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Introduction1

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Setup(performance constraint) ... delay between flops setup time of the destination ... Setup: Tcycle,min = Tlatch,max Tlogic,max tclk-width,min. Hold: ... – PowerPoint PPT presentation

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Title: Introduction1


1
Introduction-1
  • All sequential circuits depends on ordering of
    events.
  • In synchronous design, the ordering of events is
    achieved by global clock.
  • In synchronous design memory elements in the
    system are simultaneously updated by a globally
    distributed periodic synchronization signal known
    as global clock.
  • System functionality is ensured by some strict
    constraints on the clock generation its
    distribution to memory elements.

2
Timing of Integrated Circuits
3
Introduction-2
  • digital system designers strive to maximize the
    clock frequency in order to achieve high system
    performance.
  • Three ways to do it in synchronous design
  • 1. Employ a fast circuit family
  • (bipolar ECL / GaAs / CMOS)
  • 2. Use faster storage elements(latch/FF) and
    robust clocking scheme
  • 3. Distribute clock with small skew

4
Signal Classification
  • Criterion How the signal is related to local
    clock.
  • Synchronous signal has the exact same frequency
    as the local clock and maintains a known fixed
    phase offset to that clock.
  • Mesochronous(meso middle) signal has the same
    frequency as the local clock but unknown phase
    offset w.r. to that clock.
  • Plesiochronous(plesio near) signal has
    nominally but slightly different frequency w.r.
    to local clock.
  • Asynchronous signal can transition arbitrarily at
    any time(not slave to any local clock).

5
Synchronous Timing
6
Timing Constraintsfor edge triggered flops
  • Setup(performance constraint)
  • Clock period gt max clk-to-q delay of the source
    flop max logic delay between flops setup time
    of the destination flop.
  • Hold(functionality constraint)
  • Hold time of the destination flop lt min
  • clk-to-q delay of the source flop min logic
    delay between flops.

7
Timing Constraintsfor level sensitive latches
  • Setup
  • Tcycle,min gt Tlatch,max Tlogic,max
    tclk-width,min
  • Hold
  • Tsetup,max lt Tclk-width lt Tlatch,min Tlogic,min
    Thold,max

8
Clock Uncertainty- SKEW
  • Skew is the spatial variation in the arrival time
    of clock transition to different registers.
  • The skew between two points I and J is the
    difference between a certain (pos/neg) transition
    of clock at those 2 points.
  • It can be positive or negative depending on
    routing direction and position of the clock
    source.
  • The main reason of skew is the static mismatch in
    clock paths and difference in clock load.
  • Affects both performance and functionality.

9
Clock Uncertainty- JITTER
  • Jitter is the temporal variation of the clock
    period at a given point on the chip.
  • Its a zero mean random variable.
  • The absolute jitter is the worst case variation
    of of a clock edge at a given location w.r. to an
    ideally periodic reference clock edge.
  • Affects only performance(by reducing available
    clock period)

10
Combined Effect of skew and jitter in edge
triggers flop constraints
  • Setup(performance constraint)
  • Clock period gt max clk-to-q delay of the source
    flop max logic delay between flops setup time
    of the destination flop
  • skew 2 absolute jitter
  • Hold(functionality constraint)
  • Hold time of the destination flop lt min clk-to-q
    delay of the source flop min logic delay
    between flops -- skew - 2 absolute jitter

11
Source of skew and jitter-1
12
Source of skew and jitter-2
  • Clock Signal Generation clock signal generation
    itself causes jitter the signal is typically
    generated by analog circuit (VCO) which is
    sensitive to intrinsic device noise and power
    supply variation. A major problem is the
    coupling from the surrounding noisy digital
    circuit through the substrate especially in
    modern fabrication process.

13
Source of skew and jitter-3
  • 2. Manufacturing Device Variation buffers are
    integral components in clock distribution
    circuits. Unfortunately, as a result of process
    variation, device parameters in the buffers vary
    along different paths, resulting in static skew.
    Some of the sources are variation in oxide,
    dopant and lateral(width and length) dimension.
  • 3. Interconnect Variation Vertical and lateral
    dimension variations causes the interconnect R
    C to vary(static -gt skew) across the chip. One
    important source is the inter-layer
    dielectric(ILD) variation.

14
Source of skew and jitter-4
  • 4 5. Environmental Variations
  • They are probably the most significant
    contributor to skew and jitter. Two 2 major
    sources are power supply and temperature.
  • Temperature gradient across the chip which can be
    quite large results from power supply variation.
    Shutting off parts of the chip by clock gating
    for low power causes large temperature variation.
  • Temperature variation is usually considered skew
    component because of its relative slow change and
    may be compensated using feedback
  • Power supply voltage which is a strong function
    of switching activity is the major source of
    jitter.

15
Source of skew and jitter-5
  • High frequency power supply changes are difficult
    to compensate for, even with feedback circuit.
    Consequently, power supply noise fundamentally
    limits the performance of clock networks.
  • To minimize power supply, use high performance
    designs and decoupling capacitance around major
    clock drivers.

16
Source of skew and jitter-6
  • 6 7. Capacitive coupling
  • Changes in capacitive load contributes to timing
    uncertainty(jitter).
  • 2 major source coupling between the clock lines
    and the adjacent signal wires and the variation
    in gate capacitance of registers.
  • For many registers the clock load is a function
    of the current state as well as next state. This
    causes the delay through the clock buffers to
    vary from cycle to cycle.

