Autonomous Distributed MEMS for MicroSmart Structures

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Autonomous Distributed MEMS for Micro-Smart
Structures
Yves-André Chapuis - FUJITA Lab.
(Under supervision of Pr. Fujita)
Research partners Y. Fukuta, Y. Mita
(Fabrication, Control) E. Sarajlic, M. Ataka
(Design) A. Debray (Fabrication)
L. Zhou, Y. Hervé (Modeling, France)
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Needs

• Integration of MEMS, Electronics, Intelligence
  (IC, sensors, controller)
• 3-D Hybride Integration (smaller microsystem
  size)
• Large Scale Integration MEMS (for distributed
  microsystems on-chip)
• Low-Cost Packaging Technology (Flip-Chip,
  self-assembly, system-on-PCB, ..)
• Use of Smart Materials (polymers, specific
  solders)

No Needs

• To Develop Unique and Complexe Fabrication
  Process (flexible solutions for hosting
  microsystems)

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What is Smart Technology?
Scientific Context
Smart Technology a Emerging Field

•  Not only one definition Today a system should
  be Adapting, Sensing, Unferring, Learning,
  Anticipating, Self-Organizing 

Walter DERZKO, 2006

• The use of MEMS in smart systems is so intensely
  intertwined that these technologies are often
  treated as two  faces of the same coin .

Vijay K. Varadan, et al.,  Smart material
systems and MEMS  (2006)
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Scientific Context
List of exemples of smart technology
Applications of self-assembly. (1) A 2 by 2
cross array made by sequential assembly of
nanowires. (2) Diffraction grating formed on
the surface of a poly(dimethylsilo-xane) sphere.
(3) 3-D electronic circuits self assembled from
milli-metersized polyhedra with electronic
components (LEDs). (4) An artificial,
ferromagne-tic opal prepared by tem-plated
self-assembly of polymeric microbeads.
M. B. Cohn, K. F. Bohringer, Jet al.,
Microassembly technologies for MEMS, SPIE
Micromachining and microfabrication Symposium,
1998
U. Srinivasan, et al., Selected Topics in Quantum
Electronics, IEEE Journal of, 8, 4-11 (2002).
H. O. Jacobs, A. R. Tao, A. Schwartz, D. H.
Gracias and G. M. Whitesides, Science, 296,
323-325 (2002).
C. J. Morris, S. A. Stauth and B. A. Parviz, IEEE
Transactions on Advanced Packaging, 28, 600-611
(2005).
E. P. Quevy, R. T. Howe et al. Reconstituted
wafer technology for heterogeneous integration,
MEMS'06, 2006
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Our Objectifs

• Smart Surface Device
• 3-D Multi-Layer Integration
• (MEMS/Sensors/Controllers )
• Use of Capillarity Forces
• (for self-assembly)
• Paste Liquid Solder Technology
• Reliable Process
• (no functional dommaging)
• Generic Approach
• (for multi-actuation/electronic technology )

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Our Approach Smart Surface
Flip-Chip approach using Self-Assembly technique
Flip-Chip, self-alignment, and assembly
techniques are elaborated by patterning
hydrophobic/hydrophylic area on the electronic
chip sur-face, then by warming the device to make
contact between electrodes MEMS and solder bumps.
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State of Research
Self-alignement Permanent Assembly
New Process Approach3-D Large Scale Integration
of MEMSusing capillarity force for alignment
assembly process
Achieved
3 Level Integration using Through Hole Wafer
Technology
in Progress
Bump solder technique (Paste liquid solders)

• Low-cost Technology

Achieved

• Flexible Extensible Technology