Loop doc for Sen-Sen bonds from Fermilab - PowerPoint PPT Presentation

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Loop doc for Sen-Sen bonds from Fermilab

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When the issue of sparking arose, in November 2005, we changed our TOB ... In theory the encapsulate material (Dow Corning Sylgard 186) gives a factor of 5 ... – PowerPoint PPT presentation

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Title: Loop doc for Sen-Sen bonds from Fermilab


1
Loop doc for Sen-Sen bondsfrom Fermilab
  • Lenny Spiegel
  • Jan 30th, 2006

2
FNAL Sen-Sen bonds
3
FNAL Sen-Sen bonds
  • When the issue of sparking arose, in November
    2005, we changed our TOB sensor-sensor signal
    bond profile to increase the height of outer
    sensor bonds above the n implant. At the same
    time we eliminated 2 out of 6 sensor-sensor bias
    bonds, which were at the same height as the
    signal bonds. Thus we have two profiles1.  A
    "square" profile for the first 76 of TOB modules
    constructed at FNAL.                   loop
    height                 505 microns              
         n critical clearance   140 microns outer
    sensor (sensor 2)2.  A "triange" profile for
    the last 24 of TOB modules.                  
    loop height                 513
    microns                   n critical
    clearance   286 microns outer sensor

4
FNAL Sen-Sen bonds
  • In both cases we are using the first set of bond
    pads on the sensors (unlike UCSB which switched
    to second set for their outer sensors when they
    changed profiles in November 2005). Also, in
    reporting the above numbers I have subtracted
    the 25.4 micron diameter of the bonds from the
    microscope focus measurements as this gives a
    better indication of the clearance distance.
    Finally, it should be understood that the above
    numbers are averages obtained from a limited
    sample of measurements and that there is a fair
    amount of variation, so that some n clearances
    are around 100 microns or less.I've enclosed a
    picture of the "square" profile don't have one
    of the "triangle" profile.We are starting a
    program in the US to encapsulate all
    sensor-sensor bonds (including the bias bonds)
    for ALL TOB (and TEC) modules assembled here. In
    theory the encapsulate material (Dow Corning
    Sylgard 186) gives a factor of 5-6 improvement on
    air - for large gaps (2cm). In practice we find
    it difficult to show that the encapsulant buys
    more than a few hundred volts in the maximum
    operating voltage. However, a few hundred volts
    is still significant and, in any event, we have
    started the process.
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