Success Story of PCB Assembly Trend

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Success Story of PCB Assembly Trend
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• With the onset of 1900s, the novelty of printed
  circuit boards got started with a profound
  concept of constructing an electrical path on an
  isolated surface of a board. The initial trend of
  printed circuit board got into a vain to develop
  and upgrade the radios and gramophones. Gradually
  the notion of Through Hole Technique came into
  picture to produce a double sided PCB.

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• In mid 1990s the idea of auto assembly process
  was introduced by PCB manufacturer, USA. This was
  a point of modern touch to enhance the
  fabrication process with automated soldering
  technique. The research and development picked up
  a pace for end to end electronic solutions for
  the defense and US army.

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• Most of the major inventions with respect to
  printed circuit boards were a core concentration
  of US PCB market. The strides to up gradation in
  the fabrication process of PCBs marked great
  developments in the electronic world. From high
  speed digital and analog designs to high layer
  count boards to high pin count BGA with different
  fabrication methods like electro mechanical
  assembly, cable harness assembly, box build
  assembly and backplane assembling process noted
  demand of customized PCBs in all dominant
  industries.

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• With the cutting edge competition, there has been
  a great challenge for the PCB manufacturers to go
  for newer inventions in the market and
  differentiate themselves from the whole chunk.
  This can be a highlight to one of the inventions
  of CiP (Circuits in Plastic) which is a new
  technique for providing electronic manufacturing
  solutions wherein the eco friendly approach is
  adopted to go for PCB fabrication process with
  slim and sleekness in the PCB.

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• Nowadays common advanced methods adopted by the
  printed circuit board manufacturer are the
  state-of-the-art-techniques by using surface
  mount technology, integrated circuits and
  hybrid circuits assemblies. With dynamic
  methods of PCB manufacturing there has been a
  wide range of different types of PCBs designed
  as per the requirements of the customers. The
  flexibility in the techniques of fabrication is
  with respect to the PCB profiling, micro drilled
  holes, material thickness, surface finishing and
  solder mask capabilities.

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• Things are now becoming in great demand from
  jumbo versions to miniaturization with the
  origination of nano technology. Since a decade
  ,there has been a high application of the state
  of art technique to create different types of
  PCBs with nano scale spheres consisting of high
  performance materials, radio frequency
  applications, HDI ( High Density Interconnect )
  technology, LCD ( Liquid crystal display) and LED
  ( Light- emitting diode) technology .

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• With this the hypothesis for a new approach to
  customization was noted to provide a rare of a
  kind of PCB manufacturing service to the
  customers. There was a mark of revisions in the
  functional designs and layouts with high end
  customizations in the printed circuits mechanized
  in the multilayered boards. The concept of
  customization was embraced for the PCB
  requirements for the aircrafts, defense,
  telecommunication, pharmaceutics, robotics and
  other industries that required flexible
  electronic solutions.

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• The PCB assembly methods used by the fabricators
  majorly are the box build assembly, cable harness
  assembly and rigid/flex PCB assembly. Many of the
  industries are now demanding for the complete
  turnkey solution right from material procurement,
  designing, prototyping to shipping the order.
  This has made the PCB manufacturers to provide
  flexi solutions to its customers with respect to
  the complete turnkey solution and consigned PCB
  Assembly.