mechanical dicing san jose

1
Mechanical Dicing Services in San Francisco
2

• When looking for a mechanical dicing San
  Francisco company, look for a company that
  specializes in a specific process. These
  companies can cater to the needs of a variety of
  customers, from contractors to homeowners. For
  more information, read the following article. We
  will look at the DBAD method, plasma dicing,
  Stealth laser dicing, and optimized saw process.
  Each of these methods is effective for specific
  types of projects.

3
DBAD method

• The DBAD method for mechanical dicing is used to
  cut thin hard-brittle materials such as SiC
  wafers. The laser pulse duration is 750 fs and
  scanning speed is 3000 mm/s. Its precision-single
  pulse energy and focus depth can be precisely
  controlled. The laser is particularly useful for
  extending internal cracks that form due to
  thermal stress.

4
(No Transcript)
5
Plasma dicing

• In terms of cost, plasma dicing may not be the
  most cost-effective option. It may be impractical
  to implement in the backend of a fabrication
  process, and it may not be able to handle
  commonly encountered metals. In addition, plasma
  dicing can cause issues with production and
  throughput. In this article, we will discuss the
  advantages and disadvantages of plasma dicing and
  how it differs from other mechanical dicing
  methods.

6
Stealth laser dicing

• While there are many applications for stealth
  dicing, few studies have explored how it is
  applied to MEMS devices. MEMS devices often
  develop edge chip cracks and the authors of a
  paper on the topic found that laser processing
  had the greatest influence on the die's stress.
  The results showed that proper dicing is
  essential for these thin, delicate membranes.
  Here are some of the applications for stealth
  mechanical dicing.

7
Optimized saw process

• Optimized saw process for mechanical dicing San
  Jose - a new concept in machining technology
  based on high-speed rotary cutting. With the
  increased speed of rotary cutting, the team has
  improved surface chipping performance while
  reducing the abnormal base. To further improve
  the efficiency, the team is working on developing
  a saw process with a combination of laser and
  mechanical disciplines.

8
Laser grooving

• If you need to make a precise and clean cut,
  laser grooving can be of great help. The process
  is based on ablation, which consists of
  high-intensity laser pulses that change into
  thermal, photochemical, or electrical energy. As
  a result, neutral atoms, molecules, and ions are
  ejected explosively. This process results in
  etching on the surface of the material. The level
  of ablation will depend on the type of material
  being worked on.