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US CMS

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Custom Pixel Design: 19 ch (towers) and 73 ch (short stacks) ... longer validation time before QA kicks in. HPD's do not represent a critical path item - YET ... – PowerPoint PPT presentation

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Title: US CMS


1
US CMS
  • Report to the NSF and DOE
  • Dan Green
  • US CMS Project Manager
  • Quarterly Report - January 25, 2001

2
Agenda
3
Outline
  • Project Status - Financial
  • Labor Experience
  • October Lehman Recommendations
  • The US CMS Research Program
  • Schedule Issues

4
US CMS - DOE, NSF Profile
BA is saturated. US CMS balance between DOE and
NSF funds is roughly correct. We need to push
planning into FY05 - started (PO). This will cost
- M.R. talk.
5
US CMS Detector Project
No major trends are evident. No divergence.
Schedule slip --gt BCWS regression. Major effort
to match ACWP and BCWS on 100 complete tasks for
May Lehman Review - D.F. talk.
6
Contingency Usage and Performance
We have gt 2 years (31 months) of monthly
reporting. We are again starting to earn
contingency following the SiTrkr baselineing. But
- PO marches into FY05 and SWC short term costs.
7
US CMS Contingency Use
In the first 31 months of the Project the EAC
has grown 15 w.r.t. the baseline. Ultimately,
the EAC will grow by 40. Slope must be watched.
8
Contingency Use at L2
The largest increase in the EAC has been in
EMU. CP and Tridas have reduced the EAC, while
PO is LOE - except for FY05 and SWC. Most US
CMS costs are MS to date.
9
Complete at L2
The CP is completed up to progress payments.
ECAL and HCAL are 50 complete, while Tridas
and FPIX are only 25 complete. PO is LOE
10
Performance Index at L2
Define performance index as complete w.r.t. the
contingency increase. CP has decreased EAC.
TRIDAS has used 0 contingency. ECAL is 50
complete with only an 8 EAC increase. FPIX is
only 25 complete but has a 13 EAC increase.
11
CSC - Labor Experience
  • Early experience on
  • CSC assembly is
  • favorable

12
HB OPTICS - Labor Experience
Labor experience for CSC and for HCAL optics has
been good. This is the bulk of US CMS labor costs.
MS OK, Labor OK gt worry about electronics
(schedule) and installation (EDIA too).
13
October Lehman Review
  • Develop a corrective action plan for the ECAL bit
    serializer and present this plan at the next
    DOE/NSF Quarterly Status Meeting (January 2001).
  • Develop detailed plans for the tooling, fixtures,
    procedures, training, and staffing for Muon
    system installation by the next DOE/NSF review
    (May 2001).
  • Assess the impact of the proposed revision to the
    official CMS schedule for a working detector in
    2005 (version 30) on the completion schedule for
    U.S. activities by the next DOE/NSF Quarterly
    Status Meeting (January 2001).
  • Develop a new schedule and plan for resolving the
    ALCT board/chip Single Event Upset problem.
  • Ensure that the plans for RPC installation in the
    first disc do not adversely impact CSC
    installation.

ECAL - P.D.
EMU - in train
PO - M.R. talk
EMU - PNPI EDIA for SEU tolerant
EMU
14
Oct. Lehman - II
  • Recommendations
  • .Identify the Parts Flow Manager (including any
    necessary engineering support) for the FAST sites
    by the end of November 2000.
  • .Finalize any procedures necessary to support
    full FAST site assembly and testing operations
    before the first chambers arrive, or before
    needed.
  • .Emphasize program, status, and issues for the
    ECAL subsystem at the next DOE/NSF Quarterly
    Status Meeting (January 2001).
  • . Develop a budget plan for the total U.S. CMS
    effort over the next five years including
    detector construction pre-operations and
    operations upgrade research and development and
    software and computing. Present this plan at the
    next DOE/NSF review in May 2001.

EMU - written
EMU - written
PO, ECAL - agenda
PO - J.H. talk
15
US CMS MO Cost Estimate
16
MO Cost Estimate at L2 (FY06 and beyond)
L2 manager estimates for the different tasks. A
PMP draft and a resource loaded schedule are in
train.
17
Research Program Funding - JOG Dec. 6
18
Schedule Concerns
  • With the end of LEP, CMS now truly needs to keep
    to the schedule - CMS discussions with CERN (MDN
    talk).
  • HF is now the first detector lowered into the UX5
    experimental area. It is part of the working
    detector. US must accelerate the schedule - with
    Hungary, Iran, Russia, Turkey.
  • There are pending CR for muon trigger(0.25 M)
    and FPIX (2.2 M). In addition there are requests
    for ,ME1/1 electronics (2.0 M) and ME4/1
    electronics (0.9 M). Still other requests
    exist. Obviously, priorities must be set by the
    CMS SC. Meanwhile, we must earn more contingency
    before any scope increase is considered.

