Title: GSFC Integrated Avionics (SE Seminar Briefing)
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9GSFC Integrated Avionics(SE Seminar Briefing)
- Jaime Esper / 592
- Jaime.Esper_at_nasa.gov
- 11/5/2007
10GSFC Integrated Avionics
- Integrated avionics refers to the space mission
end-to-end and commands either internally, or
between users/electronic system (software and
hardware components) used to exchange and process
data systems either on the ground or in space. - The Mission Integration and Demonstration
Facility (MIDF) has been proposed as a means to
accomplish the integration of avionics components
within GSFC under a single roof. It is composed
of at least three major parts The
Communications, Standards and Technology
Laboratory (CSTL), The Goddard Mission Systems
Evolution Center (GMSEC), and the Vehicle
Avionics Integration Laboratory (VAIL). - MIDF improves our abilities in several areas,
including evaluation and verification of
end-to-end architectures, systems, and standards,
and our ability to streamline integration, test,
and processing of spacecraft.
10
11Mission Integration and Demonstration Facility
Overview
- The MIDF combines all elements of a space mission
within a single roof - Includes Space Segment Components
On-board electronics
(traditional avionics) - Command Data
Handling / Navigation Attitude Control
- Communications InterfaceFlight
softwareInterface Standards (plug-and-play
preferable) - Includes Ground Segment ComponentsGround
system - Mission Control -
Interface to Science Center or distributed
facilities - World-Wide-Web leverage for
distributed operations (VPN) and/or public
access - Communication interfacesGround
station network (incl. TDRSS, GSTDN)Interface
Standards (plug-and-play)
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12MIDF is a Plug-and-Play Facility (Long-Term
Perspective)
- The aerospace community is moving toward
plug-and-play open interfaces (non-proprietary).
This allows for cross-platform compatibility and
enhanced customer choices. - Flight projects would bring their on-board
electronics and application software for
integration and test within an end-to-end mission
environment. Lower-layer software,
communications infrastructure, and
(plug-and-play) interfaces will be already in
place. - No need to re-create ground segment components.
These will be already available as well.
Depending on the approach chosen, these items
may be integrated into the MIDF from a remote
location.
12
13MIDF Laboratories
- Incorporate
- Mission Control Lab / GMSEC (MCL)
- Vehicle Avionics Integration Lab (VAIL)
- Communications Standards Technology Lab (CSTL)
- Other Laboratories as technology requires
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14A Mobile Implementation of VAIL
- VAIL can have several implementations. One
possibility is to use a Rover as a platform on
which to integrate flight-like avionics systems. - Its mobility serves an operational demonstration
that is in-line with the MIDF approach realistic
scenarios on which to test mission-level systems. - One such demonstration can be the operation of
the Rover (VAIL) in a hostile environment (South
Pole), commanded using the GMSEC framework,
through the lines and interfaces of the CSTL. - This scenario also serves as a means to
demonstrate the South Pole Delay-Tolerant Network
(DTN) a developing protocol intended to bridge
between two network regions by translating
between incompatible network characteristics and
acting as a buffer for mismatched network delays. - This has been developing to service the US
Station at the Geographic South Pole and is
applicable to future Exploration applications of
local and wide-area networks using wireless and
other means of communication.
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15SpaceCube Robotic Presentation
- by Gordon Seagrave
- GSFC (301) 286-0522
16PROCESSOR (SCuP) SLICE OVERVIEW
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19What is SpaceCube?
