ECR plasma: a possible in-situ cavity processing technique - PowerPoint PPT Presentation

1 / 15
About This Presentation
Title:

ECR plasma: a possible in-situ cavity processing technique

Description:

ECR plasma: a possible in-situ cavity processing technique G. Wu, W-D. Moeller, C. Antoine T. Khabiboulline, E. Harms, Y. Terechkine, H. Edwards, D. Mitchell, A. Rowe ... – PowerPoint PPT presentation

Number of Views:61
Avg rating:3.0/5.0
Slides: 16
Provided by: tdserver18
Category:

less

Transcript and Presenter's Notes

Title: ECR plasma: a possible in-situ cavity processing technique


1
ECR plasma a possible in-situ cavity processing
technique
G. Wu, W-D. Moeller, C. Antoine T. Khabiboulline,
E. Harms, Y. Terechkine, H. Edwards, D. Mitchell,
A. Rowe, C. Boffo, C. Cooper, T. Koeth, W.
Muranyi, Fermilab
2
Contents
  • Introduction Field emission problem
  • Introduction to plasma cleaning
  • General application
  • SRF field activity
  • ECR plasma and RF cavity
  • Experimental plan and the issues to be addressed
  • Potential benefit and other applications

3
Field emission is a continuing problem
Red represents the FE limitation
DESY cavity experience
L. Lijies summary of DESY cavity databank, DESY,
2006
4
Field emission is a continuing problem
JLAB SNS cavity experience
J. Ozelis, SRF 2005
5
Field emission sources
  • Inclusions from weld-prep machining, forming
  • Residues from chemical processing (EP,BCP)
  • Water impurity (HPWR)
  • Clean room particles
  • Assembly particulates

Particulates includes (Ni, Mn, In, Cu, C, F, Cl,
Ca, Al, Si), Nb, Fe, Cr, S, etc
Particle counter recording has not been very
indicative
Particle free is not guaranteed
  • FE is a localized statistical problem
  • Success else where does not guarantee the local
    success
  • Past success does not guarantee the future
    success ?experienced in all Labs

6
Introducing plasma
  • Plasma induces chemical reactions in reduced
    temperatures, converts some surface materials,
    contaminants to gaseous phase
  • Plasma generates accelerated ions to bombard the
    surface (including loose particles)
  • Glow discharge, RF discharge and ECR plasma are
    common methods
  • Noble gas, N2, O2, H2, mixtures,

7
Applications 3,4
  • Semiconductor industry 1,6,9
  • Micro-electronics Josephson junctions 8
  • Automobile industry painting 2,10
  • Aircraft industry painting 11
  • Medical applications pre-cleaning for coating
    and sterilization
  • Optical industry
  • Antique preservation surface protection
  • Particle accelerator beam line components 14
  • Microwave power - multiMW, large-orbit, coaxial
    gyrotron 7
  • SRF Field
  • Plasma etching for Nb cavity JLAB 13
  • Plasma cleaning INFN/Lagnero, JLAB 12
  • Coupler processing DESY (W-D. Moeller, Dennis?)

8
ECR plasma and RF cavity
Figure 3 Electron being accelerated clockwise
by periodic electric field. External magnetic is
pointing out of the paper (not shown). Color
reflects energy
  • ECR electron cyclotron resonance

9
ECR plasma and RF cavity
n0 3.2?1017 /m3
?2.6?10-6 s
Minimum field 130 V/m for 90eV
rlt 0.3 mm
P1?10-5 torr
9-cell Cavity Eacc for 15 kilo-watt RF input
under different input coupling for cavity Q0
Eacc for 150 watt RF input under different input
coupling for cavity Q0
10
x-wave
?L
?R
3.9GHz
Microwave traveling inside magnetized plasma
11
Experimental plan and the issues to be addressed
  • Usual cleaning
  • Cold RF test to find FE limit
  • Plasma processing at room temperature
  • Cold RF test to verify improvement
  • Gas mixtures Ar, H2, O2, He, Kr.
  • Surface contamination removal?
  • Ar implantation? Ar ion creates surface defects?
  • Dry-oxidation afterwards?
  • If Hydrogen, how about Q-disease?
  • If Oxygen, oxidation compound?
  • He also effective?
  • Gas pressure
  • Plasma density
  • Temperature distribution
  • Ion energy distribution
  • Ion flux rate
  • Chemical reaction