19
Critical Path - EMU, HCAL, ECAL
  • CMS has defined ML1 for V30 schedule.
  • CP analysis is now in place for EMU, HCAL, and
    ECAL (M.R. talk)
  • CMS asks L2 managers for ML2, ML3, ML4 revisions.

20
CMS - ML1 (V30)
21
US CMS Critical Path - EMU
22
Summary
  • US CMS is on schedule and on budget.
  • The last Lehman review recommended contingency
    application in FY01 for scope increases if
    performance remains good. At this time it is not
    prudent to make any new contingency assignment
    until more contingency is earned. SiTrkr is now
    fully baselined.
  • Many hard decisions are ahead if we are to
    achieve a working detector ready at first beam to
    confront the Physics opportunities of the LHC.

23
US CMS Technical Summary
  • No comments on ECAL - presentations at this
    meeting and n irradiation facility tour.
  • HCAL - HPD tour
  • L2 technical snapshots.

24
EMU - Chamber Production
  • Fermilab
  • Lab 8 (panel milling) all set and is running at
    full speed
  • MP9 (ME23/2 assembly) should be at full speed
    since Jan 1, 2001
  • US FAST sites (UF and UC)
  • Teams are in place
  • DAQ hardware and cosmic ray setups are ready
  • DAQ and Test Software are to be ready by May 2001
    (on schedule)
  • PNPI Site
  • Team is in place, trained at FNAL and UF
  • Chamber Assembly Tooling arrived and is being set
    up
  • FAST Site Equipment is packed and ready for
    shipment
  • IHEP Site
  • Team is being finalized, trained at FNAL and UF
  • Chamber Assembly Tooling is being prepared for
    shipping
  • FAST Site Equipment is packed and ready for
    shipment

25
CSC Production Status
  • Panel production (on budget, on schedule)
  • CSC Types ME23/2 ME2/1 ME1/2
    ME3/1 ME1/3 ME4/1
  • PPPs 3 2 3
    2 2 2
  • To be done 1444 362 722 362 722 362
    39614
  • Done 1442 19 0 0 0 0
    (41)
  • CSC Assembly (on budget, on schedule)
  • CSC Types ME23/2 ME2/1 ME1/2
    ME3/1 ME1/3 ME4/1
  • PPPs 3 1 2
    1 1 0
  • To be done 1444 362 722 362 722 362
  • Done 18 (12) 0 0 0 0 0

26
FNAL Production Experience
  • FNAL Chamber Factory ramping up
  • Production rate increased as planned (3
    chambers/month in last quarter of CY00, vs. an
    expected rate of 3.3 chambers/month).
  • Total 18 large CSCs produces and tested by Jan 1,
    01. Two more under tests.
  • Expect to meet the goal of production rate 4.5
    chamber/month in CY01
  • Odd extra jobs (last PNPI prototype, aging test
    chamber, ) will probably prevent from reaching
    this rate until late Spring 01.

27
CSC - Beijing visit
  • Visit to Beijing (Mitselmakher) - December 2000
  • Meetings with Chen Hesheng (IHEP Director), Wang
    Naiyan (China NSF)
  • Visit to the future CSC production site
  • Visit to the Peking University, discussion of the
    RPC schedule with Ye Yanglin et. al

28
CSC- Beijing visit
  • Problems
  • No formal CMS IHEP group yet
  • Delays with preparation of the CSC factory (team,
    floor plan, schedule/milestones, customs), while
    schedule needs to be accelerated in view of V30
    schedule ( assembly in UX5). Need gt 1 year of 2
    shifts.

29
CSCs - Beijing visit
  • Action
  • CMS/CSC group formed, Jiang Chunhua - leader,
    Wang Yunyong - technical expert, QC.
  • Space for production increased
  • Customs problems being solved, IHEP responsible
    (Deng,Jiang) identified
  • First shipment - tooling, parts for first two
    prototypes in box at Fermilab, waiting for
    property transfer paperwork.

30
Integration
  • The integration design schedule has been revised
    in coordination with the chamber production and
    installation effort.
  • Installation fixture -- Design is final and
    approved for production. Assembly of the fixture
    has begun.

