3D ICs Market

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3D ICS MARKET ANALYSIS

• 3D ICs Market, By End-Use Sectors (Consumer
  electronics, Information and communication
  technology, Transport (automotive and aerospace),
  Military, Others (Biomedical applications and
  RD)), by Substrate Type (Silicon on
  insulator(SOI), Bulk silicon), by Fabrication
  Process ( Beam re-crystallization, Wafer bonding,
  Silicon epitaxial growth, Solid phase
  crystallization), by Product (MEMS and Sensor, RF
  SiP, Optoelectronics and imaging, Memories (3D
  Stacks), Logic (3D Sip/Soc), HB LED) and by
  Region (North America, Europe, Asia Pacific, RoW)
  - Size, Share, Outlook, and Opportunity Analysis,
  2020 - 2027

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• Market Overview
• The global 3D ICs market is estimated to
  account for US 38,252.9 Mn in terms of value by
  the end of 2027.
• Market Dynamics Drivers
• Increasing demand for efficient solutions is
  expected to drive growth the global 3D ICs market
  during the forecast period
• Rising adoption of portable devices is expected
  to propel the global 3D ICs market growth over
  the forecast period

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Figure 1. Global 3D ICs Market Share (), in
terms of Value, By Region, 2019
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• Market Dynamics Restraints
• High cost associated and testing issues are
  expected to restrain growth of the global 3D ICs
  market during the forecast period
• Lack of foundries and assemble houses is expected
  to hinder the global 3D ICs market growth over
  the forecast period

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• Market Opportunities
• Advent of big data analytics can present
  lucrative growth opportunities
• Collaborations among market players can provide
  business opportunities

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Figure 2. Global 3D ICs Market Value (US MN),
2017 - 2027
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• Market Trends
• Multi-chip packaging is a major trend
• IntSim is another major trend

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• Global 3D ICs Market - Impact of Coronavirus
  (Covid-19) Pandemic
• Due to Covid-19 pandemic, many industries
  witnessed significant shift in their business.
  There is significant impact on the growth of 3D
  ICs market. As manufacturing operations are
  temporarily suspended across many countries to
  contain the coronavirus.
• Competitive Section
• Key players operating in the global 3D ICs market
  are Taiwan Semiconductor Manufacturing Company,
  Ltd., MonolithIC 3D Inc., XILINX, Inc., Elpida
  Memory, Inc. (Micron Technology, Inc.), The 3M
  Company, Ziptronix, Inc., STATS ChipPAC Ltd.,
  United Microelectronics Corporation, and Tezzaron
  Semiconductor Corporation.

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