- Completely Reconfigurable Super Computer for
Space - Small footprint 4 x 4 x 3 inches
- Low Power
- High Processing Engine 4 x PPC405 _at_ 450MHZ
- Commercial parts Low cost
- Rapid Development Digikey parts and MiniCube
fit onto flight board pads - Configurable I/O LVDS/SpaceWire or RS422
- Flexible / Stackable Architecture
20Core Space Cube Capabilities
- SPECIFICATIONS
- CENTRAL PROCESSORS
- 4 x 450 MHz PowerPC 405, 32-bit RISC processors
- 2 x Xilinx XC4VFX60
- Redundant to handle SEFI
- 32K bytes of secondary (L2) on-die cache
- Common Processor Features are-
- 700 DMIPS RISC core
- 32-bit Harvard architecture
- 16 KB 2-way set-associative instruction and data
caches - Auxiliary Processor Unit (APU) controller
- 1.2V core voltage
- RECONFIGURABLE RESOURCES
- 2 x 56,880 logic cells
- 2 x 25,280 slices
- 2 x 4,176 Kb block RAM
- 232 18K block RAMs
- Example Helion AES core
- 447 slices, 10 block RAM, 2548Mbps performance
ETHERNET CAPACITY 8 x Ethernet Media Access
Controllers IEEE 802.3 compliant 10, 100, 1000
Mb/s Supports MII, GMII Does not use any system
gates. DIGITAL SIGNAL PROCESSING 128 XtremeDSP
Slices 18-bit by 18-bit, two's complement
multiplier with full precision 36-bit result,
sign extended to 48 bits. FLASH EPROM 1 Gbyte of
Flash EPROM application storage Flash has
separate power switching. Allows Flash to be
powered off when not in use. ROM 256 Mbyte of
ROM application storage backup for
Flash SOFTWARE SUPPORT Support for Linux,
VxWorks WindRiver MontaVista GNU GCC Compiler
21Core Space Cube Capabilities
SERIAL INTERFACES 32 x LVDS serial pairs Support
Ethernet, SpaceWire, or custom interface. 16550
compatible UARTs Aeroflex LVDS drivers and
Receivers RS422 can be substituted for LVDS if
desired STACKING CONNECTOR INTERFACE Airborne
Connector 72 pins Design uses no backplane or
motherboard. Low speed internal bus 400Kbps
Redundant I2C High speed bus TBD
Redundant Power Pins 3.3V, 5V RAD-HARD
SCRUBBER UT6325 RadHard Eclipse FPGA 320,000
usable system gates 24 dual-port RadHard SRAM
modules RadHard to 300K rad(Si)/sec OTHER
PERIPHERAL INTERFACES Available through stacking
connector by additional card slices Low Voltage
Power Converter card slice Same board size as
processor Provides low voltages from spacecraft
bus voltage Has 1553 interface, transformers and
signal drivers
ELECTRICAL SPECIFICATION 21V to 35V voltage input
through optional low voltage power converter card
slice 5V_at_TBDA (typical at 450 MHz with 1 Mbits
SDRAM) 3.3V_at_TBDA 2.5V_at_TBDA all voltages are
tolerant to 10 / -10 SAFETY SDRAM power is
switched separately to handle any potential
latchup conditions. ENVIRONMENTAL
SPECIFICATION -100C to 55C (operating)
(TBR) -40C to 85C (storage) 10 to 90
Relative Humidity, non-condensing (storage)
MECHANICAL SPECIFICATION 4 inches x 4 inches
(PCB) Box slice TBD inches x TDB inches single
board, double sided I/O connectors 72 pin,
Airborne Stacking 2 x 37 pin LVDS
22Completely Reconfigurable
PPC Operating System PPC Application Code
RISC uP Application Code
Xilinx FPGA Personality
23SpaceCube Housing
- MINIMUM Avionics Configuration.
- Processor Slice (SCuP) is a CDH system on a 4 x
4 inch card.
LVPC 2
SCuP 1
SCuP 2
LVPC 1
RNS BD
- Minimum Configuration 4 x 4 x 3 inches
- Scup
- LVPC
24Stacked Architecture Allows Endless Flexibility
- SpaceCube uses a stacked architecture
- composed of cards or slices connected via a
connector running the length of the stack - Slices can be made redundant and the stacking
architecture allows any slice to communicate with
any other slice thus allowing card level
redundancy. - Custom Slices Stack onto the SpaceCube
- Processor and LVPS Slices
- Small card size (4x4 inches) means mass is
minimal. (lt2Kg for minimum configuration)
Processor
Project Module
Processor
LVPC
25Option1 PPCs work on same task
The PPCs may act as one engine performing a task
together where the outputs are voted
26Option 2 PPCs Perform Different Tasks
The PPCs may act as 4 unique engines performing
4 unique tasks where the outputs may not be voted.