17
Design Technique for dealing with skew and jitter
-1
  • Some useful guidelines for reducing clock
    skew and jitter are
  • 1.To minimize skew, balance clock paths from a
    central distribution source to individual
    clocking elements, using H-tree structures or
    more generally routed matched-tree structures.
  • 2.The use of local clock grids (instead of
    routed trees) can reduce skew at the cost of
    increased capacitive load and power dissipation.

18
Design Technique for dealing with skew and jitter
-2
  • 3. If data-dependent clock load variations cause
    significant jitter, differential registers that
    have a data-independent clock load should be
    used. The use of gated clocks to save power
    results in a data-dependent clock load and
    increased jitter in clock networks where the
    fixed load is large (e.g., in clock grids), the
    data-dependent variation might not be
    significant.
  • 4. If data flow in one direction, route the data
    and the clock in opposite directions. This
    eliminates races at the cost of performance.

19
Design Technique for dealing with skew and jitter
-3
  • 5. Avoid data-dependent noise by shielding clock
    wires from adjacent signal wires. By placing
    power lines (VDD or GND) next to the clock wires,
    coupling from neighboring signal nets can be
    minimized or avoided.
  • 6. Variations in interconnect capacitance due to
    interlayer dielectric thickness variation can be
    greatly reduced through the use of dummy fills.
    Dummy fills are very common and reduce skew by
    increasing uniformity. Systematic variations
    should be modeled and compensated for.

20
Design Technique for dealing with skew and jitter
-4
  • 7. Variation in chip temperature across the die
    causes variations in clock buffer delay. The use
    of feedback circuits based on delay-locked loops
    can compensate for temperature variations.
  • 8. Power-supply variation is a significant
    component of jitter, as it impacts the
    cycle-to-cycle delay through clock buffers.
    High-frequency power-supply variation can be
    reduced by adding on-chip decoupling capacitors.
    Unfortunately, decoupling capacitors require a
    significant amount of area, ad efficient
    packaging solutions must be leveraged in order to
    reduce chip area.

21
Self-timed and asynchronous systems
  • Functions of clock in synchronous design
  • 1. Acts as completion signal
  • 2. Ensures correct ordering of events
  • Truly asynchronous design
  • 1. Completion is ensured by careful timing
    analysis
  • 2. Ordering of events is implicit in logic
  • Self-times design
  • 1. Completion is ensured by completion signal
  • 2. Ordering is imposed by handshaking signal

22
2 way handshaking
23
4 way handshaking
  • Slower but unambiguous

24
Synchronizer-1
  • Asynchronous signal coming into a synchronous
    system must be synchronized with the rest of the
    system.
  • This is generally done by feeding the
    asynchronous signal to a flop referred to as the
    synchronizer.
  • A serious concern is the prolonged indecision of
    the synchronizing flop when it enters into
    metastable state(caused by setup/hold violation
    of the asynchronous input signal to the flop) as
    illustrated in the next slide.

25
Synchronizer-2
26
Clock Synthesis and Synchronization using PLL-1
  • High frequency clock(in GHz) are almost always
    generated from crystal(less than 200Mhz) by using
    PLL as a multiplier
  • PLL is also used to synchronize communication
    between chips.
  • The above 2 uses of PLL is shown in the next
    slide.

27
Clock Synthesis and Synchronization using PLL-2
28
Distributed Clocking using DLL-1
  • A recent trend in high performance clocking is to
    use Delay Locked Loop(DLL) which is a variation
    of PLL.
  • DLL corrects phase error by using voltage
    controlled delay line(VCDL)
  • The output of the DLL is phase aligned with the
    reference input. Since it takes some time for
    this alignment, DLL can be used to compensate for
    static process variation and slow dynamic
    variation(e.g., temperature).

29
Distributed Clocking using DLL-2
30
Distributed Clocking using DLL-3
  • DLL approach to clock distribution
  • - The chip is partitioned into many small
    regions called tiles.
  • - The global clock is distributed to each tile
    through a DLL. The feedback signal to DLL is
    brought after clock tree buffers.
  • - In the following figure the clock input to
    Digital Circuit blocks are phase aligned with
    the global clock by using DLL.

31
Distributed Clocking using DLL-4
32
Optical Clock Distribution-1
  • The performance of a digital design is
    fundamentally limited by by process and
    environmental variations.
  • Use optics for system wide synchronization
  • The advantage of optical signal is that it is not
    sensitive to temperature and electromagnetic
    interference(cross talk, inductive coupling) and
    clock edges do not degrade over long distances
    (i.e., tens of meters). In fact, it is possible
    to deliver an optical clock signal with at most
    100ps of uncertainty over tens of meters.

33
Optical Clock Distribution-2
  • The disadvantage is the challenge in designing
    optical receiver(optical to electrical
    conversion). The receiver is susceptible to
    process and environmental variations(hence
    uncertainty) very much like conventional
    electrical approach but the problem is confined
    to receiver, which makes it more tractable.
  • Optical clocking has an important future if the
    challenges dealing with process variation in
    opto-electronic circuit can be addressed.

34
Optical Clock Distribution-3
  • Architecture for optical clock distribution

35
GALS
  • A promising solution of the increasingly
    difficult problem of clock distribution
    (uncertainty and power dissipation) is to use
    islands of synchronous units connected by an
    asynchronous network called Globally Asynchronous
    Locally Synchronous (GALS) to harness the
    benefits of both approach while keeping the
    difficulties of each approach a minimum.
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