Readout of a TPC with the MEDIPIX2 CMOS chip as direct anode

1 / 13
About This Presentation
Title:

Readout of a TPC with the MEDIPIX2 CMOS chip as direct anode

Description:

fiducial surface 100 mm x 100 mm, thickness 50 m. ... a total fiducial sensitive area of. 14.08 mm x 14.08 mm. Each pixel is equipped ... –

Number of Views:26
Avg rating:3.0/5.0
Slides: 14
Provided by: harry157
Category:

less

Transcript and Presenter's Notes

Title: Readout of a TPC with the MEDIPIX2 CMOS chip as direct anode


1
Readout of a TPC with the MEDIPIX2 CMOS chip as
direct anode
Saclay/Dapnia P. Colas Y. Giomataris
NIKHEF A. Fornaini H. van der Graaf J.
Timmermans J. Visschers CERN/MEDIPIX2 E.
Heijne Univ. Twente/MESA J. Schmitz
2
Our GEM-equipped TPC We have constructed a small
test TPC equipped with three GEM foils which can
be read out by means of the MEDIPIX2 CMOS pixel
sensor. The GEM foils were obtained from the
CERN/Sauli/GEM group hole-to-hole distance
(hexagonal geometry) 140 µm, hole diameter 85
µm, fiducial surface 100 mm x 100 mm, thickness
50 µm.The drift volume (vol. 100x100x100 mm3) is
surrounded by square wire loops, spaced 6.3 mm,
put at decreasing potential. Three GEM foils are
placed 7.4 mm behind the plane of the bottom wire
loop the distance between GEM foils is 1.6
mm. The anode plane, at ground potential, is 6.6
mm below the third GEM foil.
3

In the base plate of the chamber, a hole was cut
out for the MEDIPIX2 chip its pixel surface was
flush with the (anode plane) base plate plane.
The MEDIPIX2 chip contains 256 x 256 square
pixels with pitch 55 µm x 55 µm giving a total
fiducial sensitive area of 14.08 mm x 14.08 mm.
Each pixel is equipped with a low-noise charge
preamp, discriminator, two threshold DACs, a
13-bit counter and communication logic.Since a
triggering system had not been implemented, we
operated the MEDIPIX2 sensor by enabling the
counters manually, and stop the counting after a
pre-set time interval (0.1 - 10 s). After that,
the counts of each pixel are read out.
Top Drifter                      5700 V
Bottom Drifter                3473 V
Top GEM 1                     2813 V
Bottom GEM 1               2462 V
Top GEM 2                     1876 V
Bottom GEM 2               1524 V
Top GEM 3                       938 V
Bottom GEM 3                 586 V
Drift length 100 mm Distance between GEMs
1.6/2.6 mm Distance bottom GEM/MEDIPIX 6.6 mm

4
First events, recorded on March 29, 2003. Drift
space irradiated with 55Fe quanta
5
No source exposed 0.01 s
No source exposed 2 s
No source exposed 2 s
Feb 9, 2004
Fiducial field 14 x 14 mm2
Collected ionisation in 14 x 14 x 100 mm3 during
exposure time
No source exposed 0.1 s
90Sr source exposed 0.01 s
6
Dean Karlen VRVS meeting Sept 17, 2003
7
August 2002 Jeju, Korea Dean Karlen calculation
of diffusion constants Kirsten Sachs
measurment offset 500 ?m in drift versus
diffusion Sept 2003 VRVS meeting Dean Karlen
Diffusion/defocussing too large at small drift
distance Induced charge effect not ruled out
8
(No Transcript)
9
Anode strip
Scope
55Fe
Test Pulse (edge)
10
  • Possible explanation for charge widening
  • Electrons end up in low E-field region
  • Electrons are either caught by drift field or
    diffuse to low field regions
  • Electrons may migrate to regions associated with
    adjascent GEM holes

11
  • Conclusions
  • - We have readout a TPC with triple GEM by means
    of a monolitic pixel chip as
  • direct anode
  • The distribution of the electrons leaving a GEM
    hole is much wider
  • than the hole pitch. This may be explained by
    a large fraction of the
  • avalanche not traveling straight to the anode,
    but arriving much later,
  • after an effective de-focusing effect.
  • Due to the charge spread, the signal per pixel
    is very small, and the combination
  • of three GEMs and the MediPix can not detect
    single primary electrons
  • - We expect much better results from a
    Micromegas/Pixel sensor combination

12
Thanks to NIKHEF Wim Gotink Joop
Rovenkamp Jouri Ad Berkien, Frank de Zwart Edward
Berbee, Ton Boerkamp Saclay Arnoud
  • Short term plans
  • Micromegas/Pixel sensor tests
  • Construction of Micromegas in post-wafer
    process
  • definition of TimePix CMOS chip

13
(No Transcript)
Write a Comment
User Comments (0)
About PowerShow.com