Electronic Design Automation

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Electronic Design Automation

• Objectives
• Design tools for advanced packaging
• Signal integrity modeling and simulation
• Computational electromagnetics for package design

• Accomplishments
• Linear and non-linear macromodeling
• On-chip power grid simulation using circuit FDTD
• Dispersion diagrams for EBGs

• Recent results
• Multilayered finite-difference method for package
  power planes
• Causality enforcement
• Modal decomposition for integration of plane
  models with transmission lines

• Future work
• Design and analysis tools for 3D-Packaging
• Efficient integration of S-parameters with Spice
• Early exploratory tool for chip-package co-design

Ref http//www.amkor.com/enablingtechnologies/3D/
index.cfm