Overview of the Newest OMAP35x Applications Processors

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Overview of the Newest OMAP35x Applications
Processors
Martín BurgosBusiness Development
Manager Catalog Processors and EEE
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Drive for smarter devices reaches across product
categories to improve effectiveness

• Simultaneous
• Advanced user interfaces
• Enhanced productivity
• Full web browsing
• Multimedia
• Green
• Connectivity

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OMAP Processors inspire new applications with
unprecedented performance, low power
Scalable processors provide best general purpose,
multimedia graphics processing in any
combination
First broad sampling of ARM Cortex-A8 core
provides a 4x improvement over ARM9 and achieves
laptop-like performance at handheld power levels
Samples Available Today
Begin application development with extensible
OMAP35x Evaluation Module
Order EVM Today
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OMAP 35x Scalable Generation of Single-Chip
Devices for Complete Portfolio
DSP Processing Multimedia Software
Compatibility
2D/3D GraphicsCompatibility
Applications Software Compatibility
SharedPeripheralSet
Pin-for-pin compatible
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OMAP3503 Processor High Performance, Low Power
Applications Processor

• Performance
• High-performance Cortex-A8
• Low power utilizing TIs SmartReflex technology
• Option for integrated PMU solution as well as
  discrete solutions
• Features
• Core
• Cortex A-8
• 600 MHz _at_ 1.35V
• 550 MHz _at_ 1.27V
• 500 MHz _at_ 1.2V
• Memory
• ARM
• 16 kB I-Cache 16 kB D-Cache 256kB L2
• On Chip 64kB SRAM 112kB ROM
• Peripheral Highlights
• Support for mSDRAM, LPDDR
• Support for NOR, NAND, SRAM, Pseudo SRAM
• USB 2.0 HS Compliant OTG Controllers w/
  additional 2 USB HS Host Controllers

• Applications include
• Portable Navigation Device, Advanced Portable
  Consumer Electronics, Portable data collection,
  POS, Web Tablet, Smart White Goods, Smart Home
  Controllers, Security, Low Cost PC and new
  markets identified by you.

ARMCortex-A8 CPU
Display Subsystem
Camera i/f Parallel
Camera i/f Serial
LCDCont-roller
Video Enc
10 bit DAC
10 bit DAC
Master Bus
Peripherals
System
Connectivity
USB 2.0 Host Controller x2
USB 2.0 HS OTG Controller
Timers GP x12 WDT x3
Serial Interfaces
Program/Data Storage
I2C x4
UART x2
McBSP x5
MMC/ SD/ SDIO x3
SDRC
GPMC
UART w/IRDA
McSPI x4
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OMAP35xx FamilyHigh Performance, Low Power
Applications Processors

• Performance
• Strong graphics capability combined with
  high-performance Cortex-A8
• Low power utilizing TIs SmartReflex technology
• Option for integrated PMU solution as well as
  discrete solutions
• D1 resolution video performance utilizing
  TMS320C64x DSP and video hardware accelerators
• Features
• Core
• Cortex A-8
• DSP based TMS320C64x DSP and video accelerators
  
• 600 MHz / 430 MHz _at_ 1.35V, 550 MHz / 400 MHz _at_
  1.27V
• 500 MHz / 360 MHz _at_ 1.2V
• NEON SIMD Coprocessor
• 2D/3D Graphics Engine
• Up to 5M polygons per second
• Memory
• ARM
• 16 kB I-Cache 16 kB D-Cache 256kB L2
• TMS320C64x DSP and video accelerators
• L1 32kB Program Cache/32kB Data Cache 48kB SRAM

• Applications include
• Portable Navigation Device, Portable Media
  Player, Advanced Portable Consumer Electronics,
  Digital TV, Digital Video Camera, Portable data
  collection, Point-of-Sale, Gaming, Web Tablet,
  Smart White Goods, Smart Home Controllers,
  Security, Ultra Mobile Device and future new
  markets

