Cinzia Da Via S' J' Watts Manchester

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Atlas FP Detector Design
Cinzia Da Via/ S. J. Watts Manchester

• Existing Forward Physics detectors in Atlas
• The 220m, 420m insertions ? AFP
• Connection Cryostat at 420m
• Common 220-420m devices
• Movable beam pipe
• Environment RF pickup, Radiation levels
• Tracking detectors
• Timing detectors
• Alignment
• Reference timing
• Services and Installation
• Planned Tests 08
• Production Timescale-sensors

For the FP420 Detectors data can be found in the
status report
Maris Abolins Alexander Kupco
janusz.chwastowski_at_ifj.edu.pl Paul Colas
Wladyslaw Dabrowski Danuta Kisielewska
dasilva_at_lpnhep.in2p3.fr Cinzia Da Via David
Salek DEGERLI Yavuj SEDI eric delagnes
genat_at_lpnhep.in2p3.fr Lidia Goerlich
ioa_at_hep.saclay.cea.fr kapusta_at_lpnhep.in2p3.fr
Patrick Le Du Milos Lokajicek Pierre Lutz
boon_at_hep.saclay.cea.fr Piotr Malecki Oldrich
Kepka Fabienne Orsini Per Grafstrom Robi
PESCHANSKI krzysztof.piotrzkowski_at_fynu.ucl.ac.be
Mariusz Przybycien Rafal Staszewski
michael.rijssenbeek_at_stonybrook.edu Pavel
Ruzicka schoffel_at_hep.saclay.cea.fr Mikocki
Staszek Stefan Ask Hasko Stenzel
tomas.sykora_at_mff.cuni.cz Marek Tasevsky
tic_at_fzu.cz turnau_at_chall.ifj.edu.pl Vaclav
Vacek Alice Valkarova juranek_at_fzu.cz Vaclav
Vrba Keith Potter pilko_at_hep.man.ac.uk,
genat_at_aol.com
RP 220 mailing list
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From P. Grafstorm, Saclay May 08
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AFP uses LHC beam-line as a spectrometer Proton
energy loss results in proton trajectory horizonta
l departure
V. Avati/ Totem
V. Avati/ Totem
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At 420m design of new connection cryostat
14m long on each side of IP1
Modified connection cryostat
T. Renaglia (Cern TS/MME) D. DAttola (Torino) K.
Potter (Manchester) V. Parma, R. Verness (Cern
AT/MCS)
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Common 220m and 420m features movable beam pipe
From K. Piotroskovki
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Details of the movable beam-pipe from K.
Piotrskowski Louvain)
Details of the movable Beam-pipe during the 2007
test beam
300 mm window Louvain
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Environment at 420 RF pickup and radiation levels
Number of protons hits per year due to
the Process pp?pX for 20 fb-1 integrated luminosit
y Simulation of radiation level with Hector J. De
Faverau, X. Ruby, K Piotrskowsi (Louvain)
With tapering no significant impact on LHC beam.
Spikes frequency outside Electronics
sensitivity (F. Roncarolo/Manchester)
Similar conditions expected at 220m
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Major Issues

• Get as close to the beam as possible.
• Hamburg Pipe Mechanics Edgeless Detector
• Radiation Hard
• One micro-radian angular resolution.
• 10 micron per station separated by 10 m
• Assembly of blades at few micron precision
• Offset by 25 micron of alternate layers
• Repeatable assembly at few micron precision
• Stable in temperature. 20-40 W per station
• Heat sink for this which will work in the LHC
  tunnel

