Historical trends and future projections for the

1
Historical trends and future projections for the
minimum feature size used in integrated circuits
in manufacturing
NTRS National Technology Roadmap of
Semiconductors
2
Future projections for silicon technology taken
from SIA NTRS
3
Basic process
Light
Photoresist
Mask
Deposition Film
Substrate
Film Deposition
Photoresist application
Exposure
Development
Etching
Resist removal
4
What is CMOS ?
W
TiSi2
TiSi2
Ti
TiSi2
P
P
N
N
P-
P-
N-
N-
N-Well
P-Well
P
PMOS
NMOS
5
Why needs Scaling?
L
tox
W
L30nm, tox1nm _at_IEDM2002 Toshiba, Sony

• (1) Ids ? W/L x C x (Vg-Vth)2
• ?High Current drive
• (a) Low Power (b) High Speed
• (2)Small Chip Area
• ? Low Cost, High Yield

Silicon
Oxygen
particle
Chip Size 1/2
Yield ¾75
Chip Failure