CAMI Scalable Flexible Manufacturing Initiative

1
CAM-I Scalable Flexible Manufacturing Initiative
NGMS Task 6.1
2
Vision

• Our vision is E-manufacturing where we have
• Seamless, scalable and robust evolution of
  products from design to manufacturing (and
  possibly to delivery and service)
• Computer tools (such as simulators, rule-bases,
  visualizing environments) to rapidly plan,
  validate and deploy manufacturing instructions
• Flexible manufacturing systems for simultaneous
  production of multiple products and minimum
  system change over

3
Broad Goals

• Manufacturing evaluation and deployment of
  emerging standards (STEP 203 and 210, possibly
  220)
• Development of environments for manufacturability
  analysis of designs
• Manufacturing process planning and simulation
  environments
• Simulation and control for flexible manufacturing
  of board assemblies

4
Immediate Goals

• Implementation of visualization and translation
  tools for STEP AP210 (Generate 3-D models of
  assembly from AP210 descriptions)
• Computer implementation of Rockwells DFM rule
  base to function with AP210 description of boards
• Simulators for placement processes and machines
  (HSP and GSM simulators)
• Development of capabilities to virtually
  produce a board (AP210 as produced view of
  board assembly)
• Generation of (HSP) machine input files from
  AP210 model

5
Present flow
Design Release
Physical Constraints and Functions
Design and Drafting
MFG. Review (DFM Checks)
TrialError Production
6
Proposed Flow
7
Virtual Environment
8
Interconnect Assembly
Printed Circuit Assemblies
Product Enclosure
Printed Circuit Substrate
Die
Packaged Part
Package
Externally Visible Connectors
Die
9
Typical 2-D design of a PCB
10
PCB Manufacturing Process
11
Why STEP?

• Emerging standard
• Million seats of AP-203 presently deployed
• Simulation tool to be used across manufacturing
  facilities and vendors
• e-manufacturing
• E-Business applications of STEP are being enabled
  by the STEP and W3C committees working together.

12
What is STEP?

• ISO standard (ISO 10303)
• to share and exchange digital technical
  information
• Set of common data structures
• Application Protocols - Domain specific usage of
  data structures
• AP 203 (3D solid Models)

13
AP210 Electronic Assembly,Interconnect and
Packaging Design
Product Structure/
Part
Connectivity

• Functionality
• Analysis Support
• Shape 2D, 3D
• Package
• Material Product
• Properties

• Functional
• Packaged

Physical

• Component Placement
• Bare Board Design
• Layout templates
• Layers non-planar,
• conductive non-conductive
• Material product

Configuration Mgmt

• Identification
• Authority
• Effectivity
• Control
• Requirement Traceability
• Analytical Model
• Document References

Geometry

• Geometrically Bounded 2-D
• Wireframe with Topology
• Surfaces
• Advanced BREP Solids
• Constructive Solid Geometry

Requirements

• Design
• Allocation
• Constraints
• Interface
• Rules

Design Control
Technology

• Geometric Dimensioning and Tolerancing

• Fabrication Design Rules
• Product Design Rules

14
AP 210

• Several product models in electromechanical
  domain.
• Supports Multidisciplinary library data.
• Scope is as required as designed product
  information.
• Sharing across several levels of supply base.
• Ability to Integrate with other engineering
  domains.
• Ability to integrate external services
  coherently.

15
Flow Diagram
Assembly configuration file
Placement Sequence (OPTEL)
AP 210 file (2D)
AP 210 file (3D)
Visualizer (STEP OIV)
Simulator
Design Facts
DFM Rule Checker
DFM Rule files
16
2D to 3D converter

• ECAD translators generate AP 210 files containing
  2D Geometry
• Simulate 3D view of the assembly board
• Converter
• Input AP 210 file (2D geometry)
• Extrudes them into solids (Advanced BREP)
• Output
• AP 210 file (2D 3D geometry)
• AP 203 files

17
2D to 3D converter

• Ap203 files
• Individual packages
• Board
• These files then converted into Open Inventor
  format
• Inventor Graphics package used for rendering

18
Typical 2-D design of a PCB
19
AP-210 Viewer
20
DFM

• We are adapting a system originally developed by
  Boeing for use at Rockwell
• Developed on PreAMP and TIGER project.
• RDF syntax
• Inputs
• AP-210 Design File
• Rule Files
• Configuration Management

21
DFM Rule Facility

• Subset of Rockwell Collins DFM rules were chosen
  for implementation.
• Relevant facts extracted from the AP-210 file
  during preprocessing.
• Rule Inference engine insulated from intricacies
  of STEP
• Different facilities can easily plug in their DFM
  modules.
• Interface to the simulator
• DFM rules which were violated
• Components which violated these rules.

22
Assembly Data

• Establish an assembly usage view
• Components
• Organization by package / part family
• Part numbers, version
• Configuration management data
• Location, orientation
• Reference Designators
• Integrated with OPTEL
• Magazine Setup
• Optimized placement sequence

23
210 / 203 translator

• Electrical Domain Mechanical Domain

24
Simulator
25
Simulator

• Configurable
• Kinematics accepts a mechanism graph
• Graphics Geometric Models of machine components
• Next steps
• Machine Library
• Adding functionality
• Nozzle compatibility
• Placement timing

26
Project timeline
27
Work done

• Accepting an AP210 2D design file
• Manufacturability analysis
• Extracting component information
• Generating 3D models of components and assemblies
• Simulation using Universal HSP and GSM
• Generating
• as designed view
• as simulated view

28
Work done (cont.)

• Simulation
• Double sided boards
• Multi Panel Boards
• GSM
• Multiple stage simulation
• Testing
• Update of DFM Rules
• Development of Fact Extraction software
• AP210 Viewer
• Full 3-D assembly model of board
• Association between Graphical entities and AP210
  entities
• Ability to display properties

29
Future Work

• DFT
• Bare Board testing
• In-circuit test fixtures for the test
• Manufacturing systems planning
• Generating stencils for printed circuit
  substrates
• Explore transition from Line concept to Cell
  concept
• Capacity planning and simulation
• Describing production facilities (AP-220)
• Deployment