31
Installation of CSC
Balance limits w/ or w/o chamber
Fully balanced chamber can rotate to any angle
Counterweight
Test of CSC Installation fixture
32
CSC electronics
  • CSC on-chamber electronics is being ordered
  • CFEB and AFEB boards on schedule and on budget
  • ALCT board is being redesigned to solve the
    Single Event Upsets problem. Conversion from
    ALTERA to Zilinx FPGAs - faster reloading. Expert
    engineering added to minimize the delay due to
    redesign (PNPI).
  • LVDB board may be delayed by 2-3 months due to
    delays with the rad hard regulator development at
    CERN.

33
EMU -On-Chamber Boards
  • Electronics System Review took place on
    9/18/2000. Recommendations
  • AFEB Approved for procurement
  • CFEB Approved for procurement (FPGA pending)
  • ALCT Critical components approved for
    procurement. FPGAs pending. Should replace Altera
    by XILINX.
  • LVDB Board not yet finalized.
  • Official schedule in EMU project file
  • Deliver first set of production boards for all
    on-chamber boards by 5/18/01. (see table on next
    page)
  • Where do we stand w.r.t. this schedule?

34
Delivery Schedule in EMU File
35
CFEB (Ohio State)
  • Pre-production board produced and tested (12/00).
  • ASIC procurements
  • Buckeye Order placed. No delivery schedule
    problem.
  • SCA Order placed. Delivery starts in 2/01?
  • Comparator Order placed. Delivery first 2500
    chips in 3/01. Rest in 8/01 and 9/01?
  • Component procurements
  • Mostly (96 out of 98 components) ordered and in
    hand.
  • Pending XILINX Virtex FPGA ST Regulator
  • Cables and connectors ordered and delivered.
  • PCB fabrication and assembly
  • Quotes from vendors obtained
  • Will place order in 1/01.

CFEB On Schedule. Critical items SCA,
Comparator, ST regulator
36
AFEB (CMU, PNPI)
  • ASIC procurements
  • Amp-Disc chip Pre-production (5 wafers) order
    placed in 12/00. Will place full order in 4/01.
  • Delay chip (on ALCT) Pre-production chip
    delivery in 1/01. Will place full order in
    2/01.
  • Component procurements
  • All orders placed.
  • Cables and connectors ordered
  • PCB fabrication and assembly
  • Quotes from vendors obtained
  • Full order placed in 12/00.

AFEB On Schedule. Critical path Speed of ASIC
testing.
37
ALCT (UCLA)
  • ALCT-384
  • Finalize Altera to Xilinx design change
    2/15/01
  • Deliver final prototype board
    6/11/01
  • First batch (22 boards) delivered to FAST sites
    9/30/02
  • ALCT-672
  • first batch (6 boards) delivered to FAST sites
    11/8/01
  • ALCT-288
  • first batch delivered to FAST sites
    2/1/02

ALCT Schedule will slip by 5 months. Critical
issue technical manpower
38
LVDB (Wisc)
Schedule proposed by S. Lusin (9/11/00)
  • 11/00 Deliver assembled preproduction board
  • 3/01 Finish testing of preproduction board
  • 3/01 Finalize design, award production
    contract
  • 4/01 Test production sample boards (5)
  • 5/01 Start Production

LVDB Schedule will slip by 1-2 months Critical
item ST regulator
39
HCAL - CMS Organization
40
HB Absorber - Oct., 2000
HB-1 pre-assembled at Felguera. Shipping to CERN
. Megatiles will be inserted in bldg 186. The
mating of optics to absorber will begin at CERN
in CY 2001.
41
HB Optics Quality Control
  • Over 20,000 scintillator tiles built and measured
  • RMS of fibers 4.4
  • RMS of tiles 6.5
  • RMS of wire/coll 1.2
  • RMS of average layer light yield 4.6

42
The HPD - P.C. Tour
Tube Fabrication by Delft Electronic Products
(Netherlands) Diode Array by Canberra
(Belgium)Vacuum Feedthru by Kyocera (Japan)
CMS Design
  • 12 kV across 3.5 mm gap with Vth lt 3 kV gt Gain
    of 2500
  • Silicon PIN diode array, T-type
  • Thin (200 mm) with 100 V reverse bias for fast
    charge (holes) collection