Display Subsystem
ARMCortex-A8 CPU
C64x DSP and video accelerators (3525/3530
only)
Video Enc
LCDCont-roller
10 bit DAC
10 bit DAC
Camera I/F
2D/3D Graphics (3515/3530 only)
Image Pipe
Parallel I/F
L3/L4 Interconnect
Peripherals
System
Connectivity
Security Acc (HS only)
Timers GP x12 WDT x3
USB 2.0 Host Controller
USB 2.0 HS OTG Controller
Serial Interfaces
Program/Data Storage
I2C x4
UART x2
MMC/ SD/ SDIO x3
McBSP x5
SDRC
GPMC
UART w/IRDA
McSPI x4
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Industrys Best General Purpose, Multimedia
Graphics Processing in Any Combination
First Sampling ARM Cortex-A8
First with OpenGL ES 2.0 Graphics
Multi-format video processing, up to HD
C64x DSP video accelerators
ARMCortex-A8
Display Subsystem
2D/3D Graphics, OPEN GL ES 2.0
Peripherals
Connectivity SystemSerial Interfaces
Program/Data Storage
SmartReflexEnabled PowerManagement
65nm Technology CUS Package 16 x 16 mm,0.65
mm pitch
Select processors
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First Sampling ARM Cortex-A8 Core Offers a 4X
Performance Improvement vs. ARM 9
First Sampling ARM Cortex-A8
Fast, full web browsing
Compelling Java apps
Fast, full database, spreadsheet, presentation
and email applications

• Advanced, Intuitive UI
• Highest-performance ARM, up to 1200 Dhrystone
  MIPS

Linux
Windows CE
NEON enabled Multimedia
Fast boot time
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OMAP3 Architecture is First Based on
Superscalar ARM Cortex-A8

• Enables higher performance applications to
  support
• fast boot time (5 sec)
• laptop-level productivity
• full internet browsing
• Highly-integrated core
• 64/128-bit SIMD NEON engine
• VFPv3 floating point unit
• Security/Java/Thumb-2 support
• Integrated level 1 and 2 caches
• Semi-custom design to maximize performance and
  power-efficiency

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Cortex Naming The Basics

• There are several Cortex versions, how is the
  Cortex A8 differentiated?
• ARM Cortex
• Cortex A Applications
• High Performance, Full OS, Low Power
• Cortex R Real-Time
• Embedded Processing, real-time
• Cortex M Microcontroller
• Cost sensitive embedded applications
• OMAP35xx is the worlds first processor that
  features the Cortex A8

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ARM Cortex-A8 Core

• ARM Version 7 core architecture.
• Instruction set
• Standard ARM (32bit)
• Thumb-2 (mixed 16bit and 32bit) better code
  density with 32bit like performance
• Code Execution
• 13-stage main integer pipeline 10-stage NEON
  media pipeline
• Dual fetch and Dual issue inline execution.
• Jazelle RCT (Runtime Compile Target) extension
  improves performance and code density of
  JIT (Just-in-Time) and AOT (Ahead of Time)
  compiled codes
• Security TrustZone technology
• Global history based Dynamic Branch Prediction
  (95 accurate)
• Integrated NEON Media processor (SIMD
  coprocessor- VFP light media streaming
  instructions)
• Cache memories
• Level 2 cache controller with 256KB unified
  cache - 8 ways associative
• Level 1 cache 16KB instruction and 16KB data
  caches - 4 ways associative, 64 bytes/line
• Coresight ETM11 (Embedded Trace Macro)

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Legacy ARM Cores Comparison
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HD Video Playback Now Possible for a Host of New
Applications
Multi-format video processing, up to HD

• HD video processing up to MPEG-4 SP, 720p decode
  at 30 fps
• Audio processing

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Life-Like Graphics Redefine Possibilities for
Handheld and Embedded Applications
First with OpenGL ES 2.0 Graphics

• Photo-realistic graphics, up to 10 million
  polygons per second
• Advanced, Intuitive UI

Imagination Technologies' PowerVR SGX
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Peripherals and Display Subsystem for Seamless
Connectivity

• Peripheral Highlights
• USB 2.0 HS Compliant OTG Controllers w/
  additional 2 USB Host Controllers
• Display subsystem with PIP, color space
  conversion, rotation, and resizing support
• Support for LPDDR
• Support for NOR, NAND, SRAM, Pseudo SRAM

