Review: FE Exam

1
Review FE Exam

• Text Materials Science and Engineering An
  Introduction, 6th ed., William D. Callister,
  Jr., Wiley, 2003.

2
Review FE Exam

• Part 1 atomic structure bonding
• What holds materials together?
• Part 2 Imperfections in solids
• How are they packed?
• Part 3 mechanical properties
• How do they deform?

3
Review Chapter 1 Introduction

• Types of Materials
• Metals
• Polymers
• Ceramics

4
Review Chapt 2-Atomic Structure

• Atomic Number, Atomic Weight, etc.
• Periodic table
• Electron Structure - valence electrons unfilled
  shells
• Bonding
• ionic
• covalent
• metallic
• van der Waals

5
Review Chapt 3 Crystal Structures

• Unit Cell
• Metals
• BCC
• FCC
• HCP
• Atomic packing factor
• Coordination number
• Crystallographic directions uvw
• families of directions ltuvwgt
• Linear density of atoms (ld) atoms/unit length

6
Review Chapt 3 Crystal Structures (cont.)

• Miller indices of planes (hkl)
• families of planes hkl
• Planar density (pd) of atoms/ unit area
• (pd) S.A. atoms/S.A. unit cell
• X-Ray Diffraction
• Braggs law

7
Review Chapter 4

• Imperfections
• Point defects
• Interstitial
• Vacancy
• Substitution
• Solid solutions
• Line defects
• Edge dislocation - Burgers vector perpendicular
  to dislocation line
• Screw dislocation - Burgers vector parallel to
  dislocation line
• Planar defects
• Twin
• Stacking fault
• Grain Boundary

8
Review Chapter 4 (cont.)

• Microscopy
• Optical
• Electron Microscopy
• Sample Prep polishing etching

9
Review Chapter 5

• Diffusion
• Vacancy diffusion
• Interstitial diffusion
• Ficks First Law
• Second Law
• Temp effect
• Slab- non-steady state

10
Review Chapter 19

• Thermal Properties
• Heat Capacity
• C dQ/dT Cp gt Cv
• phonons
• thermal expansion coefficient
• ?l/l ?l ?T
• thermal conduction of heat
• q -k (dT/dx)
• k heat transfer coefficient

11
Review Chapter 6Mechanical Properties

• Stress vs. strain
• Hookes law s E e

TS
?y
?F
E
12
Review Chapter 6

• Poissons Ratio
• Toughness
• Resilience
• Hardness

13
Review Chapter 7

• Dislocations and Strengthening Mechanisms
• Deformation by motion of dislocations
• Slip plane plane of easiest deformation
• Slip direction direction of easiest slippage
• Slip system direction and plane
• Applied stress must be resolved along slip
  direction
• ? ? cos? cos?
• Twinning
• Mechanism of strengthening
• Grain size reduction
• Solid-solution hardening
• impurities reduce mobility of dislocations
• Strain hardening CW 100 x (A0-Af)/A0
• Recovery, recrystallization, grain growth

14
Review Chapter 8

• Fracture failure
• Ductile fracture
• Large deformations
• cone cup
• small necked regions
• Brittle fracture
• Almost no deformation other than failure
• transgranular within grain
• intergranular- between grains

15
Review, Chapter 8 (cont.)

• Griffith Crack - Stress concentration
• Critical stress
• Fatigue cyclic stress
• Creep

16
Review- Chapter 9

• Phase Diagrams
• Isomorphous system
• 1. How many which phases
• 2. Use tie line to read compositions
• 3. Use lever rule to get weight fractions

17
Review- Chapter 9

• binary eutectic system
• 1. How many which phases
• 2. Use tie line to read compositions
• 3. Use lever rule to get weight fractions

18
Review- Chapter 9 (cont.)

• Eutectic L S1S2
• Eutectoid S1 S2S3
• Peritectic S1L S2
• Hypoeutectoid
• Hypereutectoid

19
Review - Chapter 10

• Rate of Phase Transformation
• Nucleation process

20
Review - Chapter 10 (cont)

• Phase transformations vs. temperature and time
• Pearlite
• Martensite
• Bainite
• Spheroidite
• Chapter 11
• Heat Treatments