43
RD for the HPD
The Diode Custom Pixel Design 19 ch (towers)
and 73 ch (short stacks) Higher pin-out density
Glass feedthrus replace with ceramic from Kyocera
Alignment to 50 mm dead space, crosstalk,
manufacturer tolerances tightened, new
measurement procedures necessitated Improved
Risetime Thinner silicon 200 mm replaces 300
mm Guard ring and drain structure 3
interations as Canberra improves design And NOW
aluminization of surface and AR coating issues
The Tube Larger active area Less room for HV
connection, possible field distortions HV coax
cable Reliability and compatibility with
RBS Minimize gap Improve tube components
Gold-plated pins Enables us to use ZIF sockets
- questions of gold diffusion
44
HPD
  • This Al overcoat solves the electronic cross talk
    ( 100) problem.
  • The electron backscatter problem ( 15) is
    solved by the application of the CMS magnetic
    field.
  • However, there remains the crosstalk ( 10) due
    to the semi-transparent photocathode and the
    optical reflection off the aluminum. A 1/4
    wavelength anti-reflection coating is being
    explored (U. Minn.)

45
Minn. Studies of Coating
Angular acceptance and numerical aperture.
Wavelength acceptance and photocathode response
46
QA Stations at UMinn
Purpose Evaluate 550 tubes Automate (in
parallel) Complete Database DC Test
Station (Minnesota) gt boundary scans,
uniformity, leakage current gt diode
capacitance and interpixel resistance gt
alignment and registration AC Test Station
(Minnesota, portable copies at FNAL,CERN)
gt one p.e. curves dark current, resolution,
vacuum check gt gain curves and
linearity gt AC Crosstalk and
uniformity High Rate Tests (FNAL and
Minnesota) gt risetime and pulse shape gt
rate dependent effects Lifetime Studies
(Minnesota and Oak Ridge) gt Total integrated
charge gt High Voltage stability gt Radiation
Damage

47
HPD Summary
CONCLUSIONS
  • Tubes are well-understood, but technology needs
    to be refined.
  • The start-up is delayed
  • Tube production and Testing will be accelerated
    to meet final milestones
  • Costs go up New masks for diodes up front
    More expensive components Schott glass
    (US exchange rate)
    Canberra diodes (more complicated)
  • Additional testing cost reflects 1 extra QA
    station and more student labor to speed up
    QA longer validation time before QA kicks in
  • HPDs do not represent a critical path item - YET

48
HB RBX Detail View
The issue for the RBX is the access to the HPD.
There are integration issues with the tracker
patch panel. A mockup was made and changes appear
possible which will ease the problem. Schedule is
such that a PRR is needed soon. Now scheduled for
March, 2001.
49
HF - EDIA - Bricks
Design using RDMS bricks is basically complete.
The dimensions are to be respected by the RDMS
PPP. Engineering meeting at CERN mid Feb. PPP to
be available before.
50
HF - EDIA
0.5 cm spacing, packing fraction, source tubes,
edge chamfer design complete.
51
QIE Status - OK
  • Input Amplifiers/Splitters  design finished,
    layout done.
  • Integrators design finished, layout partially
    done.
  • FADC  design finished, layout done
  • Range comparators and ranging logic  not done
  • Biasing network  not done
  • State machine, timing  design being worked on
    now
  • LVDS drivers, receivers  not done
  • Other digital logic not donePlanning to
    submit total design early March 01 - on track so
    far - minor slippage.

Yarema group is on track with their scheule
52
HCAL Electronics - I
  • Building 186 Electronics
  • 800 channels of slow electronics built and
    being tested
  • Front End Readout Cards
  • QIE ASIC
  • Full 4 corner model simulations in progress
  • Full Chip Submission planned mid Feb 01
  • CCA ASIC
  • DLL - design and cell layout done
  • RBXbus serial interface design and layout done
  • Full Chip Submission planned end of Feb 01
  • CERN GOL Serializer
  • Chip submitted, parts expected in March.

53
HCAL Electronics - II
  • Readout Box Clock and Control Module (CCM)
  • Engineering Specification begun
  • Module will provide for CANbus communication,
    temperature and voltage monitoring, clocking
  • Readout Box Backplanes
  • Backplane engineering 90 complete
  • Layout has begun on HB backplane
  • Trigger/DAQ
  • 6U HTR Card PCB received (U. Maryland)
  • Initial System Test (FE and Trigger/DAQ)
  • Planned for late summer 01
  • Prototypes FE readout cards, CCM, backplane,
    HTR