Peripherals DisplaySubsystem

• Seamless connectivity for low BOM cost
• Integration results in reduced board footprint
  and power
• Interface to LCDs, SDTVs, HDTVs

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Display SubSystem Examples
Scaling
PiP
HW cursor
Overlay
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Best-in-Class Processing Capabilities For
Evolving Market Opportunities
First Sampling ARM Cortex-A8

• HD video processing up to MPEG-4 SP, 720p decode
  at 30 fps
• Audio processing

Multi-format Video Processing, up to HD
First with OpenGL ES 2.0 Graphics

• Advanced, Intuitive UI
• Highest-performance ARM, up to 1200 Dhrystone
  MIPS

• Photo-realistic graphics, up to 10 million
  polygons per second
• Advanced, Intuitive UI

Peripherals DisplaySubsystem

• Seamless connectivity for low BOM cost
• Integration results in reduced board footprint
  and power
• Interface to LCDs, SDTVs, HDTVs

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Begin Development with Extensible OMAP35x
Evaluation Module
Connectivity
Hardware

• Daughter card connectivity
• Ethernet, USB 2.0, SDIO, I2C, JTAG, Keypad
• CompactFlash, SD/MMC, DDR
• S-Video output via NTSC/PAL YPbPr/RGB

• OMAP35x Processor
• 64 MB SDRAM/128 MB NAND Flash
• Touch screen LCD display
• Landscape/Portrait modes
• DVI output

Development tools and support

• Open source development tools
• Reference schematics
• Emulator support TI XDS560

Software

• OMAP3503 Linux BSP
• Kernel 2.6.22
• Peripheral drivers
• U-boot for boot loading
• Busybox based root file system
• Windows CE 6.0 BSP available Q208

• Evaluate capability
• Begin SW development
• Use Daughter card expansion to prototype complete
  system
• Easy to Upgrade to New Processors and Power
  Management Devices

OMAP35x EVMOrder Entry Now
Price US1,499
www.ti.com/omap3503pr
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OMAP35x EVM Block Diagram
1For production TPS65950 should be used.
TPS65950 is pin and software compatible with
TWL4030 2 TPS6590 included External PHY ISP
functionality
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EVM Experience OverviewOpening the box
FCC/UL CE Waiver

• READ ME FIRST
• Register
• Go to Set Up Guide
• Support

• Set-Up Guide
• H/W and S/W installation Steps

• Getting Started Guide
• How to

• H/W Technical Users Guide
• Vendor Supplied
• BOM, schematics
• H/W peripherals, connections

• S/W content
• TI PSP, file system, and demos
• Code Sourcery compiler and debugger
• Mistral board utilities

• H/W content
• OMAP3503 Target Board
• Universal Power supply US/Euro cords
• Serial Cable

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OMAP35x Summary Software Schedule
Drivers/OS/Apps
DSP Codecs

• MPEG4 SP Encode/Decode(D1)3
• MPEG2 MP Decode(D1/)3
• H.264 MP decode / BP encode (D1) 3
• WMV/VC1 Decode (D1)3
• JPEG Encode/Decode
• AAC LC Decode
• WMA9 Decode
• MP3 Decode
• AAC HE Decode

• Image display sample application
• Linux Kernel version 2.6.22 (non commercial)
• NAND/oneNAND boot (JFFS2)
• LPDDR
• Video DisplayVGA LCD, S-Video, Rotate,
  Mirroring, V4FL2, Framebuffer, Touch screen
• USB OTG Port
• Host MSC, HID class
• Device MSC, CDC/RNDIS(IP)
• MMC/SD
• Keypad
• UART/I2C/SP/McBSP(I2S)
• Timers
• Ethernet
• Power management (TWL4030 / TPS65950) CPU Idle
  and Dynamic Tick to enter low power states
• DFVS and SmartReflex
• MMC/SD SD v2 (High capacity) SDIO WLAN
• USB ISO Transfer and GadgetFs
• Composite Video Support
• USB Host (EHCI) hub support, MSC, HID1