27PPC405 Supported Operating Systems
- VxWORKS
- BlueCat Linex
- RTEMS
28Processor Performance
29Sand Box Resources
4 x
30 Implementation of Space Cube within a Rover
POWER
Heaters
Un-switched Power Services
SPACE CUBE (SC) AVIONICS
Power Electronics
Additional Hardware (per Rover Specification)
Battery
Sensors
Low Voltage Power Converter Discretes
Slice 1
Power
Actuators
CMD and TLM Lines
Slice 2
Firewire (1394a)
Reconfigurable Logic
Sensors
Redundant Serial busses Two high speed 100 Mbps
links / Two low speed 400 Kbps links
CDH Nav Processor
Ethernet/ Spacewire
Actuators
Cam 2
Cam 1
Navigation Cameras
Slice 3
MIL-STD-1553
Comm. Interface
ITOS / ASIST
Simulated RF Com Interfaces (Ethernet)
31Mixed Rate Ethernet Processing
Example of Mixed Rate Ethernet Processing
32Xilinx Ethernet Hub Processing
Each PPC has access to 2 RadHard Ethernet MACs
10MBit
100MBit
Example of dual speed Ethernet Implementation
33SpaceCube PackagingProcessor Slice and CCA
PROCESSOR PWB EDU, 2098673
- Designed per IPC-2222 and Fabricated per IPC-6012
- Multi-layer (18 layers) board material
construction per IPC-4101 - PWB, 2098673, size 4.00W x 4.00L x .093T (inch)
(Polyimide-glass laminate) - Up to 2 oz top bottom, and internal signal
ground planes utilized for thermal management of
components. - Maximum component heights 0.79 inch (primary
side), and 0.21 inch (secondary side)
Primary Side
- External interface thru two MIL-DTL-83518
(Micro-D) connectors - The Processor board is supported by 2 stiffeners
and 2 integral stand-offs.
Secondary Side
34SpaceCube Packaging Power Slice
Assembly(contains DCC and LVPC Boards)
LVPC Board
DCC Board
35SpaceCube Lite Overview
36SpaceCube Lite
- Low Cost
- High Speed Processing Engine
- Low Power
- 12V power source
- Battery
- Wall Wort
- Rugged
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49Delay/Disruption Tolerant Networking (DTN)
- Protocols to provide the benefits of networking
in disrupted and delayed environments - Space applications Speed of light delays and
scheduling/coverage delays (NASA/Interplanetary
Network (IPN)) - Defense applications (DARPA)
- Commercial applications intermittent wireless
links - Very active area of research within Universities,
DARPA, and NASA - See http//www.dtnrg.org
50An End-to-end Path using DTN
custody transfer
internet a
internet b
BP
BP
BP
TCP
IP
SONET
fiber
Network of internets spanning dissimilar
environments
Source Scott Burleigh (JPL)
51Store-and-Forward Networking
Relay stores data while not in view of Earth
Disruption Tolerant Networking (DTN) is an effort
to develop and standardize a message-based,
store-and-forward system with reliability,
security, and quality of service.
Relay transmits data when in view of Earth
Relay Range
52Polar Robot DTN Demonstration Scenario
Lunar Relay Satellite (LRS) TDRS
Ground Station WSC
Lunar Communications Terminal (LCT) McMurdo
Station
Mission Control GSFC
Lunar Rover Robot
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55Polar Robot Demonstration Network Topology
JHU DTN BA
DTN BA
Crater Hill Network
Rover
McMurdo DTN BA
UMD DTN BA
Rover Laptop with DTN BA
Internet
McMurdo Network
DTN BA
CSTL DTN BA
Dry Valley Network
Rover
Rover Laptop with DTN BA