54
HF - QP Specifications
  • Core 600 /- 10 micron dia
  • Clad 630 5-10 micron dia
  • Buffer 800 /- 30 micron dia
  • Core non-circularity 5
  • Clad concentricity /-2 microns
  • Buffer concentricity /- 3 microns
  • NA 0.33 /- 0.02 (Full acceptance cone
    38.5 degrees)
  • ncore 1.458 (_at_ 600 nm)
  • nclad 1.419
  • Att(_at_ 300 nm) lt0.15 dB/m
  • Att(_at_ 400 nm) lt50 dB/km
  • Att(_at_ 450 nm) lt30 dB/km
  • Core OH- content 1000 1200 ppm (high OH-
    Fiber)
  • Rmin curvature (short time) 6 cm/1 min
  • Rmin curvature (long time) 10 cm/2 months
  • Quantity 815 km
  • Proof test (100 fibers) 100 kpsi
  • Operating temp range - 65 125 C
  • (gt98 optical transmission in 300 - 700 nm with
    no memory or breakage)

PRR for HF PMT and QP fiber in Feb., 2001
55
HF-PMT Specifications
  • Window Material Borosilicate glass
  • Window thickness lt 1 mm
  • Effective photocathode dia gt23 mm
  • Photocathode material Bialkaline
  • QE 15 400-500 nm, gt 25 at 420 n
  • Photocathode lifetime gt 200 mC
  • Ave. anode current vs position lt /- 20 with 3
    mm spot scan
  • Gain 105 at lt 0.75 x VKA(max)
  • single pe resolution rms/mean of single pe peak
    lt 50
  • pulse linearity /- 2 for 1-3000
    photoelectrons
  • peak current lt 10 mA
  • transit time lt 25 ns
  • rise time lt 2.5 ns
  • pulse width lt 15 ns FWHM
  • gain (1/2)-lifetime gt 1500 C
  • average current IK lt 1 nA
  • average current IA lt 10 mA ( g 104 )
  • stability lt /- 3 within any 48 hr. period
  • envelope opaque and conductive coating

56
Trigger TDR
  • Met June Milestone for 1st Draft (ML1)
  • Final draft by November TriDAS Week (6-11.11.00)
  • Submission to LHCC shortly thereafter

57
Calorimeter Trigger Status(U. Wisconsin)
  • Successful Prototyping Program
  • Crate, 160 MHz Backplane Clock Card
  • Receiver Electron Isolation Cards tested
  • Adder ASIC tested production finished
  • 4 Gbit/sec Copper 20 m link system tested
  • ASIC Prototypes
  • Phase Boundary Scan protos delivered
  • Isolation Sort protos delivered
  • Testing Program Plans
  • Next generation Backplane finished
  • Next generation Receiver, Elect. Iso. Cards
  • Test remaining ASIC prototypes
  • Simulation Program
  • New ORCA4 results verify performance

58
Cal Trigger Serial Data Cable Gbit Link Tests
Receiver Bottom
Transmitter Bottom
Receiver Top
Transmitter Top
Mezzanine Transmit Receive Cards convert 4 x
1Gb/s links to 120 MHz TTL w/ Vitesse 7214
cable equalization
Serial Link Test Card includes VME, memories
comparison circuitry to fully test serial links
_at_ 120 MHz TTL from Mezzanine Cards. (U.
Wisconsin)Bit Error rate lt 10-14
59
ORCA4 Rates at L1034
60
ORCA4 Calorimeter Trig. Effcy.
  • Jets are included in cut sets for Taus
  • h lt 2.4 due to tracker limits for e, Tau, Jets
    out to h 5
  • Electrons are Isolated - high luminosity
  • Isolation not considered - low luminosity

61
Muon Trigger Progress
  • Successful CSC Trigger Integration test
  • Prototype Muon Port Card, Sector Receiver, Sector
    Processor, Clock Board, Backplane work
    communicate
  • New ORCA 4 full simulation working
  • Agreement/use with hardware test

62
Track-Finder Crate Tests
SP
SR
CCB
MPC
Bit3 VME Interface
Custom backplane
100m optical fibers
63
Muon Trigger System Tests
  • Port Card ? Sector Receiver
  • MPC (Rice) SR (UCLA) communicate via HP GLinks
    optical fiber
  • Data successfully sent from input of one MPC,
    through 100m of optical cables, to output of SR
  • Sector Receiver ? Sector Processor
  • SR and SP (Florida) communicate via Channel-Link
    backplane
  • Data successfully sent from input of one SR,
    through custom backplane, into the SP
  • Successfully sent data from three SRs connected
    to the SP to emulate an entire trigger sector

