Title: Plasma CVD Carbon Nanotubes
1Plasma CVD Carbon Nanotubes
- Instructor Yonhua Tzeng
- An-Jen Cheng
- April 19 2004
2Questions
- What is the major effect for growing carbon
nanotubes by HFPECVD? - Why can carbon nanotubes be bent by ion
bombardment?
3Introduction
- Carbon nanotubes which have a hexagonal structure
are synthesized in plasmas containing ionized
carbon atoms, and carbon nanotubes can be divided
into single- and multi-wall . - Carbon nanotubes can be synthesized by MW-PECVD,
RF-PECVD, HF-PECVD, pyrolysis, laser evaporation
and so on. - Carbon nanotubes exhibit semiconducting or
metallic properties depending on their diameter
and helicity of the arrangement of graphite rings
in the wall. - Carbon nanotubes have preeminent electric,
thermal, and mechanical properties such as high
aspect ratio, high stress, high resistance to
chemical and physics attack.
4Outline
- The effects and parameters of magnetron-type
radio-frequency plasma for carbon nanotubes
growth. - Growing carbon nanotubes by hot filament plasma
enhanced chemical vapor deposition, and control
carbon nanotubes shape by ion bombardment. - Effects of coating a ultrathin polymer films on
carbon nanotubes by plasma treatment.
5RF magnetron-type apparatus
- 1. A powered Ni RF electrode is installed in the
center of a grounded cylindrical chamber. - PECVD for nanotubes growth is performed under the
conditions of 0.5 Torr and RF power of 1000W. - A magnetic field (0Bz340G) is externally
applied parallel to the powered cylindrical RF
electrode using solenoid coil in order to achieve
lower plasma sheath voltage and higher plasma
density. - The low-pass filter (LPF) is used to control the
DC bias voltage component (V rf) and DC current
density (J rf) toward the RF electrode. - Gas sources Methane and hydrogen (91).
Ref G-H, Jeong, N. Satake,
T. Kato, T. Hirata, R. Hatakeyama, K. Tohji, Jpn.
J.Appl. Phys., 42 (2003), ppL1340-L1342
6 SEM images show the features of
nucleation and successive nanotubes growth during
PECVD with time evolution. (a) As
polished Ni RF electrode surface (b) after
sputtering for 15 min ( c) after 1 min
growth using the mixture of CH4 and H2 (d)
after 3 min growth (e) after 7 min (f) after
15min growth
Ref G-H, Jeong, N. Satake, T. Kato, T.
Hirata, R. Hatakeyama, K. Tohji, Jpn. J. Appl.
Phys., 42 (2003), ppL1340-L1342
7Effects of magnetic field
- 1. SEM images showing the effects of magnetic
field externally introduced to the vacuum
chamber. (a) Bz 0G, (b) Bz 170G,(c) Bz 340G - Image (a) shows that when Bz 0 and Vdc-890V,
most of the creations consist of amorphous carbon
and graphite material. - The density of nanotubes grown in Bz 170G and
Vdc-380V is higher than the result in the case
of Bz 340G and Vdc-180V. - It is found that plasma confinement and self-bias
control by magnetic field introduction have
critical effects on the carbon nanotubes growth
REF T.
Hirata, N. Satake, G.-H. Jeong, T. Kato, R.
Hatakeyama, K. Motomiya, K.Tohji, Appl. Phys.
Lett., 82, 1119, 2003
8Effect of current density
- SEM images showing the MWCNTs produced on the RF
electrode under the condition of (a) Jdc0mA/cm2
, Vdc-180V (b) Jdc1.5mA/cm2 , Vdc-235V (c)
Jdc4.0mA/cm2 , Vdc-570V,and (d) dependence of
nanotubes density on Jdc. - The DC bias voltage of the RF electrode (Vdc) is
externally changed for typical magnetic fields (
170, 240, and 340G ) . An uniform, dense, and
straight MWCNTs grow in the externally bias case
of Jdc1.5mA/cm2 , Vdc-235V as shown in Fig.
(b). - Carbon nanotubes are observed to grow along the
local electric field due to the potential drop in
the plasma sheath formed by Vdc. - DC bias voltage which directly determine the ion
bombarding energy in the plasma sheath. - The typical parameters measured by Langmuir
probe, such as Te5eV, ne51010cm-3, and fp10V,
the sheath thicknesses were found to be 3-6.7mm.
