viertel/ETH
MPD (TMPD)
LVDS Parallel Bus 16 Data 8 Address 3 Control
DTS Dallas Temperature Sensor
A
B
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M-Crate Design by CGS, manufacturing at
ETH Backplane by Waclaw Karpinski Module address
coding on the backplane MPD MPD now combined
with TPD gtgt TMPD USCM Front panels
50 made in Taiwan, 50 TBD by Alexei
Lebedev Only CAN bus connector on front panel,
DALLAS connector on request USCM flight modules
from RWTH will be sent to CERN (Alexei Lebedev) 4
USCM test set-ups from RWTH 3 to CERN, 1 to ETH
Proposed dioding
5 V
5 V
USCM B
USCM A
lt Other 5 V consumers gt
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• GPSE
• Generic electronics designed by V.Commichau to
  specifications by A.Lebedev.
• Detailed design, implementation awaiting
  selection of GPS unit (if any).
• MCE
• 4 pairs of three dimensional B-field sensor and
  PT100 on the empty tracker positions
• on layer 3, 4, 5 and 6.
• Sensors on standard tracker PCB mounted on
  thermal bar
• Tracker cable (AMS02new K cable) and connectors
  used
• Cable path to be studied (proposal all cables
  in z direction) to the M-Crate
• Cable connectors on the MCE board
• MCE board Digital part designed by Volker
  Commichau, analogue part by Ulf Roeser

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AMS02 B-Field Sensors
HPvG
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Paolo Trampus ASTE
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• CryoCooler (Ulf Roeser)
• April 2003 TIM Meeting
• Agreement with GSFC about CryoCooler Hardware
• No final agreement about a new IVD (old IVD
  version from June 2001)
• April 2003 Aachen III
• Development of the CryoCooler Interface Module
  CCIF 2, which can be
• qualified to become a flight version
• May 2003 ETH
• Market screening about radhard components.
  Conclusion delivery time to
• long for a one step development
• Input for crate design will take more time (first
  electronic design to be
• finished)
• June 2003 Aachen III / ETH
• Decision about two step development
• Electronic hardware with non-flight components
  and non flight connectors
• without crate
• Soon after we start software development and GSFC
  could work on
• calibration of CERNOX (cryo temperature) sensors,
  EMC issues and
• procedures

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• CryoCooler (Continued)

• Distribution of work
• CCPA POWA DIGO
• POWA Power Amplifier, according to last
  prototype tested at GSFC
• (Hanspeter von Gunten)
• DIGO Digital Opto Interface for CCIF2 (Ulf
  Roeser)
• CCMO Reduced version of final CCMO (for one
  CryoCooler and
• DCCCOSCI (from Volker Commichau), also Ulf
  Roeser)
• Address coding on the CCEB crate backplane
• CCEB crate mechanics Design by CGS (via M.
  Capell)
• Manufacturing at ETH

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• CryoCooler (Continued)

• Set up consists of the following components
• One USCM on motherboard in slot B, slot A is
  preliminary used for CCIF2
• DIGO interfaces control signals to POWA
• POWA delivers monitor signals into CCMO
• CCMO conditioned additionally cryo T sensors for
  USCM (ADC inputs)
• Excluded are the DC/DC converters, which have to
  be ordered from MDI
• (5V and dual /-15V or triple module, TBD)
• Oscillators are not on the preflight CCMO, the
  prototype
• oscillator developed at Aachen III can be used
  for the test.
• Open Points
• LMCO fuses, protection and isolation issues
  (Paul Nemeth)
• GSFC updated IVD, sensor connector assignments