Existing Cookbook Outline

1
Existing Cookbook Outline

• Introduction (gives overview)
• Pre-modeling Steps (general guidance, needs some
  updates)
• Extracting the Data
• Spice to IBIS
• I-V and V-t
• I-V setups for CMOS, Open, ECL model types
• V-T setups for Ramp, waveform tables
• Measurement guidance
• Putting the Data Into an IBIS File (keyword notes
  at mostly Version 2.1 level and some questionable
  recommendations)
• Header information
• Component and Pin information
• Model information
• External Package (under construction)
• Verifying IBIS file
• Validating the Model (brief, should reference
  Accuracy Specification)
• Correlating the Data (brief, should reference
  Accuracy Handbook)
• Resources (wrong, needs updated)
• Appendix - Examples (five examples to be added)

2
Cookbook Options

• Michaels presentation raises fundamental
  questions
• Document missing keywords at Version 4.0 level?
• What is needed? Who does the work? Assignment of
  Sections?
• Upgrade or rewrite?
• Upgrade (based mostly on 2.1 level modeling, but
  incomplete) continue BASIC level model
  development flow with just some 3.2 features
• Requires major rewrite/many changes for technical
  content, notation, etc.
• Rewrite would require an editor or single
  primary author for consistency
• Significant changes already needed based on more
  recent presentations and understandings easier
  to start from scratch
• Easier to add new information rather than patch
  it in
• Some sections need to be removed
• Restructure for Version 4.0 level, or issue topic
  specific cookbooks

3
Other Rewrite/Organizational Options

• Several Cookbooks by topics such as
• Basic modeling at Version 2.1
• Package modeling, EBD modeling
• Advanced Features (multi-stage or Driver
  Schedule, Differential buffers, Internal
  terminations, Series/switch keywords, etc.
• Multi-lingual modeling in the future
• Advanced Specification details (Model Spec, test
  loads, timing, overshoot, etc.)
• Or follow keyword flow and annotation (minimal
  additional guidance, but large documents and
  easier to selectively expand)
• (Siemens internal document)
• 3Com documents by Roy Leventhal under training
  directory
• Tree diagram outline
• Several Cookbooks by keyword groupings (vertical
  coverage from basic to advanced)
• Header and Component
• Model (and model selector)
• Package and EBD
• FAQ Driven Topics per Lynnes topics and basic
  tutorial
• Add Descriptive Examples

4
Recommendations for Keyword Coverage Beyond
Existing Document (Add from Michaels Red List)

• Component keywords
• Diff Pin
• Pin Mapping?
• Package Model? (then need a large package model
  section)
• Model keywords
• Model Selector?
• (briefly, all Model_types)
• Model Spec?
• Driver Schedule?

5
Recommendations and References

• Decide organization for rewrite (discuss)
• Select primary editor
• Use references for Sections 5, 6.
• Roy Leventhals documents
• http//www.eda.org/pub/ibis/training/3com-docs/
• IBIS_HowToUse.doc
• IBIS_Syntax.doc
• Accuracy Handbook
• http//www.eda.org/pub/ibis/accuracy/handbook.pdf
• handbook.pdf
• IBIS Quality Committee documents
• http//www.sisoft.com/ibis-quality/
• IQ_Specification_.txt (under Documentation,
  and under development)