12
Coupler Qext 3x104 2x109
13
Potential benefit and other applications
  • Reduce field emission, increase cavity production
    yield
  • through in-situ processing, improve cryomodule
    performance
  • Potential new design for cryomodule recovery
    (Build-in magnetic coil)

Processing opportunity in between
Or built-in capability
  • CF4O2, Cl2 in plasma etching of niobium 15,
    16
  • NbCl5 coating of niobium
  • Sn/SnClx vapor Nb3Sn formation
  • B2H6Mg similar to Penn State HPCVD 17

14
1.Kim, H.-w. and R. Reif, In-situ low-temperature
(600degC) wafer surface cleaning by electron
cyclotron resonance hydrogen plasma for silicon
homoepitaxial growth. Thin Solid Films, 1996.
289(1-2) p. 192-198. 2.Steffen, H., et al.,
Process control of RF plasma assisted surface
cleaning. Thin Solid Films, 1996. 283(1-2) p.
158-164. 3.Kruger, P., R. Knes, and J. Friedrich,
Surface cleaning by plasma-enhanced desorption of
contaminants (PEDC). Surface and Coatings
Technology, 1999. 112(1-3) p. 240-244. 4.Kegel,
B. and H. Schmid, Low-pressure plasma cleaning of
metallic surfaces on industrial scale. Surface
and Coatings Technology, 1999. 112(1-3) p.
63-66. 5.Li, H., et al., An in situ XPS study of
oxygen plasma cleaning of aluminum surfaces.
Surface and Coatings Technology, 1997. 92(3) p.
171-177. 6.Choi, K., et al., Removal efficiency
of organic contaminants on Si wafer by dry
cleaning using UV/O3 and ECR plasma. Applied
Surface Science, 2003. 206(1-4) p.
355-364. 7.William E. Cohen, R.M.G., Reginald L.
Jaynes, Christopher W. Peters, and Y.Y.L. Mike R.
Lopez, Scott A. Anderson, and Mary L. Brake,
Thomas A. Spencer, Radio-frequency plasma
cleaning for mitigation of high-power
microwave-pulse shortening in a coaxial gyrotron.
APPLIED PHYSICS LETTERS, 2000. 77(23) p. 3. 8.T.
S. Kuan, S.I.R., and R. E. Drake Journal of
Applied Physics, 1982. 53(11) p. 7. 9.Th.
Schäpers, R.P.M., G. Crecelius, H. Hardtdegen,
and H. Lüth Preparation of transparent
Nb/two-dimensional electron gas contacts by using
electron cyclotron resonance plasma cleaning.
Journal of Applied Physics, 2000. 88(7) p. 3. 10
D.F. O'Kane, K. L. Mittal, Plasma cleaning of
metal surfaces. Journal of Vacuum Science and
Technology, 1974. 11(3) p. 3. 11.Petasch, W., et
al., Low-pressure plasma cleaning a process for
precision cleaning applications. Surface and
Coatings Technology, 1997. 97(1-3) p.
176-181. 12.N. Patron, R.B., L. Phillips, M. Rea,
C. Roncolato, D. Tonini, and V. Palmieri. Plasma
cleaning of cavities. in Thin Films and new ideas
for pushing the limits of RF superconductivity.
2006. Padua, Italy. 13. H. L. Phillips, private
communications 14. H.F. Dylla, J. Vac. Sci.
Technol.. A6 (1988) 1276. 15. M. Chen and R. H.
Wang, J.Vac.Sci. Technol. A, Vol. 1, No. 2,
Apr/June 1983 16. Jay N. Sasserath and John
Vivalda, J.Vac.Sci. Technol. A, Vol. 8, No. 6,
Nov/Dec 1990 17. Xi, X.X., In Situ Growth of MgB2
Thin Films by Hybrid Physical-Chemical Vapor
Deposition. IEEE Transactions on Applied
Supconductivity, 2003. 13(2) p. 5
15
Acknowledgement
H. Padamsee, Cornell P. Kneisel, L. Phillips, G.
Bialas, R. Rimmer, H. Wang, B. Manus, G. Slack,
JLAB
Write a Comment
User Comments (0)
About PowerShow.com