The Market for Thermal Management Technologies

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The Market for Thermal Management Technologies
Bharat Book Bureau

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Summary

• REPORT HIGHLIGHTSThis report provides
• An overview of the global market for thermal
  management products, including hardware,
  software, interface products, and substrates.
• Analyses of global market trends, with data from
  2011 and 2012, and projections of compound annual
  growth rates (CAGRs) through 2017.
• Discussion of individual materials, hardware, and
  software product segments in terms of market size
  and revenue trends.
• Forecasts for the most important applications by
  product.
• Examination of the competitive aspects of each
  product segment, along with several successful
  suppliers strategies in the market.
• A current industry directory, a survey of recent
  U.S. thermal management patents and patent
  applications pending.

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• REPORT SCOPE
• In recent years, there has been tremendous
  progress, technologically and in terms of demand,
  in electronic devices and systems. The
  technological progress has come on two main
  fronts increased functionality on a single device
  unit and miniaturization of each unit. Both of
  these developments have increased the need for
  thermal management technologies.Thermal
  management is the term used to describe the
  array of material technologies and
  problem-solving design tools that systems
  manufacturers apply to regulate the unwanted heat
  caused by the normal functioning of an electronic
  system.This report segments thermal management
  technologies into four segments hardware,
  software, interfaces and substrates.

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• The hardware segment includes several product
  subsegments, including heat sinks, fans and
  blowers, fan sinks, heat pipes and cold plates.
  These segments were chosen because they are
  established technologies and represent revenue
  markets of significant size.The software
  segment consists of electronic design software
  designed to model and analyze the thermal
  characteristics of an electronic system design.
  Specific types of thermal management software
  examined in this study include computational
  fluid design (CFD), computational heat transfer
  (CHT), power management, circuit design and other
  electronic design automation (EDA).

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• Thermal management interface materials are
  products that stand between a heat sink and the
  device to be cooled, where their function is to
  improve the thermal transfer in the joint between
  the heat sink and the device to be cooled by
  increasing or securing the area of contact
  between the two surfaces. In some cases, the
  interface actually performs the job of the heat
  sink. This role has become increasingly common in
  a number of applications in which, due to the
  height or weight constraints of the system, a
  conventional hardware heat sink is not
  feasible.Finally, the report analyzes
  substrates, which are the foundations of
  integrated circuits (ICs), or planar components
  of electronic packages or modules. The report
  focuses on substrates that have been developed
  specifically to enhance the thermal handling
  capability of an electronic component.

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• STUDY GOAL AND OBJECTIVESThis report is
  an update of an earlier BCC Research report
  prepared in 2011. The overall goal of this
  updated report is to provide an analysis of the
  most recent developments and current trends in
  the global thermal management marketplace.
  Specific objectives include
• Identifying thermal management technologies and
  products with the greatest commercial potential
  in the near to mid-term (20122017).
• Analyzing the key drivers and constraints that
  will shape the market for thermal management
  technologies and products over the next five
  years.
• Estimating the current and future demand for
  thermal management technologies and products.
• Ascertaining the companies that are best
  positioned to meet this demand because of
  proprietary technologies, strategic alliances or
  other advantages.

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• INTENDED AUDIENCEThis report is intended
  especially for suppliers of thermal management
  technologies and products, and others with a need
  to understand the status and dynamics of the
  market for these products. Although the report is
  organized around specific technologies, it is
  largely nontechnical in nature and coverage. That
  is, it is concerned less with theory and jargon
  than with what works, how much the market is
  likely to purchase and at what price.As such,
  the reports main audience is executive
  management personnel and marketing and financial
  analysts. It is not written specifically for
  scientists and technologists, although its
  findings concern the market for their work and
  include the availability of government and
  corporate research funding for different
  technologies and applications, which should
  interest them.

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• SCOPE AND FORMATThe scope of this report
  is broad, covering several product areas. The
  individual materials, hardware and software
  product segments are presented in terms of market
  size and revenue trends. The revenue forecasts
  are explained in terms of the key market issues
  for that product segment, and are projected for
  five years from 2012 to 2017. The application
  sections feature forecasts for the most important
  applications by product.The technology
  discussion concentrates on trends that will
  develop more significantly during the forecast
  period. The report also includes a discussion on
  the competitive aspects of each product segment,
  along with several successful suppliers
  strategies in the market. A current industry
  directory, a survey of recent U.S. thermal
  management patents and patent applications
  pending, and profiles of a selection of the
  leading thermal management suppliers are also
  included.

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• The report addresses the global market for
  thermal management products during the period
  from 2011 through 2017, including
• Thermal management hardware.
• Thermal management software.
• Thermal management interface products.
• Thermal management substrates.
• The report format includes the following
  major elements.
• Executive Summary.
• Thermal management industry overview.
• Thermal management products major segments,
  subsegments, technology trends,
• applications, world market estimates and
  projections.
• Industry structure market shares and company
  profiles.
• Patent analysis.

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• METHODOLOGYThe findings and conclusions
  of this report are based on information gathered
  from a variety of sources, using both primary and
  secondary research methodologies. Sources of
  information include Internet searches and
  industry association data, and interviews
  conducted with thermal management component
  suppliers, custom engineering companies and
  manufacturers of representative applications. In
  addition, other secondary sources were consulted
  for the report, including industry journals and
  publications, product literature, white papers
  and technical journals, and financial reports for
  industry suppliers.The base year for analysis
  and projection is 2011. With 2011 as a baseline,
  market projections were developed for 2012 and
  2017. These projections are based on a
  combination of a consensus among primary contacts
  combined with our understanding of key market
  drivers and their impact from a historical and
  analytical perspective. The analytical
  methodologies used to generate the market
  estimates are described in detail in the market
  analysis. All dollar projections presented in
  this report are in 2011 constant dollars. 

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