Fan Out Packaging Market 2028

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Fan Out Packaging Market 2028
Published on 06 Feb 2023
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Report Overview
According to market research study published by ,
the market size of the global fan out packaging
sector is expected to rise by USD 2.7 billion
with a CAGR of 17.2 by the end of 2028. This
industry report offers market estimates of the
global market, followed by a detailed analysis of
the type, carrier type, business model, and
region. The global market data on fan out
packaging can be segmented by type core-fan out,
high-density fan out, ultra high-density fan out.
Among these, the high-density fan out segment was
accounted for the highest revenue generator in
2021. Fan out packaging market is further
segmented by carrier type 200 mm, 300 mm, Panel.
The 300 mm segment is estimated to account for
the largest share of the global fan out packaging
market. Based on business model, the fan out
packaging market is segmented into foundry,
integrated device manufacturer (IDM), outsourced
semiconductor assembly and test (OSAT).

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Table Of Contents

• Part 1. Summary
• Part 2. Introduction
• Study period
• Geographical scope
• Market segmentation
• Part 3. Fan out packaging market overview
• Part 4. Market breakdown by type
• Core-fan out
• High-density fan out
• Ultra high-density fan out
• Part 5. Market breakdown by carrier type
• 200 mm
• 300 mm
• Panel

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By Region
United States
Europe
China
Rest of the world
Japan
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Market Size
Expected to reach 2.7 billionUSD by the end of
Forecast year
2028
2022
Base year
CAGR 17.2 (2022 - 2028)
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lobal-fan-out-packaging-market-2028

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