21
Review Chapter 11

• Fabrication of Metals
• Forming
• Forging
• Rolling
• Extrusion
• Drawing
• Casting
• Powder metallurgy
• Welding
• Machining
• Alloy Nomenclature
• Cast Irons addition of Si catalyzes graphite
  formation
• Refractories

22
Review Chapter 12

• Ceramics
• Crystal structures
• oxygen larger generally in FCC lattice
• cations go in lattice sites based on
• size
• stoichiometry
• charge balance
• bond hybridization
• no good slip planes brittle failure
• Silicates
• built up of SiO44-
• layered
• countercations to neutralize charge

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Chapter 12 Ceramics

• Carbon forms
• diamond
• graphite
• fullerenes
• amorphous
• Lattice imperfections
• Frenkel defect cation displaced into
  interstitial site
• Schottky defect missing cation/anion pair
• Phase diagrams
• Mechanical properties

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Chapter 13 Ceramics (cont)

• Glasses
• amorphous sodium or borosilicates
• Forming
• pressing
• drawing
• blowing
• Clay products - forming
• Hydroplastic forming
• Slip casting
• Refractories
• Powder pressing
• Cements
• Advanced ceramics

25
Chapter 14 Polymers

• Types of polymers
• Commodity plastics
• PE Polyethylene
• PS Polystyrene
• PP Polypropylene
• PVC Poly(vinyl chloride)
• PET Poly(ethylene terephthalate)
• Specialty or Engineering Plastics
• Teflon (PTFE) Poly(tetrafluoroethylene)
• PC Polycarbonate (Lexan)
• Polysulfones
• Polyesters and Polyamides (Nylon)

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Chapter 14 Polymers

• Molecular Weight
• Actually a molecular weight distribution
• Mn Number-averaged molecular weight
• Mw Weight-averaged molecular weight
• Polydispersity Mw/Mn
• A measure of the width of the distribution
• Chain Shapes
• linear
• branched
• crosslinked
• network

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Chapter 14 15 Polymers

• Isomerism
• Isotactic
• Syndiotactic
• Atactic
• Cis vs. Trans
• Copolymers
• Random
• Alternating
• Block
• Crystallinity
• Spherulites

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Chapter 16 Composites

• Combine materials with objective of getting a
  more desirable combination of properties
• Dispersed phase
• Matrix
• Particle reinforced
• large particle
• dispersion strengthened
• Rule of mixtures
• Upper limit Ec(u) EmVm EpVp
• Lower limit

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Chapter 16 Composites

• Reinforced concrete
• Prestressed concrete
• Fiber reinforced
• Short vs. long fibers
• Critical length
• allignment

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Chapter 18 Electrical Properties

• Definitions
• R resistance Ohms
• ? RA/l resistivity ohm meter
• ? 1/? conductivity
• C Q/V capacitance
• ?r ?/?o dielectric constant

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Chapter 18 Electrical Properties

• Energy Bands valance vs. conduction
• Conductor no band gap
• Insulator wide gap
• Semiconductor narrow gap
• Intrinsic pure or compound
• Electron vs. hole (which carries charge)
• Extrinsic (doped)
• n-type donor levels extra electrons
• p-type acceptor levels extra holes
• Microelectronics
• pn junction rectifier diode
• npn transistor

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Chapter 20 Superconductivity

• Tc temperature below which superconducting
• critical temperature
• Jc critical current density if J gt Jc not
  superconducting
• Hc critical magnetic field if H gt Hc not
  superconducting
• Meissner Effect - Superconductors expel magnetic
  fields

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Chapter 21 Optical Properties

• Electromagnetic radiation
• Angle of refraction at interface

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Chapter 21 Optical Properties

• Light interaction with solids
• Reflection
• Absorption
• Scattering
• Transmission
• Semiconductors absorb light with energy greater
  than band gap
• Luminescence emission of light by a material
• phosphorescence If very stable (long-lived
  gt10-8 s)
• fluorescence If less stable (lt10-8 s)
• LASERS coherent light
• Fiber optics

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Questions???

• Contact Prof. David Rethwisch to discuss
  questions.
• office 4139 SC
• Phone [phone]
• email david-rethwisch_at_uiowa.edu