Flip Chip Technologies Market

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Flip Chip Technologies Market

• Publish By- Accurize Market Research

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Global Flip Chip Technologies Market is Estimated
to Reach 54 Billion by 2024

• Global Flip Chip Technologies Market report
  published by Accurize Market Research forecast
  that the global market is expected to reach 54
  billion by 2024 growing at a CAGR of 9.2 from
  2017 to 2025. By geography, Asia Pacific and
  North America are expected to grow at a CAGR of
  XX and XX, respectively, during the forecast
  period.
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• High demand for miniaturization high-performing
  electronic devices to drive the market
• Improved performance capabilities of flip chip
  technology, high demand for computing,
  mobile-wireless, and consumer applications, and
  high demand for miniaturization high-performing
  electronic devices are few factors boosting the
  growth of the global flip chip technologies
  market. Though, low customization options may
  hamper for the growth of the market. However,
  high demand of sensors in electronics devices
  would provide various growth prospects for the
  market in the forecast period.

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Market Segmentation

• Global Flip Chip Technologies Market is split
  into bumping technology, packaging technology,
  packaging type, industry vertical, and geography.
  The bumping technology segment is divided into
  copper pillar, solder bumping, gold bumping
  other bumping technologies. Packaging technology
  segment is comprised of 3D IC, 2.5D IC and 2D IC.
  The market is further segmented by packaging type
  as flip chip SiP package, flip chip LGA package,
  flip chip PGA package, flip chip BGA package, and
  wafer level packagingCSPnl. Industry vertical
  segment is divided into industrial, electronics,
  automotive transport, healthcare, IT
  telecommunication, aerospace and defence, and
  other industry verticals.

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Market Segmentation

• North America, Europe, Asia-Pacific and rest of
  the world (RoW) are the geographical segments of
  the market. North America is further bifurcated
  into countries namely U.S., Canada and Mexico.
  Europe covers countries like Russia, U.K.,
  Germany, France, Italy and Rest of Europe.
  Asia-Pacific countries include China, India,
  Japan, South Korea and Rest of Asia Pacific. Rest
  of the World (RoW) covers South America, Africa
  and Middle East.
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Copper pillar accounted for the largest market
share in the bumping technology segment

• Copper pillar accounted for the largest market
  share in 2017, in the bumping technology segment.
  This is due to its benefits like high efficiency
  compatibility with bond pads, and noticeably
  low cost than other methods. 2.5D IC accounted
  for the largest market share in 2017, in the
  packaging technology segment.
• Asia-Pacific dominated the global market with the
  highest market share over the forecast period
• Asia-Pacific conquered the global flip chip
  technologies market with largest market share of
  49.3 in the year 2017. It is expected to
  continue its dominance during the forecasted
  period, due to booming market for semiconductors
  electronic devices in this region.

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Top players in the market

• Major companies operating in the market include
• ASE group
• Samsung Electronics Co
• Powertech Technology Inc
• Siliconware Precision Industries Co Ltd
• United Microelectronics Corporation
• Intel Corporation
• Amkor Technology Inc
• TSMC
• Jiangsu Changjiang Electronics Technology Co Ltd
• Texas Instruments Inc
• Amkor Technology Inc.

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