Global System in Package Market

1

• Global System in Package Market is expected to
  reach 11.26 Billion by 2024 from 5.44 Billion in
  2016 at
• 9.5 CAGR of (Detailed analysis of the market
  CAGR is provided in the report).
• Global System in Package Market
• Global System in Package Market is divided in six
  key market segments that include
• By Packaging Technology
• By Package Type
• By Device
• By Packaging Method
• By Application
• By Geography

The System in Package is a technique used in
latest mechanizations for packaging of small or
microelectronic bits bounded in a single module.
This Integration of microelectronic bits
increases the performance of the device and also
helps in reduction of the production cost. The
System in Package mostly adopted in various
applications in consumer electronics,
telecommunications and automotive due to its
enhanced efficiency and durability. Global System
in Package Market is mainly driven by rising
demand in the semiconductor packaging industry
for efficient electronic devices with high
performance and durability. Due to variation in
some physical properties like thermal expansion
of electrical components used in packaging with
respect to material of ICs, is considered to be
drawback of in system in package technology,
which restrains the growth of Global System in
Package Market. The report has addresses and
analyzed the Global System in Package Market by
five key geographies i.e.
2

• North America
• Europe
• Asia-Pacific
• Middle East Africa
• Latin America
• APAC region is going to emerge as one of the
  faster growing market in forecast period followed
  by North America and Europe.
• Key Highlights
• Assessment of market definition along with the
  identification of key players and analysis of
  their strategies to determine the competitive
  outlook of the market, opportunities, drivers,
  restraints and challenges for Global System in
  Package Market during the forecast period
• Complete quantitative analysis of the industry
  from 2016 to 2024 to enable the stakeholders to
  capitalize on the prevailing market opportunities
• In-depth analysis of the industry on the basis of
  market segments, market dynamics, market size,
  competition companies involved value chain.
• Global System in Package Market analysis with
  respect to packaging technology, packaging type,
  device, packing method , application and
  Geography to assist in strategic business
  planning.
• Global System in Package Market analysis and
  forecast for five major geographies North
  America, Europe, Asia Pacific, Middle East
  Africa, Latin America and their key regions.

3

• Research Methodology
• The market is estimated by triangulation of data
  points obtained from various sources and feeding
  them into a simulation model created
  individually for each market. The data points are
  obtained from paid and unpaid sources along with
  paid primary interviews with key opinion leaders
  (KOLs) in the market.
• KOLs from both, demand and supply side were
  considered while conducting interviews to get the
  unbiased idea of the market. This exercise was
  done at the country level to get the fair idea of
  the market in countries considered for this
  study. Later this country-specific data was
  accumulated to come up with regional numbers and
  then arrive at the global market value for Global
  System in Package Market.
• Key players in Global System in Package Market
  are
• Amkor Technology Inc.
• TriQuint Semiconductor Inc.
• KLA-Tencor Corporation
• China Wafer Level CSP Co. Ltd
• ChipMOS Technologies Inc
• STATS ChipPAC Ltd.
• IQE PLC
• Deca Technologies
• Siliconware Precision
• AOI Electronics
• Tongfu Microelectronics

4

• Semiconductor foundry players
• Outsourced semiconductor assembly testing
  services players
• Integrated device manufacturers
• Research institutes and organisations
• Integrated circuit designers
• System in package manufactures
• The scope of the Global System in Package Market
• The research report segments Global System in
  Package Market based on packaging technology,
  packaging type, device, packing method,
  application and Geography.
• Global System in Package Market, By Packaging
  technology
• 2-D IC Packaging
• 2.5-D Packaging
• 3-D Packaging
• Global System in Package Market, By Packaging
  type

5
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