Subproject: Soft Lithography and SelfAssembly SLASA

1
Subproject Soft Lithography and Self-Assembly
(SLASA) The SLASA subproject develops large
area, low-cost nanopatterning processes making
use of soft elastomeric patterned stamps and
self-assembly techniques. The focus lies on soft
UV NIL and microcontact printing (µCP). Soft UV
NIL allows nanopatterning on wafer scale in a
single imprint step at room temperature and at
low imprint pressures (lt1 bar). µCP uses
elastomeric stamps to transfer an ink pattern to
a substrate. The scope of inks applied extends
from small molecules (alkanethiols) over
biomolecules, dendrimers, and polymers to even
nanoparticles. Self-assembly methods are explored
to complement and optimize large area patterning
with functionalized nanoparticles. Applications
for the methods developed in the SLASA subproject
are foreseen in sensors, diagnostic devices,
photonics, photovoltaic and post-CMOS electronic
devices.
Soft UV-NIL
Microcontact printing (µCP)
µCP of a double gradient of proteins for bio-chip
applications, BSA-FITC in green, BSA-Cy3 in red.
EVG620 tool for soft UV molding
µCP of stretched ?-DNA complexed with a
fluorescent conjugated polyelectrolyte (scale bar
15 µm).
µCP of oligonucleotides for bio-chip applications.
Imprinted high resolution pattern (left) and
optical ring resonator structure (right).
Heavyweight dendrimer inks with low surface
diffusion enable high resolution µCP with high
pattern fidelity (100 nm wide lines).
Contact Heiko Wolf (hwo_at_zurich.ibm.com)