Ondrej Kvasnicka, Michal Tom

1
Status of Si - sensor prototyping for CALICE

• Ondrej Kvasnicka, Michal Tomášek,
• Jirí Popule, Václav Vrba
• Institute of Physics, AS CR, Prague

2
Outline

• Sensor tile outer dimensions
• Sensor pre-prototype production
• Tests outlines
• Conclusions

3
Sensor tile outer dimensions

• 4 high resistivity wafers
• tile side 62.00.0
• -0.1 mm
• scribe line 100 ?m
• scribe safety zone 200 ?m
• guard ring width cca 750 ?m (cca 1.5 wafer
  thickness)
• The dead zone width is
• about 1 mm

1.0 mm
Wafer book keeping information
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Pre-prototyping

• using existing masks
• elaborate the technology process of sensor
  fabrication
• estimate the quality of sensors
• evaluate some effects of high resistive silicon,
  guard rings, scribe lines, etc.
• we used following input material
• wafers thickness
  ?m
• 5 SSP Wacker 530
• 5 DSP Topsil 500
• 5 DSP Topsil 300
• 5 DSP Topsil 250

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Pre-prototyping
Active area cca 0.25 cm2
Wafer diameter 100 mm Wafer backside all Al
metallized
6
Tests outlines

• Diode tests
• a) C-V curves
• determination of Vfull-depletion and resistivity
  Vop Vfull-depletion 50 V.
• b) I-V curves
• Vbreak-down ? Vop
• Ileak _at_ Vop lt cca 30 nA/cm2

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Topsil 300 mm - 12 k?cm
Ufd 20 V
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Topsil 250 mm - 3 k?cm
Ufd 50 V
9
Topsil 500 mm - 12 k?cm
Ufd 55 V
10
Wacker 530 ?m - 5 k?cm
Ufd 110 V
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Summary and next steps

• A lot of pre-production sensors has been produced
  at the Czech producer Tesla Sezam. Their
  depletion voltages and currents satisfy TESLA
  demands
• Mechanical assembly and tests with electronic
  chips will follow.