64
Muon Trigger Tests (Contd)
  • Port Card ? Sector Receiver ? Sector Processor
  • Successfully sent data from the input of two
    MPCs (representing ME2 and ME3), through one SR,
    and reconstructed tracks correctly in the SP
  • Complete chain test
  • Clock and Control Board prototype (Rice)
    coordinated these tests
  • Distributed clock and control signals with
    programmable delays
  • Sent BC0 to initiate tests
  • Considerable software development coordination

65
DAQ
  • The DAQ effort continues in an RD phase -
    watching and evaluating commercial developments.
  • The ML1 for DAQ is the TDR, due in 2001.
  • Paris Sphicas is US CMS L2 DAQ manager and CMS
    L2 PRS manager. Much work on forming and
    launching the 4 PRS groups has been accomplished.

66
Forward Pixels, Test Beam
Test Beam CERN
Charge Sharing
Vienna Repeater
Y
Row
X
Z, B

Double Column
Beam
20o
ROC, PSI36 11 double columns x 30 rows
Pixels 150 x150 ?m2
8mm
D\Transfer from Bob\Pictures\Test Beam
Hardware\Geometry Pixels.ppt
67
Pixels - Charge Sharing
Charge sharing vs position
Pixels at 20o to beam
? 14 ?m over pixel
150 ?m
150 ?m
Charge sharing vs position
150 ?m / ?12 43 ?m
? 46 ?m over pixel
Pixels normal to beam
68
SiTrkr -Increased Scope
  • Expanded Role
  • Build 6000 modules installed in 750 Rods
  • Project files prepared in detail including all
    resources, schedules, contingency analysis.
  • PMG committee review Sep. 14-15, 2000
  • M. Crisler chair
  • Recommendations received and responses returned
    Nov. 1, 2000
  • Change Request signed Nov. 22, 2000
  • MOUs and SOWs being finalized signed

69
Organization in US CMS
Joined US CMS _at_ FNAL
70
Physicist Manpower
71
SiTrkr Schedule
Main Production Period 8 months of explicit
float
72
Estimated Costs (FY00)
Base Cont
520k of this is covered by the original support
of CMS Tracker groups outside the US.
Price has risen 380k.
73
Current Activities
  • Frames
  • Weve begun manufacturing the C Fiber
  • frames supporting the sensors and hybrids.
  • Only making those for mock-up modules to be used
    in the training of the gantry robots.
  • Production equipment
  • We are expecting our gantry to arrive in late
    January.
  • Well set it up with the help of a CERN
    technician.
  • Test equipment
  • Test boxes being designed now.
  • Test stand definition is converging
  • Components
  • Silicon tender has begun
  • Hybrid design now on a likely final iteration
  • Commercial Frame manufacturers now being qualified

74
Frames
C fiber frames on gluing jig at FNAL
75
Near term Schedule
  • First Modules
  • Mechanicals this winter
  • First working modules produced at FNAL in
    Spring/Summer for Milestone 200 and initial
    system tests
  • Test burn-in stands
  • First test stand here in Spring
  • Preliminary burn-in stand will re-use CDF Run 2
    equipment.

76
CP - Disk Production
  • Contractor Kawasaki (Japan)
  • Status
  • Minus endcap shipped on 13 Jan 01
  • Approx. 2000 tons of steel
  • YE-1, YE-2, YE-3 disks, YN-1, YN-2 nose disks,
    nose support tube, 3 spacer rings
  • Finished trial assembly of YE-1 disk with nose
    disks
  • All items fit nicely
  • Photogrammetry shows hole location good to .2mm
  • Plus endcap fabrication
  • Good progress - half-disk of YE2 machined
  • Sector blocks mostly finished
  • Expect to ship to CERN in Jul 01

77
YE-1 nose trial assembly Nov 00
78
Sector blocks ready for shipping Nov 00
79
YE Cart - Nov. 00
80
Tech Summary
  • EMU - CSC OK, ALCT SEU being addressed. ESR
    passed --gt ASIC boards in train. FAST and
    installation ? remain.
  • ORG for Physics. RBX and HPD schedule? QIE OK.
    HF PMT and QP fiber ready to begin procurement.
  • Trig/DAQ OK. PRS (HLT) working well.
  • ECAL - optical link resolved. LBNL work begun.
    Schedule ? for CMS remain. US CMS electronics
    schedule? remain - see CP analysis.
  • FPIX OK (CR ?). SiTrkr well launched.
  • CP done. PO transition to MO - PMP draft.
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