Dev. Tools

• CodeSourcery
• GNU gcc 4.2.1
• glibc
• Build-root busybox filesystem
• U-boot 1.1.4
• Platform Builder (WinCE only)

Schedule April 2008 OMAP3503 only (Beta) 3Q08
OMAP3530 enabled (Beta) 4Q08 - GA Release
1 Will require modified EVM or daughter card 2
Preliminary demos planned for Mar 08 3 Targeted
performance
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Overview of SW stacksAPI perspective OMAP35x
EA DVSDK

• Abstracts location of algorithm
• Common codec interfaces
• Video/Imaging/Speech/Audio
• Extensible for new algorithms
• Helps manage shared resources
• May be used without a DSP
• Requires xDM algorithm

• Manages algorithm resources
• Manages algorithm lifetime
• Structures I/O and control

xDM
VISA
Framework Components
Link
Linux 2.6.22
DSP/BIOS

• Downloads arbitrary DSP code
• Performs IPC

• Schedules DSP tasks
• Manages DSP resources

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Overview of SW stacksAPI perspective - WinCE

• Standard interfaces for WinCE graphics

• Standard interfaces for WinCE multimedia

DirectDrawDirectDraw3D
DirectShow
xDM
VISA
Framework Components
Link
WinCE 6.0
DSP/BIOS

• 3rd-party port with Microsoft help
• Runs on TI OMAP3 EVM

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OMAP35x Offers Robust Performance at
Significantly Lower Power
Management Framework
System Design

• lt220mW _at_ 300MHz (equivalent to 600 MHz ARM9)
• 477uW standby (allows for autonomous wakeup)
• Assumes 85 utilization on typical application

Policy and Domain Managers

Workload Monitoring and Prediction
Multiple Domains
Adaptive Voltage Scaling
SoC Design
Dynamic Power Switching
Static Leakage Management

Dynamic Voltage/Frequency Scaling
Low Leakage Process
Multi-Domain Support Cells
Silicon IP
Multi-Threshold CMOS Cells
Retention Memory And Logic
Temperature And Process Sensor
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SmartReflex Class Definition

• Process Variations
• Class-1
• At boot-up time, process-optimized operating
  point voltages of the die are determined during
  calibration 
• Process Variations Temperature Silicon
  Degradation
• Class-2
• SmartReflex sub-chip does real-time voltage
  optimization via software loop
• MPU services interrupts to change voltage
• Class-3
• SmartReflex sub-chip has a dedicated hardware
  loop to dynamically optimize voltage 
• MPU intervention not required

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Power Related Terms

• Dynamic Voltage Frequency Scaling (DVFS)-
  Consume less energy/power in low performance
  modes by lowering the voltage
• Adaptive Voltage Scaling (AVS) - Lower voltages
  when the chip process and temperature allow it
  technically this is SmartReflex, but the
  SmartReflex name is commonly used to refer to all
  power savings techniques listed
• Dynamic Power Switching (DPS) Split chip into
  several power domains that can be put into low
  power states individually

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Power Analog Companion Options for OMAP35x

• DVFS Class-3 SmartReflex Capable
• PMIC (multi-output DCDC)
• TPS659501 (samples available 2Q08, RTM 3Q08)
• TPS65930 (samples available 3Q08, RTM 4Q08)
• TPS65920 (samples available 3Q08, RTM 4Q08)
• DVFS Class-1 / Class-2 SmartReflex Capable
• PMIC (multi-output DCDC)
• TPS650732 (samples RTM 3Q08)
• TPS650232 (in production)
• Single Output DCDC
• TPS623502 (in production)

1 Software and pin compatible with TWL4030 2
Driver availability 2H08
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OMAP Analog Companions
1 Software and pin compatible with TWL4030
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Feature Overview of OMAP35x Power Options
TPS65950
TPS65930
TPS65920
Integration
TPS65073
TPS65023
TPS62350
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Established OMAP Developer Network Enables
Faster Time to Market
OMAP Developer Network

• Proven and established ecosystem

• More than 400 developers

• From OS to application support

And many more
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OMAP35x processors inspire new applications with
unprecedented performance at handheld power
levels