REF T. Hirata, N. Satake, G.-H. Jeong,
T. Kato, R. Hatakeyama, K. Motomiya, K.Tohji,
Appl. Phys. Lett., 82, 1119, 2003
9- (a) Variation of the nanotubes length with growth
time and (b) diameter distribution of the MWCNTs
grown for 3 min and 15min (c) TEM image of
individual MWCNT, and (d) Raman spectrum of the
uniformly grown MWCNTs. - We found that the nanotubes growth rate in this
study is 0.5µm/min, and the nanotubes diameter
distribution becomes narrower in other words,
although MWCNTs grown at the early stage have
various diameters but most of the MWCNTs after 15
min growth have similar diameter of 100-120nm
Ref G-H, Jeong, N. Satake, T. Kato,
T. Hirata, R. Hatakeyama, K. Tohji, Jpn. J. Appl.
Phys., 42 (2003), ppL1340-L1342
10HFPECVD Carbon nanotubes growth
- During deposition, the gas pressure of 10 Torr
(50C2H2 and 50 NH3) was kept constant, and the
temperature of the substrate was about 650C. The
power of the DC plasma was 160W (400V, 0.4A) and
the time of deposition was 3 min. The distance
between filament and substrate was about 5-10mm. - Acetylene(C2H2) and ammonia(NH3) gas were used
as a carbon source and catalyst. - Prior to carbon nanotubes growth, the substrate
was cleaned in acetone and methanol for 10 min.
Fig. Schematic diagram of plasma enhanced hot
filament chemical vapor deposition reactor
REF J.-H Han, W.-S. Yang, J.-B. Yoo, C-Y Park,
J. Appl. Phys., 88, 7363, (2000) H. Lim, H. Jung,
S.-K. Joo, Microelectronics engineering 69 (2003)
81-88
11Effect of plasma density for nanotubes growth
- The bias voltage for plasma decreased from 550 to
429V , the substrate temperature change from 580
to 530C with decrease in the bias voltage. As
shown in Fig.(a), the vertically aligned carbon
nanotubes were grown at the plasma power of 550V
and 0.15A. But as shown in Figs. (b) and (c), the
growth of carbon nanotubes was not observed at
plasma power lower than 550V(0.15A) - The filament current is expected to play
important roles such as heating the substrate and
electron generation. The fact that the growth of
carbon nanotubes changes under the same filament
current implies that plasma power plays a more
important role than the filament current on
carbon nanotubes growth.
Fig. Effect of plasma power on the growth
of carbon nanotubes at a constant filament
current of 14 A (a) 550V
(0.15A) (b) 504V (0.11A) (c) 450V (0.06A) (d)
430V (0.02A)
12Effect of plasma density for nanotubes growth
- The plasma power and the filament current were
simultaneously varied to maintain a constant
substrate temperature (556C) in the HFPECVD
system. - As shown in Fig.1 (a)-(d), an increase in plasma
power enabled the carbon nanotubes to be grown
dramatically even though the filament current
decreased. - The plasma power may be the most crucial factor
for determining the growth characteristics of
carbon nanotubes. - Without the filament current, the growth of
vertically well-aligned carbon nanotubes was also
observed and shown in Fig.2 (b)
Fig.1.Effect of
plasma power on the growth characteristics of
carbon nanotubes
at
a constant temperature of 556C (a) 500V (0.13A)
(plasma power),12.1A
(filament current) (b) 551V (0.15A), 11.1A (c)
600V(0.21A,(A,(d) 650V (0.25A,7A
Fig.2. SEM images of carbon nanotubes grown on Ni
coated glass without filament current (a) 650V
(0.23A) , 25min (b) 640V (0.23A), 40 min
REF
J.-H. Han, W.-S. Yang, and J.-B Yoo, C.-Y Park,
J. Appl. Phys., 88, 7363 (2000)
13Ion mass doping system
Fig. Schematic of
the ion mass doping system
Fig. Two cases
of CNTs specimens (a) perpendicular,
(b) at 45 to the ion
shower
REF H. Lim, H. Jung,
S.-K. Joo, Microelectronics Engineering 69
(2003) 81-88
14Effect of Ion Bombardment
- Ion bombardment was used to bend the carbon
nanotubes structure, the shape of the CNTs did
not change when the ion beam was perpendicular to
the substrate however, CNTs were bent when the
CNTs was tilted to 45 degree. - The reasons for the CNTs to bend
- 1.The unique features of the process in
IMDS such as DC bias and physical etching. - A strong electric field during the ion
shower may be the reasons that cause the CNTs to
bend.
Fig. Carbon nanotubes after Ar ion bombardment
(a) with substrate
perpendicular to ion shower (b) at angle of 45C
REF H. Lim, H. Jung, S-K.
Joo, Microelectronics Engineering 69 (2003), 81-88
15Cont.
- After placing the carbon nanotubes tilted for an
hour at the same electric field without ion
bombardment, there is no trace to find out carbon
nanotubes have been bent in such a high electric
field. - The physical damage on the carbon nanotubes wall
may be another reason. - The carbon nanotubes were damage on only one side
of the wall and bent toward the etched side,
being etched means that carbon nanotubes loses
some carbon atoms. It reported that carbon
nanotubes yield to plastic deformation under
tensile stress.
Fig. No change of
carbon nanotubes after expose to
electric field of 5 kV/cm without ion
bombardment
Fig. TEM image
of asymmetrically etched carbon nanotubes
REF H. Lim, H. Jung, S-K.