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Detector layout for spatial resolution optimisatio
n
15o tilt cluster of 2 pixels, extra improvement
of the resolution
25mm shift
Spatial precision/layer 14 microns 10
layers/station, 2 stations 8m apart Simulation by
S. Watts/Manchester
MSangle(2mrad x sqr (thickness/X0))/layer at 7
TeV X01 radiation length ? MS0.2mrad/layer
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Tracking detectors requirements
5 super-planes, 10 layers close to the
beam Distance from the beam 10s200mm (window)
500mm (thermal worst case) 20mm (edge, etch,
align) 3.72 4mm at 420m 2mm at
220m Spatial resolution in x with shifted planes
better less than 10mm/plane S/N before
irradiation 1051 (250 mm thick substrate) S/N
after300 fb-1 integrated lumi 651 (4E) Signal
efficiency (before irradiation) 99.9 with 15o
tilt (measured in beam) equivalent to half pitch
shift Trigger capability possible with improved
spatial resolution (Dual readout) under study.
Considers using modified FE-I4 design
S. Kolya R. Thompson Manchester
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Tracking Detectors at 420m 25x5mm2
3D silicon with active edges
50mmx400mm
124.5 mm
R.Thompson S.Kolya/Manchester
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Tracking Detectors at 220m 25x10mm2 similar
design than 420m plus trigger information
J.F Genat (Saclay)
FE-I3 has an internal Fast-OR which provides A
trigger signal but without spatial information
VFAT, 128 channels developed for TOTEM Has
fast-or every 8 channels
Development under way
C. Da Via/Manchester 2G3D
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3D manufactured at Stanford By J.
HAsi/Manchester C. Kenney MBC
Full3D-Active Edge versus Planar
particle
3D
PLANAR
500 mm
p
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300 mm
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50 mm
Active edge 4mm
3D planar Vdep lt 5-10 V
50-70 V Q 1mip 24000e- 24000e- C
40-80fF 50-200fF
Simulations using FlexPDE by S. Watts
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Production status 10, 4 wafers available at
Stanford -1 bump bonded with 84 yield
Green good detectors
-32 3E ATLAS Single Chips -6 4E ATLAS Single
Chips -6 2E ATLAS Single Chips -Quarter Size
ATLAS Chips -ATLAS Test Structures -8 3E FPIX2
Single Chips -Modules Removed From Mask!
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Financial support STFC-UK for the FP420
project DOE, USA for ATLAS Upgrade
3D electrode configurations
Design and fabrication by J. Hasi, Manchester C.
Kenney, MBC at CIS-Stanford
Thickness lt250 mmgt p-type substrate 12kWcm
Baby-2E
Baby-3E
ATLAS pixel chip 7.2 x 8 mm2 2880 pixels
Atlas chip picture from Bekerle Vertex03
56 mm
10 wafers competed. Yield80 (1 wafer)
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3DAtlas pixel tracking performance
M. Mathes1, C. DaVia2, J. Hasi2, S. Parker3, L.
Reuen1, M. Ruspa4,J. Velthuis1, S. Watts2, M.
Cristinziani1, K. Einsweiler5, M.
Garcia-Sciveres5, C. Kenney6, N. Wermes1 test
beam 2006
5mm alignment
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Thickness and electrodes response
Aspect ratio D/d 191 , already 211 with
Alcatel etcher Etching time 5mm/min
sintef
stanford
250 mm
trench
Could be used for alignment
J. Hasi PhD Thesis - 2004
M. Mathes1, C. DaVia2, J. Hasi2, S. Parker3, M.
Ruspa4, L. Reuen1, J. Velthuis1, S. Watts2, M.
Cristinziani1, K. Einsweiler4, M.
Gracia-Sciveres4,K. Kenney5, N. Wermes1
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EDGE response (2003 test beam in the SPSX5 )
C. Da Vià, M. Deile, J. Hasi, A. Kok, C.
Kenney, Sherwood Parker, S. Watts, V. Avati
, VB assetti, V. Boccone, M. Bozzo,  K. Eggert,
F. Ferro, A.Inyakin, P. Jarron,  J. Kaplon,
J.J. Lozano-Bahilo, A. Morelli, H.
Niewiadomski, E. Noschis, F. Oljemark, M.
Oriunno, K. Österberg, G. Ruggiero, W. Snoeys,
S. Tapprogge.
R. Thompson, S. Kolya Super layer designs)
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Noise characterisation using the ATLAS FE-I3
chip bump-bonding IZM through Bonn University
Tests by E. Bolle, O. Rohne (Oslo)
Leakage currents before irradiation 325 pA/pixel
Noise vs Bias voltage
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Industrialisation of 3D silicon under way SINTEF
completed full3D with active edges CNM, FBK,
IceMOs progressing with alternative Designs (but
no active edges yet)
Talk presented by Angela Kok /Sintef April 2008
Wafer layout same than Stanford 2 wafers
completed Are presentely being Bump-bonded
to Atlas FE-I3 pixel chips Will be
characterised In test beams this Summer
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Timing Detectors motivation From K. Piotrskowsi
challenges
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2 approaches being used
GasTof, developed in Louvain
QUARTIC
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Test beam results from 2006-2007 From K.
Piotrskoski (louvain) and A. Brandt (UTA)
Scope analysis Very encouraging! Will continue
during The next 2 weeks in The CERN SPS/H6
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Alignment system for HP J. Pater (Manchester),
D. Swoboda (CERN). BPM and stretched wire
Calibration and alignment need to monitor the
distance from the detectors From the beam centre
per bunch (injection?) by using BPMs and external
wire Monitor of beam tilt to lt 30 mrad
Calibration possible with exclusive dimuons
At 220m Can use elastics In vertical pots
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Reference timing crucial and being investigated
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Services at 420m (D. Swoboda) should be similar
at 220m
Peltier
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Cryostat Installation will use quadrupole
interconnection teams
Detectors will be Made in modular format with
a 2mm self alignment System for easy installation
S. Kolya, R. Thompson (Manchester) D. Dattola
(Torino)
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3D silicon production 420220 cost estimate
(very rough)
420? (20 x 4) x 2spares 160 single sensors
220? (40 x 4) x 2spares 320 single sensors
horizontal 220? vertical? 480 vertical
(spares included) 20 chips/wafer (4) --? 30
wafers 2 runs 1 year (110keuros) Cost for
bump-bonding 1000euro/wafer ? 30k euros
euros Front endmcc 20k euros 160k euros
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Basic concept and nomenclature
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Recall Silicon Station Front End Mechanics
Superplane
Mcc card flexes
Silicon blade front end bearings
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Precision Chip Placement
Precision Support Structure . Prototype exists
(in Al) Front end Blade material versions
exist in silicon and Al nitride
10 off each enough for
5 superplanes Alignment jigs - last
turnplate machined in late July
- need careful setting up
- Not yet tried with real
orientation chips Bonding jigs exist test
bonding of thermal chips ok
- support issues seem solved ( chips on
rear side) - some
cleanliness problems use plasma cleaner
on flexes

