Characterization of PulsedPlasmaPolymerized

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Characterization of Pulsed-Plasma-Polymerized Arom
atic Films
Neil M. Mackie, David G. Castner, and Ellen R.
Fisher
Department of chemistry, Colorado State Unv.
Langmuir, 1998
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Introduction

• Method of deposition
• Continuous wave plasma
• Pulsed plasma
• Advantage of Pulsed plasma
• functional group control
• reduce trapped radicals in the film.
• Decrease the high-energy ion bombardment
• and UV flux to the surface
• provide greater control over the resulting film
  chemistry

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Experimentals

• Method for deposition
• pulsed inductively coupled rf plasma
• Precursor
• benzene C6H6
• 1,2,4-trifluorobenzene(TFB) C6F3H3
• hexafluorobenzene(HFB) C6F6
• Condition
• variable duty cycle plasma
• different monomer fluorination while keeping
  other parameter
• power 400W on p-Si(110)
• 10cm downstream of the coil region
• but still within the plasma glow
• 150mTorr

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• Intruments for measuring
• transmission FTIR
• contact angle goniometer(1uL)
• XPS (AlKa 1486.6eV)
• Time-of-Flight SIMS
• DSC

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Results and Discussion
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C6H6
Methyl CH bend
Out-of-plane phenyl ring bending
Aromatic ring mode
sp1 CH stretch
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C6H6
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C6F3H3
CFx (x1-3)
CF3
H, F, CC stretch
CF benzene ring
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C6F3H3
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C6F6
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C6F6
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Contact angle
C6F6
C6F3H3
C6H6
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Deposition rate
C6H6
C6F3H3
C6F6
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On time 5 - 8000us
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