Joo, Microelectronics Engineering 69 (2003), 81-88
16Polymer film coating
- The carbon nanotubes were vigorously stirred at
the bottom of the tube and thus the carbon
nanotubes surface can be continuously rotated and
exposed to the plasma for thin film deposition
during the plasma polymerization process, and the
magnetic bar was used to stir the powders. - These ultrathin coating could act to activate,
passivate or functionalize the particle to
achieve both desirable bulk and surface
properties. - To be able to distinguish the deposited polymer
thin film and the surface of carbon nanotubes, a
small fraction of C6F14 is introduced to
copolymerize with pyrrole monomer.
Fig. Schematic diagram of the plasma
reactor for thin polymer film coating of
nano-particles
REF P.He, J. Lian,
D. Shi, L. Wang, D. Mast. Wim J. van Ooij,
M.Schulz, Mat. Res. Soc. Symp. Proc. Vol.740
(2003), 13.19.1-13.19.7
17HRTEM CNTs images
- The original Pyrograf III PR-24-PS PR-24-HT
nanotubes shows the graphite structure with the
interlayer spacing d0020.34nm, based on the
bright-field TEM and HRTEM images the wall
thickness of the nanotubes can be speculated to
be 20-30nm for both kinds of nanotubes. - In Fig. (b), we can see the nanotubes that were
treated by plasma polymerization process, the
thickness of the ultrathin film is approximately
2-7nm.
Fig. HRTEM images of pyrograf III PR-24-PS
PR-24-HT nanotubes
(a) The fragments of the wall with
inclined planes (002) showing
lattice space on
the outer and inner surfaces of uncoated
nanotubes
with slight roughness(lt1nm) on the
surface (b) An ultrathin film of
pyrrole can be observed on both outer and inner
surfaces of coated nanotubes
REF P.He, J. Lian, D. Shi, L. Wang, D. Mast.
Wim J. van Ooij, M.Schulz, Mat. Res. Soc. Symp.
Proc. Vol.740 (2003), 13.19.1-13.19.7
18Cont.
- Fig. (b) is the HRTEM image of coated SWCNT in a
bundle, due to high energies these SWCNTs tend
to cluster together in an aligned form. - The polymer film is deposited on the outer
surface of the bundle as show in Fig. (b)
Fig. HRTEM images of single wall carbon
nanotubes (a) an isolated
SWCNT coated
with pyrrole (b) a bundle of SWCNT coated with
pyrrole
REF P.He, J. Lian, D. Shi, L. Wang, D.
Mast. Wim J. van Ooij, M.Schulz, Mat. Res. Soc.
Symp. Proc. Vol.740 (2003), 13.19.1-13.19.7
19TOFSIMS
- Time-of flight secondary mass spectroscopy
(TOFSIMS) was used to investigate the surface
films of carbon nanotubes. - The spectrum of the untreated nanotubes show an
appreciable intensity of carbon, hydrogen, and
oxygen, which is a characteristic of untreated
natural surface. - The spectrum in Fig. (b) shows carbon-fluorine in
the forms of C4 F7, C3 F7, C4 F6, and C5 F7,,
indicating highly branched and cross-linked
polymer structure in the deposited thin film.
Fig. (a)
SIMS data showing uncoated MWCNTs
Fig. (b) SIMS data showing
coated MWCNTs
REF P.He, J. Lian, D. Shi, L. Wang, D.
Mast. Wim J. van Ooij, M.Schulz, Mat. Res. Soc.
Symp.
Proc. Vol.740 (2003),
13.19.1-13.19.7
20Answer
- Plasma power
- The physical damage on the carbon nanotubes.
Carbon nanotubes were damage only on one side of
the wall and bent toward the etched side
21Reference
- REF G-H, Jeong, N. Satake, T. Kato, T. Hirata,
R. Hatakeyama, K. Tohji, Jpn. J.Appl. Phys., 42
(2003), ppL1340-L1342 - 2. REF T. Hirata, N. Satake, G.-H. Jeong, T.
Kato, R. Hatakeyama, K. Motomiya, K.Tohji, Appl.
Phys.Lett., 82, 1119, (2003) - 3. REF J.-H Han, W.-S. Yang, J.-B. Yoo, C-Y
Park, J. Appl. Phys., 88, 7363, (2000) - 4. REF H. Lim, H. Jung, S.-K. Joo,
Microelectronics engineering 69 (2003) 81-88 - 5. REF P.He, J. Lian, D. Shi, L. Wang, D.
Mast. Wim J. van Ooij, M.Schulz, Mat. Res. Soc.
Symp. Proc. Vol.740 (2003), 13.19.1-13.19.7 - 6. REF D. Shi, J. Lian, P. He, L.M. Wang, Wim
J. van Ooij, M. Schulz, Y. Liu, David B. Mast,
Appl. Phys. Lett. 81,5216,(2002)