Remaining Design holding frame
for holding front end readout card
jig for positioning flexes

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1. Transfer chuck aligned turnplate
2. Transfer chuck aligned turnplate
3. Chips transferred and held by vacuum 4.
Invert turnplate. Repeat for chips 34
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5. Chips 34 on second transfer chuck
6. Blade A (with Bearings) Blade B

(without inserted) in turnplate
7. Transfer chucks replaced on turnplate
8. Blade A with chips on both sides
FP420 Design Report
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Minature touch bearings
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Positioning Vacuum Chucks
Turnplate
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Cooling tests

• 2 superplanes exist with resistive chips,
  instrumented with pt100s
• ( one silicon, one Al nitride)
• Support frame, vacuum box
• 1 - Manchester ( delayed due to effort issues)
• Demonstrate can make reproducable cooling
  contacts to super planes
• whilst maintaining position accuracy
• Initial tests
• use water/glycol chiller connection to cooling
  blocks to measure Dt
• Repeat in vacuum, look at effects of nearness
  of beam window
• 2- Cern
• look at cooling plant issues, transport to
  station , feedthroughs etc
• connections to station insides

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Blade front end
Laser cut Silicon (or AlN) blade
Touch bearings
Assembled Thermal Test Superplane front end
Blades with Thermal Chips and sensors
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Support frame set up for initial cooling tests
Superplane with dummy readout card
Resistive chips simulating detector chips
Precision bearings
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Mini-Design Review - SJW/RT September 08
The current design allows the superlayers to be
positioned with suitable precision and offset
and can be dis-assembled and re-assembled. But,
concerns that about the thermal design. Will this
be reliable ? We will test this in the next few
weeks. Meanwhile, a second idea is being worked
on. Heatsink integral to the superlayer design.
But how to make a flexible thermal link to this ?
Alternatively, solid block design which uses a
low-temperature solder to allow dis-assembly and
re-assembly. Details of assembly, alignment etc.
need to be worked on. Prototype to be made and
tested before Xmas. - On the basis of tests,
choose design, or modified design.
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Local Heat Sink at 420 m

• 420m from the IP remote
• Must be reliable and need little/no maintenance
• Must work in a radiation environment.
• Prefer if it does not introduce any mechanical
  noise
• CERN Cryolab Friedrich Haug and Jihao Wu see
  previous talk

Pulse Tube Cryocooler Acoustic Stirling (these
are commercially available) Looks like the
solution. Need to test. Also have to link the
station to this heat sink heat pipes? Must not
disturb the mechanics !!!!!!
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Link needs to be resolved
Remote Head
Station
Vaccum Vessel
Pulse Tube
A physicists overview. Needs to be engineered !
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Lower capacity system Note 1 metre remote head
Qdrive.com one commercial company
CERN Cryolab has one from/made by? KEK Cryogenic
Dept.
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• PLANS
• 2008
• Cooling tests in the lab October
• Cooling test with CERN cryolab to be fixed.
• Test of a prototype tracking station. With
  source and cosmics.
• Test on beam in 2009.
• Two (or three) superlayers with dummy layers to
  provide a thermal load
• 2009 - Tentative ATLASFP
• Depends on funding From April 2009 ?
  AGGRESSIVE SCHEDULE
• Silicon detector production 2009 - can both
  220 and 420 be supplied
• 
  on this timescale ?
• Assembly Spring 2010
• Test full 420 system on a test beam at CERN
  Summer 2010
• Install 2010 Winter shutdown
• NEED A GANTT CHART DISCUSSIONS TODAY